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    • 1. 发明专利
    • Composite resin composition and molded product having excellent insulation properties and heat dissipation properties
    • 复合树脂组合物和具有优异绝缘性能和散热性能的成型产品
    • JP2014109024A
    • 2014-06-12
    • JP2012265603
    • 2012-12-04
    • Sumitomo Bakelite Co Ltd住友ベークライト株式会社
    • SUGINO RYOSUKE
    • C08L101/00C08K3/00C08K7/02
    • PROBLEM TO BE SOLVED: To provide a composite resin composition which has more excellent moldability, lightness, and insulation properties compared to ceramic materials, and more excellent thermal conductivity and mechanical strength compared to resin materials.SOLUTION: The composite resin composition includes constituent materials formed of: a high thermal conductive filler (A) having insulation properties; and a resin (B). A molded product of the resin composition has: a thermal conductivity in plane direction of 2 W/mK or more measured by a laser flash method; a thermal conductivity in thickness direction less than half of the thermal conductivity in plane direction; a flexural strength of 100 MPa or more and a flexural modulus of elasticity of 8 GPa or more measured in accordance with JIS K 6911; a specific gravity of 1 or more and 5 or less measured in accordance with JISK 6911; a coefficient of linear expansion in plane direction of 0.1 ppm/°C or more and 50 ppm/°C or less measured in accordance with JIS K 7197; and a volume resistivity of 10Ω cm or more and 10Ω cm or less measured in accordance with JIS K6911.
    • 要解决的问题:提供一种与陶瓷材料相比具有更优异的成型性,亮度和绝缘性能的复合树脂组合物,并且与树脂材料相比具有更优异的导热性和机械强度。解决方案:复合树脂组合物包括形成的组成材料 :具有绝缘性能的高导热填料(A); 和树脂(B)。 树脂组合物的成型体具有:通过激光闪光法测定的平面方向的热导率为2W / m·K以上; 厚度方向的热导率小于平面方向热导率的一半; 根据JIS K 6911测定的弯曲强度为100MPa以上,挠曲弹性模量为8GPa以上; 根据JISK 6911测定的比重为1以上且5以下; 根据JIS K 7197测定的平面方向的线膨胀系数为0.1ppm /℃以上至50ppm /℃以下; 体积电阻率为10&OHgr; 厘米以上和10&OHgr; cm以下。
    • 3. 发明专利
    • 積層体および筐体
    • 层压和住房
    • JP2015058533A
    • 2015-03-30
    • JP2013191292
    • 2013-09-17
    • 住友ベークライト株式会社Sumitomo Bakelite Co Ltd
    • SUGINO RYOSUKEKIMURA YASUTAKA
    • B32B7/02B32B27/20H05K5/02
    • 【課題】成形加工性、軽量性、絶縁性、熱伝導率、機械的強度に優れる積層体を提供すること。【解決手段】第1組成物で構成される熱伝導層と第2組成物で構成される強度層を有し、かつ、最外層が前記強度層からなる積層体であって、前記積層体の曲げ強さは200MPa以上であり、前記熱伝導層の、レーザーフラッシュ法により測定した平面方向の熱伝導率が10W/mK以上であることを特徴とする積層体。前記第1組成物がフィラーと樹脂とを含み、前記第1組成物に含まれるフィラーが、繊維状のフィラーである。前記第2組成物がフィラーと樹脂とを含み、前記第2組成物に含まれるフィラーが、繊維状のフィラーである。【選択図】なし
    • 要解决的问题:提供具有优异的成型性,亮度,绝缘性,导热性和机械强度的层压体。解决方案:层压体具有由第一组合物构成的导热层和由第二组合物构成的强化层, 最外层是强度层。 层压体的弯曲强度为200MPa以上,导热层的通过激光闪光法测定的平面方向的导热率为10W / m·K以上。 第一组合物含有填料和树脂,第一组合物中所含的填料是纤维填料。 第二组合物含有填料和树脂,第二组合物中所含的填料是纤维填料。
    • 5. 发明专利
    • Composite resin composition and molding having an excellent heat diffusibility
    • 复合树脂组合物和模塑具有优异的热差
    • JP2014101459A
    • 2014-06-05
    • JP2012254997
    • 2012-11-21
    • Sumitomo Bakelite Co Ltd住友ベークライト株式会社
    • SUGINO RYOSUKE
    • C08L101/00C08J5/04C08K3/08C08K3/26C08K3/34C08K7/02C08K7/06
    • PROBLEM TO BE SOLVED: To provide a composite resin composition superior to metallic materials in terms of moldability and weight reduction potential and superior to resin materials in terms of heat conductivity and mechanical strength.SOLUTION: The provided composite resin composition is a composite resin composition including (A) a carbon fiber and (B) a resin as constituent materials and having the following characteristics: the heat conductivity of a molding obtained by molding the resin composition along the plane direction thereof as measured based on the laser flash method is 5 W/mK or above; the heat conductivity thereof along the thickness direction is no more than a half of the heat conductivity along the plane direction; the flexural strength and flexural modulus of elasticity thereof measured in compliance with JIS K 6911 are respectively 100 MPa or above and 10 GPa or above; the specific gravity thereof measured in compliance with JIS K 6911 is 1.0 or above and 2.5 or below; the linear expansion coefficient thereof along the plane direction measured in compliance with JIS K 7197 is 0.1 ppm/°C or above and 50 ppm/°C or below; a molding excellent in terms of heat conductivity using the composite resin composition is also provided.
    • 要解决的问题:提供在成型性和重量减轻潜力方面优于金属材料的复合树脂组合物,并且在导热性和机械强度方面优于树脂材料。解决方案:提供的复合树脂组合物是一种复合树脂组合物,包括 (A)碳纤维和(B)树脂作为构成材料并具有以下特征:通过基于激光闪光法测量的沿着其平面方向模制树脂组合物获得的模制品的导热率为5W / mK以上; 沿着厚度方向的热传导率不超过沿着平面方向的热传导率的一半; 根据JIS K 6911测定的挠曲强度和挠曲弹性模量分别为100MPa以上且10GPa以上; 按照JIS K 6911测定的比重为1.0以上且2.5以下; 其沿着根据JIS K 7197测量的平面方向的线性膨胀系数为0.1ppm /℃或更高且为50ppm /℃或更低; 还提供了使用复合树脂组合物的导热性优异的成型体。