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1. 发明专利

JP2013140379A Photosensitive resin composition, photosensitive film, method of manufacturing permanent mask resist, and permanent mask resist 审中-公开
标题翻译：感光性树脂组合物，感光膜，制造永久掩膜抗蚀剂的方法和永久掩膜
公开(公告)号：JP2013140379A
公开(公告)日：2013-07-18
申请号：JP2013022305
申请日：2013-02-07
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： OHASHI TAKESHI
IPC分类号： G03F7/004 , C08F2/44 , G03F7/027 , G03F7/033 , H01L21/027 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which shows practically sufficient flexibility even after photocuring, also exhibits excellent solder heat resistance and excellent plating resistance, and is applicable as a permanent mask resist for FPC.SOLUTION: The photosensitive resin composition includes (A) a resin having a carboxyl group, (B) a compound having a benzoxazine skeleton, (C) a photopolymerizable compound and (D) a photopolymerization initiator. In the composition, the (C) photopolymerizable compound has 10 to 70 parts by mass with respect to total 100 parts by mass of the solid content of the (A) resin having a carboxyl group and the (C) photopolymerizable compound.
摘要翻译：要解决的问题：为了提供即使在光固化后也显示出实际上足够的柔性的感光性树脂组合物，也具有优异的耐焊锡性和优异的耐电镀性，并且可用作FPC的永久掩模抗蚀剂。溶解性：感光性树脂组合物包含 A）具有羧基的树脂，（B）具有苯并恶嗪骨架的化合物，（C）光聚合性化合物和（D）光聚合引发剂。在组合物中，（C）光聚合性化合物相对于具有羧基的（A）树脂的固体成分和（C）光聚合性化合物的总计100质量份，为10〜70质量份。

2. 发明专利

JP2014209260A 感光性樹脂組成物、感光性フィルム、レジストパターンの形成方法及び永久レジスト有权
标题翻译：感光树脂组合物，感光膜，形成耐火图案的方法和永久抗蚀剂
公开(公告)号：JP2014209260A
公开(公告)日：2014-11-06
申请号：JP2014130173
申请日：2014-06-25
申请人：日立化成株式会社 , Hitachi Chemical Co Ltd
发明人： OZAWA KYOKO , OHASHI TAKESHI
IPC分类号： G03F7/027 , G03F7/004 , H05K3/28
CPC分类号： G03F7/00 , H05K3/28
摘要：【課題】光硬化後の可とう性、耐薬品性及び耐めっき性のすべてを高水準に達成可能な感光性樹脂組成物を提供する。【解決手段】(A)カルボキシル基を有するバインダーポリマーと、(B)光重合性化合物と、(C)光重合開始剤と、(D)メラミン誘導体と、(E)ジシアンジアミド類と、を含有し、(B)光重合性化合物が、(B1)ビスフェノールA系ジ(メタ)アクリレート、及び(B2)ウレタンオリゴマー又はモノマー、から選ばれる少なくとも1種を含み、(E)成分の固形分の含有量が、(A)成分及び(B)成分の固形分総量100質量部に対して、0.1〜10質量部である、感光性樹脂組成物。【選択図】なし
摘要翻译：要解决的问题：提供能够以高水平光固化后实现全部柔软性，耐化学性和耐电镀性的感光性树脂组合物。溶解性：感光性树脂组合物含有（A）具有羧基的粘合剂聚合物（B ）可光聚合化合物，（C）光聚合引发剂，（D）三聚氰胺衍生物和（E）双氰胺。光聚合性化合物（B）含有选自（B1）双酚A型二（甲基）丙烯酸酯和（B2）氨基甲酸酯低聚物或单体中的至少一种。基于组分（A）和组分（B）的总固体含量的100质量份，组分（E）的固体含量为0.1-10质量度。

3. 发明专利

JP2005031523A PHOTOSENSITIVE FILM AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD USING THE SAME 审中-公开
公开(公告)号：JP2005031523A
公开(公告)日：2005-02-03
申请号：JP2003272553
申请日：2003-07-09
申请人： HITACHI CHEMICAL CO LTD
发明人： YOSHIZAKO KIMIHIRO , KUBOTA MASAO , OHASHI TAKESHI
IPC分类号： G03F7/11 , G03F7/004 , H05K3/06 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive film which can be tightly adhered, in particular, to a rugged part of a substrate surface without generating a gap and which does not produce splits or resin chips when manufactured, and to provide a method for manufacturing a printed wiring board by using the film. SOLUTION: The photosensitive film comprises a supporting layer, a cushion layer formed on the supporting layer, and a photosensitive layer formed on the cushion layer. The cushion layer comprises a resin having ≤1,000% breaking extension and ≤10 MPa tensile modulus of elasticity. COPYRIGHT: (C)2005,JPO&NCIPI

