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1. 发明专利

JP2014146570A Lamp and illumination device 审中-公开
标题翻译：灯和照明装置
公开(公告)号：JP2014146570A
公开(公告)日：2014-08-14
申请号：JP2013016008
申请日：2013-01-30
申请人： Panasonic Corp , パナソニック株式会社
发明人： KAI MAKOTO , YAMASHITA MASAHITO , MATSUI NOBUYUKI
IPC分类号： F21S2/00 , F21V5/00 , F21V5/04 , F21V29/00 , F21Y101/02
摘要： PROBLEM TO BE SOLVED: To provide a lamp having long life and in which a light distribution angle can be broadened.SOLUTION: By utilizing power received from a base 30, a plurality of LED light sources 51b mounted on a mounting substrate 51a are made to emit light, and heat of each of the LED light sources 51b at the time of light emission is radiated by a heat sink 10. The heat sink 10 is arranged along a lamp axis CL which coincides with a shaft center of the base 30, and at an end part on the opposite side of the base 30, a base part 11 having a mounting surface 11a on which the mounting substrate 51a is mounted is provided. The mounting surface 11a has: a first region on which the mounting substrate 51a is mounted; and a second region around the first region. In the second region, a light diffusion lens 53 having a function of diffusing light emitted from each of the LED light sources 51b is fitted.
摘要翻译：要解决的问题：提供一种寿命长，并且可以使配光角度变宽的灯。解决方案：通过利用从基座30接收的功率，将安装在安装基板51a上的多个LED光源51b制成发光，发光时的每个LED光源51b的热量由散热器10照射。散热片10沿着与基座30的轴心重合的灯轴CL布置，并且在基座30的相反侧的端部设置有安装有安装基板51a的安装面11a的基部11。安装面11a具有：安装基板51a的第一区域; 以及围绕第一区域的第二区域。在第二区域中，装配有从每个LED光源51b发射的散射光的功能的光漫射透镜53。

2. 发明专利

JP2014146569A Lamp and illuminating device 审中-公开
标题翻译：灯和照明装置
公开(公告)号：JP2014146569A
公开(公告)日：2014-08-14
申请号：JP2013016007
申请日：2013-01-30
申请人： Panasonic Corp , パナソニック株式会社
发明人： KAI MAKOTO , YAMASHITA MASAHITO , MATSUI NOBUYUKI
IPC分类号： F21S2/00 , F21V23/00 , F21V29/00 , F21Y101/02
摘要： PROBLEM TO BE SOLVED: To make an LED lamp lightweight and to improve heat radiation.SOLUTION: A lamp has a lighting circuit unit 150 light a semiconductor light-emitting element 171 and has a heat sink 130 radiate heat of the semiconductor light-emitting element 171 when lighting. The heat sink 130 has: a cylindrical part 130a which has an internal space 130d, has a part which gradually expands an internal diameter toward one end part in a lamp shaft direction, and forms a communication passage 130c for communicating with the internal space 130d and an outside at least near the other end part of the lamp shaft; and a plurality of fins 130b radially standing around the lamp shaft from an outside surface of the cylindrical part 130a. The semiconductor light-emitting element 171 is mounted on one end part in the lamp shaft direction of the cylindrical part 130a. The lighting circuit unit 150 is housed in a case member 120 worn by the other end part in the lamp shaft direction of the cylindrical part 130a.
摘要翻译：要解决的问题：使LED灯轻便并改善散热。解决方案：灯具有点亮电路单元150，对半导体发光元件171进行点亮，并具有散热器130辐射半导体发光元件的热量照明时171。散热器130具有：具有内部空间130d的圆筒部130a，具有在灯轴方向上朝向一端部逐渐扩径的部分，形成与内部空间130d连通的连通路130c，外部至少靠近灯轴的另一端部; 以及从圆柱形部分130a的外表面径向站立在灯轴周围的多个翅片130b。半导体发光元件171安装在圆筒部130a的灯轴方向的一端部上。照明电路单元150容纳在由圆筒部130a的灯轴方向上的另一端部磨损的壳体构件120中。

