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1. 发明专利

JP2014069296A Electrode for electric discharge machining 审中-公开
标题翻译：电动放电电极
公开(公告)号：JP2014069296A
公开(公告)日：2014-04-21
申请号：JP2012218904
申请日：2012-09-29
申请人： Nippon Tungsten Co Ltd , 日本タングステン株式会社
发明人： KOE SHINGO , KUBO YUJI , FUJITA TAKAHIRO , NAKAGAWACHI KOJI , YOSHIZUMI KENSUKE , MORI YASUHIDE , TANAKA TAKAAKI , MORI TATSUYA , BENOKI HIDERO , UENO SHUJI
IPC分类号： B23H1/06
摘要： PROBLEM TO BE SOLVED: To improve a bonding area of both plate materials, in an electrode for electric discharge machining having a plate Cu-W composite material (a.) and a plate iron material (b.).SOLUTION: Both materials are bonded together by brazing, and a brazing part has a structure of first brazing material (d.)-copper plate (c.)-second brazing material (e.) from the iron-based material (b.) side. Wettability between the members is heightened by sandwiching the copper plate (c.) to reduce a gap caused by brazing, and to thereby improve greatly a bonding area. A brazing material using an alloy in which a temperature at which a solid phase and a liquid phase coexist has a width of 70°C or more is especially suited for the first brazing material. A brazing material having a liquidus curve equal to or lower than that of the first brazing material is suited for the second brazing material.
摘要翻译：要解决的问题：为了提高两种板材的接合面积，在具有板Cu-W复合材料（a。）和板铁材料（b。）的放电加工用电极中。一起钎焊，并且钎焊部分具有从铁基材料（b。）侧开始的第一钎焊材料（d。） - 铜板（c。） - 第二钎焊材料（例如）的结构。通过夹住铜板（c。）来增加构件之间的润湿性，以减少由钎焊引起的间隙，从而大大改善粘结面积。使用其中固相和液相共存的温度具有70℃以上的宽度的合金的钎焊材料特别适合于第一钎焊材料。具有等于或低于第一钎焊材料的液相线曲线的钎焊材料适合于第二钎焊材料。

