专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP5469271B2 Dicing sheet and a method of manufacturing the same with identification mark 有权
公开(公告)号：JP5469271B2
公开(公告)日：2014-04-16
申请号：JP2013089607
申请日：2013-04-22
申请人：リンテック株式会社
发明人：修山崎 , 正啓古館 , 昭枝濱崎
IPC分类号： H01L21/301

2. 发明专利

JP5406995B2 Adhesive used in the method of manufacturing a semiconductor device 有权
公开(公告)号：JP5406995B2
公开(公告)日：2014-02-05
申请号：JP2013016952
申请日：2013-01-31
申请人：リンテック株式会社
发明人：修山崎 , 功市川
IPC分类号： H01L21/52

3. 发明专利

JP5010800B2 Adhesive tape for the production method and the dicing of semiconductor device 有权
公开(公告)号：JP5010800B2
公开(公告)日：2012-08-29
申请号：JP2004091769
申请日：2004-03-26
申请人：リンテック株式会社
发明人：明徳佐藤 , 修山崎 , 貴志杉野
IPC分类号： C09J7/02 , H01L21/301 , C09J4/00 , C09J5/00 , C09J133/08

4. 发明专利

JP5005325B2 Pressure-sensitive adhesive composition, method of manufacturing the adhesive sheet and the semiconductor device 有权
公开(公告)号：JP5005325B2
公开(公告)日：2012-08-22
申请号：JP2006319231
申请日：2006-11-27
申请人：リンテック株式会社
发明人：尚哉佐伯 , 修山崎 , 功市川 , 弘憲賤機
IPC分类号： C09J133/00 , C09J7/02 , C09J163/10 , H01L21/301 , H01L21/52
CPC分类号： H01L2224/2919 , H01L2924/01006 , H01L2924/0665 , H01L2924/12044 , H01L2924/14 , H01L2924/00 , H01L2924/3512

5. 发明专利

JP4970767B2 Conductive adhesive insulation sheet for the seat, conductive adhesive sheet, production method and a method of manufacturing electronic composite parts of the conductive adhesive sheet 有权
公开(公告)号：JP4970767B2
公开(公告)日：2012-07-11
申请号：JP2005311379
申请日：2005-10-26
申请人：リンテック株式会社
发明人：尚哉佐伯 , 正啓古館 , 修山崎 , 将人島村 , 勇司川又 , 雅子渡辺 , 武田島 , 智則篠田 , 正純雨海
IPC分类号： H01B17/56 , B32B7/02 , H01B5/14 , H01B13/00 , H01L21/60 , H01R11/01 , H05K3/32
CPC分类号： H05K3/3478 , C09J7/29 , C09J2433/00 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H05K2201/10424 , H05K2203/041 , H01L2924/00
摘要： An insulating sheet for conducting bonding sheets, which has an adhesive layer that can hold at least one layer of conducting particles, a conducting bonding sheet using such insulating sheet, and an electronic compound component using such conducting bonding sheet. Provided are the insulating sheet and the conducting bonding sheet which firmly hold the arranged conducting particles and can prevent the particles from dropping, a method for manufacturing such conducting bonding sheet, and a method for manufacturing the electronic compound component using such conducting bonding sheet.

6. 发明专利

JPWO2006118033A1 シート状アンダーフィル材および半導体装置の製造方法审中-公开
公开(公告)号：JPWO2006118033A1
公开(公告)日：2008-12-18
申请号：JP2007514624
申请日：2006-04-19
申请人：リンテック株式会社
发明人：明徳佐藤 , 明徳佐藤 , 山崎　修 , 修山崎 , 高橋　和弘 , 和弘高橋
IPC分类号： H01L21/60 , H01L23/29 , H01L23/31
CPC分类号： H01L23/293 , H01L21/563 , H01L21/6835 , H01L24/12 , H01L24/27 , H01L2224/1134 , H01L2224/131 , H01L2224/13144 , H01L2224/16 , H01L2224/274 , H01L2224/27436 , H01L2224/73104 , H01L2224/81191 , H01L2224/83191 , H01L2924/00013 , H01L2924/01004 , H01L2924/01019 , H01L2924/01025 , H01L2924/01079 , H01L2924/01322 , H01L2924/07802 , H01L2924/351 , Y10T428/2839 , H01L2924/014 , H01L2924/00014 , H01L2224/13099 , H01L2924/3512 , H01L2924/00
摘要：本発明は、バンプ(5)が形成された半導体ウエハ(6)の回路面に貼付されるシート状アンダーフィル材であって、基材(1)とその上に剥離可能に形成された接着剤層(2)とからなり、バンプ(5)が接着剤層(2)を貫通し、かつ、バンプ頂部が基材(1)内に貫入するように貼付されるものに関する。基材(1)の貯蔵弾性率が1.0×106〜4.0×109Pa、破断応力が1.0×105〜2.0×108Paであり、ヤング率が1.0×107〜1.1×1010Pa、接着剤層(2)の貯蔵弾性率が1.0×104〜1.0×107Pa、破断応力が1.0×103〜3.0×107Paである。

8. 发明专利

JP4959527B2 A method of manufacturing a semiconductor device 有权
公开(公告)号：JP4959527B2
公开(公告)日：2012-06-27
申请号：JP2007311025
申请日：2007-11-30
申请人：リンテック株式会社
发明人：修山崎 , 功市川
IPC分类号： H01L21/52
CPC分类号： H01L24/75 , H01L2224/75304 , H01L2224/83191
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that prevents the occurrence of voids in the interface between a wiring board and an adhesive layer. SOLUTION: In this method of manufacturing a semiconductor device, a chip provided with an uncured adhesive layer is die-bonded on the wiring board via the uncured adhesive layer and then the wiring board whereon the chip is die-bonded is heated to cure the uncured adhesive layer to fabricate a semiconductor device. The method of manufacturing a semiconductor device includes a holding process of holding the surface of the chip where the uncured adhesive layer is not formed by means of a collet having a recessed chip-holding surface; a die-bonding process wherein, after the outer periphery of the chip is brought into contact with the wiring board via the uncured adhesive layer, the chip is die-bonded on the wiring board so that the entire surface of the chip may be brought into contact with the wiring board via the uncured adhesive layer; and a static-pressure pressurization process wherein, before the curing of the uncured adhesive layer is finished, the wiring board with the chip die-bonded thereto is pressurized with a static pressure which is larger than the normal pressure by 0.05 MPa or above. COPYRIGHT: (C)2009,JPO&INPIT

9. 发明专利

JP4271597B2 For forming a protective film sheet for the chip 有权
公开(公告)号：JP4271597B2
公开(公告)日：2009-06-03
申请号：JP2004054354
申请日：2004-02-27
申请人：リンテック株式会社
发明人：秀男妹尾 , 修山崎 , 貴志杉野
IPC分类号： B32B7/06 , C09J4/00 , C09J7/00 , C09J133/00 , C09J163/00 , H01L21/301 , H01L21/68
CPC分类号： H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/2919 , H01L2224/83191 , H01L2924/01029 , H01L2924/181 , H01L2924/0665 , H01L2924/00 , H01L2924/3512

10. 发明专利

JP4111565B2 Electromagnetic shielding properties decorative sheet 失效
公开(公告)号：JP4111565B2
公开(公告)日：2008-07-02
申请号：JP3843297
申请日：1997-02-06
申请人：リンテック株式会社
发明人：修山崎 , 嘉之杉本 , 文明都築
IPC分类号： B32B27/00 , E04B1/92 , B32B7/02 , B32B7/12 , B32B27/18 , B32B27/30 , H05K9/00

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式