4. 发明专利

JP2004004528A PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING THE SAME, METHOD FOR MANUFACTURING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 审中-公开
公开(公告)号：JP2004004528A
公开(公告)日：2004-01-08
申请号：JP2003011497
申请日：2003-01-20
申请人： HITACHI CHEMICAL CO LTD
发明人： OHASHI TAKESHI , ICHIKAWA TATSUYA
IPC分类号： G03F7/004 , C08F2/44 , C08F257/02 , C08F299/00 , G03F7/027 , H05K3/06 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent resolution, adhesion properties and imaging properties, a photosensitive element, a method for manufacturing resist patterns, and a method for manufacturing a printed wiring board. SOLUTION: The method for manufacturing resist patterns comprises coating the surface of a support with a photosensitive resin composition containing a carboxyl group-containing binder polymer containing 0.1 to 30wt% styrene or styrene derivatives as a copolymerization component, a photopolymerizable unsaturated compound (B), a photopolymerization initiator (C), and a general formula (1)(D), then drying the coating, laminating the same to form a photosensitive resin, laminating such photosensitive element on a substrate for circuit formation, irradiating the element with active rays in the shape of an image, and removing unexposed sections by development. COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2002268211A PHOTOSENSITIVE ELEMENT, METHOD FOR PRODUCING RESIST PATTERN USING THE SAME AND METHOD FOR PRODUCING PRINTED WIRING BOARD 失效
公开(公告)号：JP2002268211A
公开(公告)日：2002-09-18
申请号：JP2001062565
申请日：2001-03-06
申请人： HITACHI CHEMICAL CO LTD
发明人： OHASHI TAKESHI , ISO JUNICHI , ICHIKAWA TATSUYA
IPC分类号： G03F7/004 , C08F2/44 , C08F2/50 , C08F291/00 , G03F7/027 , G03F7/028 , G03F7/032 , G03F7/09 , H05K3/00 , H05K3/06 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive element having high resolution, giving a resist pattern having very excellent side face ruggedness, resolution, adhesion, flatness, plating resistance and imaging property and ensuring a small number of mouse bites. SOLUTION: The photosensitive element is obtained by forming a resin layer containing fine particles on one face of a biaxial oriented polyester film and forming a layer of a photosensitive resin composition on the resin layer-free face of the resulting support film by coating and drying. The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable unsaturated compound having at least one polymerizable ethylenically unsaturated bond in one molecule, (C) a photopolymerization initiator and (D) a polyphenol having two or more OH groups substituted on a benzene ring, e.g. hydroquinone, catechol or resorcinol.

6. 发明专利

JP2001255653A PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING THE SAME, METHOD FOR PRODUCING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD 失效
公开(公告)号：JP2001255653A
公开(公告)日：2001-09-21
申请号：JP2001000945
申请日：2001-01-09
申请人： HITACHI CHEMICAL CO LTD
发明人： ICHIKAWA TATSUYA , ENDO MASAKI , ISHIKAWA TSUTOMU , KIMURA NORIYO , MUKAI JINKO , OHASHI TAKESHI , FUKAYA TAKEHIRO
IPC分类号： G03F7/033 , C08F2/44 , C08F2/50 , C08F220/30 , C08F257/02 , C08F265/02 , C08F290/06 , C08F291/00 , G03F7/027 , H05K3/06 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in photosensitivity, resolution, chemical resistance (plating resistance), adhesion, mechanical strength and flexibility, a photosensitive element, a method for producing a resist pattern and a method for producing a printed wiring board. SOLUTION: The photosensitive resin composition contains (A) a binder polymer having a dispersity of 1.0-3.0, (B) a photopolymerizable compound containing a bisphenol A type (meth)acrylate compound as an essential component and having at least one polymerizable ethylenically unsaturated bond in one molecule of the compound and (C) a photopolymerization initiator. The photosensitive element is obtained by coating the top of a base with a layer of the photosensitive resin composition and drying the layer. The method for producing a resist pattern uses the photosensitive element. In the method for producing a printed wiring board, a substrate for forming a circuit with a resist pattern produced by the above method is etched or plated.