2. 发明专利

JP2008073712A Electrode for fusing welding 有权
标题翻译：焊接电极
公开(公告)号：JP2008073712A
公开(公告)日：2008-04-03
申请号：JP2006254550
申请日：2006-09-20
申请人： Nippon Tungsten Co Ltd , Nisshin Steel Co Ltd , 日新製鋼株式会社 , 日本タングステン株式会社
发明人： KOE SHINGO , OKAMURA KENJI , TERAMOTO SHUICHI , KUROBE ATSUSHI , ASADA HIROSHI , INOUE SHOJI , MATSUBARA SHIGEO
IPC分类号： B23K11/30 , B22F3/24 , C22C1/04 , C22C1/05 , C22C27/04 , C22C32/00
摘要： PROBLEM TO BE SOLVED: To inexpensively provide an electrode for fusing welding to be repeatedly subjected to heating/pressurizing in which grain removal attrition, and chipping at the tip part are suppressed, and whose durability is stably increased.
SOLUTION: In an electrode with a double structure where the tip part of an electrode body made of Cu or a Cu alloy is mounted with an electrode core material using W or Mo or an alloy based on them as a base material, as the electrode core material, W or Mo or an alloy based on them subjected to sintering and swaging and the subsequent heat treatment as annealing, and having a fibrous structure elongating to the axial direction in such a manner that the average grain diameter in the transverse section is ≥50 μm, and also, its aspect ratio reaches ≥1.5 is used.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了廉价地提供一种用于熔化焊接的电极，其被重复地进行加热/加压，其中抑制了谷物去除磨损，并且抑制了尖端部分的碎裂，并且其耐久性稳定增加。解决方案：在具有双重结构的电极中，由Cu或Cu合金制成的电极体的末端部分使用W或Mo的电极芯材料或基于它们的合金作为基材安装，作为电极芯材，W或Mo或基于它们的合金进行烧结和型锻，随后的热处理为退火，并且具有沿轴向延伸的纤维结构，使得横截面中的平均晶粒直径 ≥50μm，并且使用其长宽比≥1.5。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2015013307A 抵抗溶接用電極有权
标题翻译：电阻焊接电极
公开(公告)号：JP2015013307A
公开(公告)日：2015-01-22
申请号：JP2013142197
申请日：2013-07-06
申请人：日本タングステン株式会社 , Nippon Tungsten Co Ltd
发明人： MORI SHIGEKI , MISHIMA AKIRA , UENO SHUJI , KOE SHINGO
IPC分类号： B23K35/02 , B23K11/30 , B23K35/32 , C22C1/05 , C22C29/08 , C22C29/14 , C22C29/16 , C22C32/00
摘要：【課題】被溶接材が難溶接材であっても、通電による自身の発熱が大きさにより溶接が可能で、かつ、被溶接材と反応しにくい抵抗溶接用電極を得る。【解決手段】抵抗溶接用電極の少なくとも非溶接材と接する面に、Wを5〜95体積%と4a〜6a族金属炭化物、窒化物、ホウ化物等を5〜95体積%有する材料を用いることで解決した。これらの材料は電気抵抗率が比較的高く、電極として用いた場合に抵抗発熱量が大きく、難溶接材も溶接が容易になる。また、被溶接金属がアルミニウム、マグネシウムなどの電極と溶着が起こりやすい材料であっても、反応性が低いために溶着が起こりにくい。Wの破壊靱性が高いために、様々な電極形状に用いることが可能である。【選択図】図1
摘要翻译：要解决的问题：为了提供电阻焊接用电极，即使焊接对象由难焊接材料制成也能够焊接对象彼此焊接，这是由于电极本身由于导电而产生的大量热量，并且几乎不与焊接对象反应。解决方案：使用包含5-95体积％的W和5-95体积％的4A至6A族金属的碳化物，氮化物，硼化物等的任何材料至少在焊接电极的表面上分别接触焊接对象。这些材料各自具有相对高的电阻率，并且当用作电极时具有大的电阻加热量，因此即使难焊接材料也容易焊接。此外，即使焊接金属是易于对诸如铝，镁等的电极沉积的材料，由于材料的低反应性，几乎不会沉积。此外，由于W的断裂韧性高，所以材料可用于各种形状的电极。