3. 发明专利

JP2013026304A Insulating heat radiation substrate 审中-公开
标题翻译：绝热散热基板
公开(公告)号：JP2013026304A
公开(公告)日：2013-02-04
申请号：JP2011157454
申请日：2011-07-19
申请人： Panasonic Corp , パナソニック株式会社
发明人： TSUMURA TETSUYA , MIYOSHI NORIYUKI , MATSUI NOBUYUKI , ENDO KENJI
IPC分类号： H01L23/12 , H01L23/36
摘要： PROBLEM TO BE SOLVED: To improve a degree of adhesion of an insulating resin layer to a metal plate and thereby to improve heat radiation efficiency.SOLUTION: In order to solve the above problem, an insulating heat radiation substrate of this invention includes: a metal plate 6; an insulating resin layer 7 provided on an upper surface of the metal plate 6; and a wiring pattern 8 provided on the upper surface of the insulating resin layer 7 so as to be at least partially exposed. Taper parts 10, forming inclined planes, are respectively provided at upper parts of end surfaces 9 formed in the thickness direction at end parts of the insulating resin layer 7.
摘要翻译：要解决的问题：提高绝缘树脂层与金属板的粘合度，从而提高散热效率。解决方案：为了解决上述问题，本发明的绝热散热基板包括：金属板6; 设置在金属板6的上表面上的绝缘树脂层7; 以及设置在绝缘树脂层7的上表面上以至少部分地露出的布线图案8。在绝缘树脂层7的端部，在厚度方向上形成的端面9的上部，分别设置形成倾斜面的锥形部10。（C）2013，JPO＆INPIT

4. 发明专利

JP2012256602A Lamp 有权
标题翻译：灯
公开(公告)号：JP2012256602A
公开(公告)日：2012-12-27
申请号：JP2012171078
申请日：2012-08-01
申请人： Panasonic Corp , パナソニック株式会社
发明人： TAMURA TETSUSHI , TAKAHASHI KENJI , TOMIYOSHI YASUNARI , MATSUI NOBUYUKI , SAKUMOTO MASAYA , HASHIMOTO TOMONARI
IPC分类号： F21S2/00
CPC分类号： F21V23/006 , F21K9/23 , F21K9/65 , F21V3/02 , F21V23/02 , F21V29/70 , F21V29/85 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide a lamp that can restrain temperature rise of a circuit unit without enlarging the lamp.SOLUTION: The lamp 7 includes a light-emitting module 24 wherein LEDs 74 are mounted on a board 72, a cylindrical heat sink 46 for radiating heat in light-emitting the LEDs 74, a base 20 arranged at one end side of the heat sink 46, a mounting member 44 for mounting the light-emitting module 24 on the surface, and a circuit unit 26 stored in the heat sink 46 and receiving power through the base 20 and light-emitting the LEDs 74. Heat at light-emission is transmitted to the heat sink 46 by making the mounting member 44 and the heat sink 46 come in touch with each other. The circuit unit 26 is made of a circuit board 110, a plurality of electronic components 112, 114, and 116 mounted on the circuit board 110. At least one electronic component 116 among the plurality of electronic components is thermally jointed with the mounting member 44 via thermally conductive members 154, 156.
摘要翻译：要解决的问题：提供一种能够在不放大灯的情况下抑制电路单元的温度上升的灯。解决方案：灯7包括其中LED 74安装在板72上的发光模块24，用于在发光LED 74中散热的圆柱形散热器46，布置在LED 74的一端侧的基座20 散热器46，用于将发光模块24安装在表面上的安装构件44和存储在散热器46中的电路单元26，并且通过基座20接收电力并发光LED74。通过使安装构件44和散热片46彼此接触而将发射传递到散热器46。电路单元26由电路板110，安装在电路板110上的多个电子部件112,114和116组成。多个电子部件中的至少一个电子部件116与安装部件44热接合通过导热构件154,156。（C）2013，JPO和INPIT

