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    • 2. 发明专利
    • Transparent conductive film
    • JP5348905B2
    • 2013-11-20
    • JP2008043956
    • 2008-02-26
    • 富士フイルム株式会社
    • 佳弘 藤田直弥 西村
    • H01B5/14B32B15/04
    • PROBLEM TO BE SOLVED: To form a transparent conductive film capable of carrying out electroless plating treatment in a short time, and reducing a defect caused by an adhesion failure of an electroless plated layer continuously by a simple process and inexpensively even in the case of a lengthy transparent conductive film. SOLUTION: This has a printing process of pattern-forming a second printed layer by printing a metal compound containing paste for printing on an ink receiving layer of a transparent base body, a reduction treatment process of forming metal from the upper face successively to the side face of the second printed layer by carrying out reduction treatment to the second printed layer, a substitute plating process of adhering catalyst metal from the upper face successively to the side face of the second printed layer by carrying out the substitute plating process to the second printed layer that has finished the reduction treatment, and an electroless plating process of forming the electroless plated layer on the catalyst metal adhered on the second printed layer by carrying out the electroless plating treatment. COPYRIGHT: (C)2009,JPO&INPIT