4. 发明专利

JP2007260718A Electrode for seam welding 审中-公开
标题翻译：焊接电极
公开(公告)号：JP2007260718A
公开(公告)日：2007-10-11
申请号：JP2006088151
申请日：2006-03-28
申请人： Nippon Tungsten Co Ltd , Nisshin Steel Co Ltd , 日新製鋼株式会社 , 日本タングステン株式会社
发明人： KUROBE ATSUSHI , ASADA HIROSHI , OKAMURA KENJI , KOE SHINGO
IPC分类号： B23K11/30
摘要： PROBLEM TO BE SOLVED: To prolong the life of an electrode used for seam welding of a Zn based plated steel sheet and the like.
SOLUTION: The electrode 1 for seam welding has double structure in which a core material 4 composed of W or Mo or an alloy using them as the base material is imbedded in an abutting face 2 of a Cu- or Cu alloy-made electrode body, the abutting face 2 abutting on a material to be welded, wherein when W
0 is the width of the abutting face and W
1 is the width of the core material, a width ratio W
1 /W
0 is set in the range of 0.7-3.0.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：延长用于Zn基镀覆钢板等的缝焊的电极的寿命。解决方案：用于缝焊的电极1具有双重结构，其中由W或Mo组成的芯材4或使用它们作为基材的合金被嵌入Cu或Cu合金制成的邻接面2中电极体，邻接在待焊接材料上的抵接面2，其中当W 0 是接触面的宽度时，W 1 是芯材的宽度，宽度比W 1 / W 0 设定在0.7-3.0的范围内。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2006095549A ELECTRODE FOR SPOT WELDING OF STEEL PLATE PLATED WITH Mg COMPONENT-CONTAINING ZINC-BASED ALLOY 有权
标题翻译：用含Mg组分含锌合金的钢板焊点焊丝
公开(公告)号：JP2006095549A
公开(公告)日：2006-04-13
申请号：JP2004282463
申请日：2004-09-28
申请人： Nippon Tungsten Co Ltd , Nisshin Steel Co Ltd , 日新製鋼株式会社 , 日本タングステン株式会社
发明人： KUROBE ATSUSHI , ASADA HIROSHI , MATSUBARA SHIGEO , TERAMOTO SHUICHI , KOE SHINGO , SAKAGUCHI SHIGEYA , MATSUO SHIGERU
IPC分类号： B23K11/30 , B23K11/16 , B23K103/04 , B23K103/16 , C22C27/04
摘要： PROBLEM TO BE SOLVED: To inexpensively provide an electrode for spot welding, wherein the long service life can be attained by suppressing the welding/alloying with a plating metal and preventing generation of cracks even when a plated steel plate subjected to Mg component-containing Zn alloy plating is subjected to spot welding under a high electric current.
SOLUTION: For the electrode having a double structure where a core material is imbedded in an electrode body, W or Mo in which at least one or more kinds of fine particles selected from the oxides of Be, Mg, Ca, Sr, Ti, Zr, Y and Ce are dispersed in an amount of 0.5 to 10 volume% or an alloy using them as a base material is used as the core material. In the electrode, the oxidation of an Mg component in the plating metal is inhibited by the action of the dispersed fine particles, thus the depositing of MgO to the tip of the electrode is inhibited, and the welding of the electrode and the plating metal is caused with difficulty, thereby improving the service life of the electrode.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了廉价地提供点焊用电极，其中通过抑制与电镀金属的焊接/合金化并且即使当经受Mg组分的电镀钢板时也能防止产生裂纹，可以实现长使用寿命的Zn合金镀层在高电流下进行点焊。解决方案：对于具有核心材料嵌入电极体中的双重结构的电极，其中至少一种或多种选自Be，Mg，Ca，Sr， Ti，Zr，Y和Ce以0.5〜10体积％的量分散，或者使用它们作为基材的合金作为芯材。在电极中，电镀金属中的Mg成分的氧化被分散的微粒的作用抑制，因此抑制了MgO向电极前端的析出，电极和电镀金属的焊接为引起难度，从而提高电极的使用寿命。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2004315841A Metallic material 有权
公开(公告)号：JP2004315841A
公开(公告)日：2004-11-11
申请号：JP2003107436
申请日：2003-04-11
申请人： Nippon Tungsten Co Ltd , 日本タングステン株式会社
发明人： MISHIMA AKIRA , KOE SHINGO , UENO SATOYUKI
IPC分类号： C22C9/00 , C22C5/06
摘要： PROBLEM TO BE SOLVED: To provide a metallic material which has high conductivity and high hardness and can be used for an electric contact material, a resistance welding electrode, a semiconductor lead frame, a sliding and current-conducting member, a wire material for electric discharge machining, etc., and whose characteristics are free from deterioration independently of environmental conditions, such as heating temperature, during its application.
SOLUTION: The metallic material can be manufactured by dispersing particles of W, Mo, Re, etc., into a Cu-Ag alloy consisting of, by weight, 0.5 to 20% Ag and 80 to 99.5% Cu. In spite of its electric conductivity equal to that of the conventional one, the metallic material has higher hardness owing to the precipitation hardening of Cu and Ag.
COPYRIGHT: (C)2005,JPO&NCIPI