5. 发明专利

JP2009252933A Circuit module and manufacturing method thereof 审中-公开
标题翻译：电路模块及其制造方法
公开(公告)号：JP2009252933A
公开(公告)日：2009-10-29
申请号：JP2008097925
申请日：2008-04-04
申请人： Panasonic Corp , パナソニック株式会社
发明人： NAKAGAWA MASARU , MATSUI NOBUYUKI
IPC分类号： H05K1/14 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To solve the problem wherein a soldered section in a circuit board of a lower layer redissolves as shown by a dotted line to possibly cause solder floating and solder cracks in the soldering and fixing of the circuit board onto a conventional thermal dissipation substrate in the conventional thermal dissipation substrate.
SOLUTION: A circuit module 108 includes: the thermal dispersion substrate 117 having a metal plate 109, a sheet-like heat transfer layer 110, a lead frame 119, and connection terminals 111a, 111b; a first circuit board 112 installed on the thermal dispersion substrate 117 nearly in parallel; and a second circuit board 113 installed between the thermal dispersion substrate 117 and the first circuit board 112. In the circuit module 108, the first circuit board 112 is connected to the second one 113 by a connection terminal 101 between substrates having a tool attachment section 106, thus miniaturizing the circuit module 108, and improving reliability.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题为了解决下面的电路板中的焊接部分如虚线所示再次溶解的问题，可能导致焊料漂浮，并且将电路板的焊接和固定到常规散热基板中常规的散热基板。解决方案：电路模块108包括：具有金属板109，片状传热层110，引线框架119和连接端子111a，111b的散热基板117; 几乎平行地安装在散热基板117上的第一电路板112; 以及安装在热分散基板117和第一电路板112之间的第二电路板113.在电路模块108中，第一电路板112通过连接端子101连接到第二电路板113，基板之间具有工具附接部分 106，从而使电路模块108小型化，并提高可靠性。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2009252931A Circuit module and manufacturing method thereof 审中-公开
标题翻译：电路模块及其制造方法
公开(公告)号：JP2009252931A
公开(公告)日：2009-10-29
申请号：JP2008097923
申请日：2008-04-04
申请人： Panasonic Corp , パナソニック株式会社
发明人： NAKAGAWA MASARU , MATSUI NOBUYUKI
IPC分类号： H05K1/14
摘要： PROBLEM TO BE SOLVED: To solve the problem wherein a soldered section in a circuit board of a lower layer redissolves to possibly cause solder floating and solder cracks in the soldering of the circuit board of an upper layer in a conventional thermal dissipation substrate. SOLUTION: A circuit module 102 includes: the thermal dispersion substrate 113 having a metal plate 103, a sheet-like heat transfer layer 104, a lead frame 116, and connection terminals 105a, 105b; a first circuit board 106 installed on the thermal dispersion substrate 113 nearly in parallel; and a second circuit board 107 installed between the thermal dispersion substrate 113 and the first circuit board 106. In the circuit module 102, the first circuit board 106 is connected to the second one 107 by a connection terminal 109 between substrates having a heat radiation structure section 119, thus preventing lead-free solder 108 for fixing a portion between the second circuit board 107 and the connection terminal 109 between substrates from being redissolved by the soldering heat of the first circuit board 106 and hence miniaturizing the circuit module 102 and improving reliability. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了解决在传统的散热基板中，下层的电路板中的焊接部分重新溶解以可能导致焊料漂浮和上层电路板的焊接中的焊料裂纹的问题。电路模块102包括：具有金属板103的热分散基板113，片状传热层104，引线框架116和连接端子105a，105b; 几乎并联安装在散热基板113上的第一电路板106; 以及安装在热分散基板113和第一电路板106之间的第二电路板107.在电路模块102中，第一电路板106通过连接端子109连接到第二电路板107，基板之间具有散热结构从而防止无铅焊料108固定在第二电路板107与基板之间的连接端子109之间的部分被第一电路板106的焊接热量重新溶解，从而使电路模块102小型化并提高了可靠性。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2014205427A 照明システム有权
标题翻译：照明系统
公开(公告)号：JP2014205427A
公开(公告)日：2014-10-30
申请号：JP2013084264
申请日：2013-04-12
申请人：パナソニック株式会社 , Panasonic Corp
发明人： NISHIMURA TADASHI , TATENO YOJI , MOTOIE ATSUSHI , OTA TAKASHI , KIDO HIROSHI , HASEGAWA JUNICHI , GOSHIMA SHIGEO , MATSUI NOBUYUKI , MURAKAMI TADASHI
IPC分类号： B64D11/00
CPC分类号： B64D11/00 , B64D2011/0038 , B64D2203/00 , Y02T50/46
摘要：【課題】航空機のキャビン内の天井を照明する照明システムにおいて、少ない数の照明装置でキャビン内を効果的に照明し、且つ航空機の総重量を軽量化して航空機の燃費向上に寄与する。【解決手段】照明システム1は、通路Pの一側に沿って設けられた照明装置4と、通路Pの他側に沿って設けられ照明装置4から出射された光を照明装置4の方に反射する鏡面反射板5と、を備える。この構成によれば、一側の照明装置4だけで照明装置4を設けた側も照明することができるので、通路Pの両側に照明装置を設けた場合に比べて、少ない数の照明装置4でキャビン内を効果的に照明することができる。また、照明装置4の数を減らすことができるので、航空機APの総重量を軽量化して航空機APの燃費向上に寄与することができる。【選択図】図1
摘要翻译：要解决的问题：提供一种照明系统，用于照射飞机的舱内的天花板，该天花板用较少数量的照明装置有效地照亮舱室，并且有助于通过减少飞机的总重量来改善飞机的燃料经济性飞机。解决方案：照明系统1包括：沿通道P的一侧设置的照明装置4; 以及沿着通道P的另一侧设置的镜面反射板5，并且将从照明装置4发射的光反射到照明装置4侧。在这种结构中，仅一侧的照明装置4也可以照亮设置有照明装置4的一侧。因此，与在通道2的两侧设置照明装置的情况相比，能够以较少数量的照明装置4有效地照明驾驶室。而且，随着照明装置4的数量的减少，照明系统可以通过减少飞机AP的总重量来促进飞机AP的燃料经济性的改善。

