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1. 发明专利

JP5360552B2 gasket 有权
公开(公告)号：JP5360552B2
公开(公告)日：2013-12-04
申请号：JP2009042680
申请日：2009-02-25
申请人：北川工業株式会社
发明人：広晃加藤 , 利樹瀬戸
IPC分类号： H05K9/00 , F16J15/14
摘要： PROBLEM TO BE SOLVED: To enhance dimensional accuracy in a gasket including a conductive outer coat fitted onto an elastic foam body as a core material. SOLUTION: A block-like or sheet-like elastic foam body is cut into a columnar body having a rectangular sectional shape. This is used as a base material 1, and the base material 1 is slitted 4 from one side surface 2 thereof to a counter side surface 3 facing thereto while leaving a non-cut part 5 on the counter surface side 3. A pair of cut surfaces 6 and 6 formed by the slit 4 is opened with the non-cut part 5 as a fulcrum point to form an elastic core material 7. An adhesive layer 9 is provided on the outer circumference of the elastic core material 7, and a conductive outer is adhesively fitted thereto to form a gasket 10. Since the base material 1 of the elastic core material 7 is worked with a knife, the dimensional accuracy can be enhanced. Further, since the non-cut part 5 left in the elastic core material 7 acts as the fulcrum point, the gasket can be used to a slide part without causing a trouble such that a desired compression resistance cannot be obtained due to slippage of fulcrum point. COPYRIGHT: (C)2010,JPO&INPIT

3. 发明专利

JP4464254B2 Conductive gel composition 有权
公开(公告)号：JP4464254B2
公开(公告)日：2010-05-19
申请号：JP2004330801
申请日：2004-11-15
申请人：北川工業株式会社
发明人：広晃加藤 , 輝明祐岡
IPC分类号： H01B1/22 , C08K3/00 , C08K5/00 , C08L53/02 , H01B1/00 , H04R1/02 , H05K9/00
摘要： PROBLEM TO BE SOLVED: To provide a conductive gel composition superior in flexibility and capable of demonstrating conductivity at low load. SOLUTION: This is the conductive gel composition containing a substrate resin consisting of styrene system elastomer, a softening agent, and a conductive filler. The conductive gel composition contains the softening agent 200-1,500 parts by weight and the conductive filler 150-3,000 parts by weight against the substrate resin 100 parts by weight, and the durometer hardness is A40 or less. It is desirable that the conductive filler has aspect ratio of 1-5. Furthermore, the conductive gel composition can be used for an electrode material for microphone holder, a shield packing, a gasket, and a grounding member for electronic equipment. COPYRIGHT: (C)2006,JPO&NCIPI

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