7. 发明专利

JP2015014036A 抵抗溶接用電極有权
标题翻译：电阻焊接用电极
公开(公告)号：JP2015014036A
公开(公告)日：2015-01-22
申请号：JP2013142198
申请日：2013-07-06
申请人：日本タングステン株式会社 , Nippon Tungsten Co Ltd
发明人： MORI SHIGEKI , MISHIMA AKIRA , UENO SHUJI , KOE SHINGO
IPC分类号： B22F5/00 , B23K11/30
摘要：【課題】被溶接材が難溶接材であっても、通電による自身の発熱が大きさにより溶接が可能で、かつ、被溶接材と反応しにくい抵抗溶接用電極を得る。【解決手段】抵抗溶接用電極の少なくとも被溶接材と接する面に4a〜6a族金属炭化物、窒化物、ホウ化物等を用いることで解決した。これらの材料は電気抵抗率が比較的高く、電極として用いた場合に抵抗発熱量が大きく、難溶接材も溶接が容易になる。また、被溶接金属がアルミニウム、マグネシウムなどの電極と溶着が起こりやすい材料であっても、反応性が低いために溶着が起こりにくい。【選択図】図1
摘要翻译：要解决的问题：提供一种用于电阻焊接的电极，其允许通过带电自身产生的热量进行焊接，即使当待焊接材料是难以焊接的材料并且提供用于电阻焊接的电极，焊接材料。解决方案：用于电阻焊接的电极在与待焊接材料接触的电极的表面中使用第4a至6a等组中的一种或多种金属碳化物，氮化物和硼化物。该材料具有相对高的电阻率，当用作电极时具有高的电阻值，并使难焊接材料易于焊接。即使待焊接金属是易于沉积在电极上的材料，例如，铝或镁，由于低反应性，电极引起较少的沉积。