7. 发明专利

JP2000047380A PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT USING SAME 失效
公开(公告)号：JP2000047380A
公开(公告)日：2000-02-18
申请号：JP21330098
申请日：1998-07-28
申请人： HITACHI CHEMICAL CO LTD
发明人： OHASHI TAKESHI , ISHIKAWA TSUTOMU
IPC分类号： G03F7/027 , C08F20/36 , C08F291/00 , C08F299/00 , G03F7/028
摘要： PROBLEM TO BE SOLVED: To obtain a photosensitive resin compsn. excellent in adhesion, resolution, peeling property, etc., by incorporating a polymer binder, a specified photopolymerizable compd. and a photopolymn. initiator. SOLUTION: The photosensitive resin compsn. contains (A) a polymer binder, (B) a photopolymerizable compd. contg. a compd. of formula I as an essential component and having polymerizable ethylenically unsatd. groups in one molecule and (C) a photopolymn. initiator. In the formula I, R1 is H or a 1-3C alkyl, X is a 2-16C hydrocarbon, A is ethylene, B is a 3-6C alkylene, (m), (n), (p) and (q) are each an integer of 0-14, one of (m) and (p) is an integer of 1-14, one of (n) and (q) is an integer of 1-14 and Z is a group of formula II, wherein R2 is H or a 1-3C alkyl, W is a 2-6C alkylene and (r) and (s) are each an integer of 0-14.

8. 发明专利

JP2003131370A PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT USING THE SAME 审中-公开
公开(公告)号：JP2003131370A
公开(公告)日：2003-05-09
申请号：JP2001326528
申请日：2001-10-24
申请人： HITACHI CHEMICAL CO LTD
发明人： FUJIWARA TAKESHI , OHASHI TAKESHI , ICHIKAWA TATSUYA
IPC分类号： G03F7/027 , G03F7/004 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high sensitivity and excellent chemical resistance (plating resistance) and useful to increase the density and resolution of printed wiring and to further provide a photosensitive resin composition having excellent mechanical strength, flexibility, adhesion, resolution and chemical resistance. SOLUTION: The photosensitive resin compositions comprise (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in one molecule and (C) a photopolymerization initiator, wherein the component (B) comprises a compound of formula (I) and a compound of formula (II) as essential components.

9. 发明专利

JP2001305730A PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING THE SAME, METHOD FOR PRODUCING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD 失效
公开(公告)号：JP2001305730A
公开(公告)日：2001-11-02
申请号：JP2000128989
申请日：2000-04-25
申请人： HITACHI CHEMICAL CO LTD
发明人： OHASHI TAKESHI
IPC分类号： G03F7/027 , C08F2/44 , C08F2/50 , C08F291/00 , G03F7/031 , G03F7/033 , H05K3/06 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in removability, developability, scumming resistance, adhesion and work efficiency, a photosensitive element, a method for producing a resist pattern using the element and a method for producing a printed wiring board using the element. SOLUTION: The photosensitive resin composition contains (A) two or more binder polymers, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated bond in one molecule and (C) a photopolymerization initiator. The component (B) contains (b1) a compound having one polymerizable ethylenically unsaturated bond and at least one phenyl or phenylene group in one molecule as an essential component. The photosensitive element is obtained by applying, drying and laminating the photosensitive resin composition on a substrate.

10. 发明专利

JP2001159817A PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING SAME, METHOD FOR PRODUCING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD 失效
公开(公告)号：JP2001159817A
公开(公告)日：2001-06-12
申请号：JP34402599
申请日：1999-12-03
申请人： HITACHI CHEMICAL CO LTD
发明人： ICHIKAWA TATSUYA , ENDO MASAKI , ISHIKAWA TSUTOMU , KIMURA NORIYO , KIMURA JINKO , OHASHI TAKESHI , FUKAYA TAKEHIRO
IPC分类号： H05K3/06 , C08F2/46 , C08F220/30 , C08F290/06 , C08F291/00 , G03F7/027 , G03F7/028 , G03F7/033 , H05K3/00 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in photosensitivity, resolution, chemical resistance (plating resistance), adhesion, mechanical strength and elasticity and a photosensitive element excellent in photosensitivity, resolution, chemical resistance (plating resistance), adhesion, mechanical strength, elasticity, work efficiency and productivity. SOLUTION: The photosensitive resin composition contains (A) a binder polymer having 8 dispersity of 1.0-3.0, (B) a photopolymerizable compound including a bisphenol A type (meth)acrylate compound as an essential component and having at least one polymerizable ethylenically unsaturated bond in one molecule and (C) a photopolymerization initiator. The top of a substrate is coated with a layer of the photosensitive resin composition and dried to obtain the objective photosensitive element or the top of a substrate is coated with a layer of the photosensitive resin composition and dried and a protective film is further laminated in such a way that it comes in contact with the layer of the photosensitive resin composition opposite to the substrate to obtain the objective photosensitive element.

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