8. 发明专利

JP2008012591A Electrode for spot welding 有权
标题翻译：电焊点焊
公开(公告)号：JP2008012591A
公开(公告)日：2008-01-24
申请号：JP2007137474
申请日：2007-05-24
申请人： Nippon Tungsten Co Ltd , Nisshin Steel Co Ltd , 日新製鋼株式会社 , 日本タングステン株式会社
发明人： KOE SHINGO , OKAMURA KENJI , TERAMOTO SHUICHI , KUROBE ATSUSHI , ASADA HIROSHI , INOUE SHOJI , MATSUBARA SHIGEO
IPC分类号： B23K35/04 , B23K11/30
摘要： PROBLEM TO BE SOLVED: To inexpensively provide a W (tungsten)- or Mo (molybdenum)-based electrode which is used for spot welding in which the electrode is repeatedly subjected to heating and pressurization, and which has stable and enhanced durability by suppressing attrition and breakage at the working face of the electrode.
SOLUTION: The electrode for spot welding has a double structure comprising an electrode body of Cu or a Cu alloy and a core material of a W, Mo, W-based alloy or a Mo-based alloy which is embedded in the face of the electrode body abutting on a material to be welded. The core material is sintered, swaged and then annealed. The W, Mo, W-based alloy or the Mo-based alloy used as the core material has an average particle diameter of not less than 50 μm at a cross section thereof, and has a fibrous structure extended axially so as to have an aspect ratio of 1.5 or more.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了廉价地提供用于点焊的W（钨）或Mo（钼）基电极，其中电极被反复进行加热和加压，并且其具有稳定和增强的耐久性通过抑制在电极的工作面上的磨损和断裂。解决方案：用于点焊的电极具有包括Cu或Cu合金的电极体和W，Mo，W基合金或Mo基合金的芯材的双重结构，其嵌入在该表面中的电极体抵接在待焊接的材料上。将芯材烧结，模锻，然后退火。用作芯材的W，Mo，W基合金或Mo基合金在其横截面上的平均粒径不小于50μm，并且具有轴向延伸的纤维结构，从而具有方面比例在1.5以上。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2006015349A Spot welding electrode 有权
标题翻译： SPOT焊接电极
公开(公告)号：JP2006015349A
公开(公告)日：2006-01-19
申请号：JP2004192694
申请日：2004-06-30
申请人： Nippon Tungsten Co Ltd , Nisshin Steel Co Ltd , 日新製鋼株式会社 , 日本タングステン株式会社
发明人： KUROBE ATSUSHI , ASADA HIROSHI , MATSUBARA SHIGEO , TERAMOTO SHUICHI , KOE SHINGO , SAKAGUCHI SHIGEYA , MATSUO SHIGERU
IPC分类号： B23K11/30 , B23K35/04 , B23K103/04 , B23K103/16
摘要： PROBLEM TO BE SOLVED: To provide a spot welding electrode capable of suppressing welding and alloying with plating metal, preventing cracks, and prolonging the lifetime even when performing the spot welding of a plated steel plate with Zn plating or Zn alloy plating thereon under a large current.
SOLUTION: A core 3 formed of an alloy consisting of tungsten or molybdenum or an alloy with tungsten or molybdenum as a base metal of at least one of particles selected from oxide, nitride, carbide or boride of 2a group element, 4a group element or rare earth metal is embedded in an abutting face 2a to be abutted on a material to be welded of a body of an electrode 1 formed of copper or a copper alloy so that the area ratio of the core to the abutting face is 70-300%. The particles are preferably dispersed at the rate of 0.5-10 vol.%.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够抑制与电镀金属的焊接和合金化的点焊电极，防止裂纹，并且即使在其上进行镀锌钢板或锌合金镀层的镀覆钢板的点焊时也延长其使用寿命在大电流下。解决方案：由钨或钼组成的合金或与钨或钼合金作为选自2a族元素的氧化物，氮化物，碳化物或硼化物中的至少一种的贱金属的合金的芯3，4a族元件或稀土金属嵌入在邻接面2a中，以抵接在由铜或铜合金形成的电极1的主体的待焊接材料上，使得芯与抵接面的面积比为70度， 300％。颗粒优选以0.5-10体积％的比例分散。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2005263582A Perovskite type compound thin film and its forming method 审中-公开
标题翻译： PEROVSKITE型复合薄膜及其成型方法
公开(公告)号：JP2005263582A
公开(公告)日：2005-09-29
申请号：JP2004080871
申请日：2004-03-19
申请人： Fukuoka Prefecture , Nippon Tungsten Co Ltd , 日本タングステン株式会社 , 福岡県
发明人： FUJIYOSHI KUNITAKA , TANIGUCHI YOKO , ARIMURA MASASHI , MAKINO AKIHISA , YAMAGUCHI HIROBUMI , KOE SHINGO
IPC分类号： C04B35/46 , C09D201/00
摘要： PROBLEM TO BE SOLVED: To provide a method for forming a perovskite type compound thin film pattern without cracks by making a thin film from a perovskite type compound material and by patterning it without using a large-scale special expensive device. SOLUTION: A support substrate 11 is coated with a solution containing perovskite type compound particles of which the particle diameter is 50 nm or less and of which 10-15 mass% of the surface is covered with an organic substance, thus forming a perovskite type compound thin film 12. On the perovskite type compound thin film 12, a resist pattern 13 is formed by a photolithography method. Then, the perovskite type compound thin film 12 is etched with an acid having a pH of 5 or less under masking by the resist pattern 13, and finally the resist pattern is removed. The pattern formation of the perovskite type compound thin film can be performed by the above wet etching method. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种通过从钙钛矿型复合材料制造薄膜而形成钙钛矿型化合物薄膜图案而不产生裂纹的方法，并且通过对其进行图案化而不使用大规模的特殊昂贵装置。解决方案：用含有粒径为50nm以下的钙钛矿型化合物颗粒，其表面被10-15质量％覆盖有机物质的溶液涂布在支撑基板11上，形成钙钛矿型化合物薄膜12.在钙钛矿型化合物薄膜12上，通过光刻法形成抗蚀图案13。然后，在抗蚀剂图案13掩蔽下，用pH为5以下的酸蚀刻钙钛矿型化合物薄膜12，最后除去抗蚀剂图案。钙钛矿型化合物薄膜的图案形成可以通过上述湿式蚀刻方法进行。版权所有（C）2005，JPO＆NCIPI

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