8. 发明专利

JP2014146575A Lamp, method of manufacturing lamp and illumination device 审中-公开
标题翻译：灯，制造灯和照明装置的方法
公开(公告)号：JP2014146575A
公开(公告)日：2014-08-14
申请号：JP2013016013
申请日：2013-01-30
申请人： Panasonic Corp , パナソニック株式会社
发明人： YAMASHITA MASAHITO , KAI MAKOTO , MATSUI NOBUYUKI
IPC分类号： F21S2/00 , F21V19/00 , F21V23/00 , F21V29/00 , F21Y101/02
摘要： PROBLEM TO BE SOLVED: To provide an LED lamp which has a small number of components and which can be assembled easily, and a method of manufacturing the LED lamp.SOLUTION: A lamp includes: a semiconductor light-emitting element 171; a lighting circuit unit 150 for driving the semiconductor light-emitting element 171; and a housing 130. The housing 130 has: a heat sink part 131 in which the semiconductor light-emitting element 171 is mounted on one end part in a lamp axis direction, and which radiates heat of the semiconductor light-emitting element 171 at the time of lighting; and a case part 135 which is integrally molded with the heat sink part 131 and made of a resin material for accommodating the lighting circuit unit, on the other end part in the lamp axis direction of the heat sink part 131. The heat sink part 131 includes a body of a fin structure, and has a cavity in which the lighting circuit unit 150 can be inserted along the lamp axis direction in the body.
摘要翻译：要解决的问题：提供一种具有少量部件并且易于组装的LED灯，以及制造该LED灯的方法。一种灯包括：半导体发光元件171; 用于驱动半导体发光元件171的点亮电路单元150; 壳体130具有：散热部131，其中半导体发光元件171沿灯轴方向安装在一个端部，并且在半导体发光元件171的散热部131中散热半导体发光元件171的热量照明时间; 以及在散热部131的灯轴方向的另一端部上与散热部131一体成型并由用于容纳点灯电路单元的树脂材料制成的壳体部135.散热部131 包括翅片结构体，并且具有空腔，照明电路单元150可以沿着灯轴方向在身体中插入。

9. 发明专利

JP2014146573A Lamp and illuminating device 审中-公开
标题翻译：灯和照明装置
公开(公告)号：JP2014146573A
公开(公告)日：2014-08-14
申请号：JP2013016011
申请日：2013-01-30
申请人： Panasonic Corp , パナソニック株式会社
发明人： YAMASHITA MASAHITO , KAI MAKOTO , MATSUI NOBUYUKI
IPC分类号： F21S2/00 , F21V29/00 , F21Y101/02
摘要： PROBLEM TO BE SOLVED: To suppress that a lighting circuit unit is in a high temperature state.SOLUTION: A heat sink 10 for radiating heat of an LED is provided with a mounting section 17 for mounting an LED at one end part of a lamp shaft CL direction, and a plurality of fins 12 extend toward the other end part in the lamp shaft direction from the mounting section 17. Each of the fins 12 is separated from the lamp shaft CL and placed radially with respect to the lamp shaft CL. At the other end part in the lamp shaft direction in the heat sink 10, a circuit case 21 housing a lighting circuit unit 60 is attached. On the side of the mounting section 17 with respect to the circuit case 21, a part of each of the fins 12 is placed in the state that a space is formed between the part of the fin and the circuit case 12.
摘要翻译：要解决的问题：抑制照明电路单元处于高温状态。解决方案：用于辐射LED的散热器10设置有用于在灯轴的一个端部处安装LED的安装部17 CL方向，并且多个翅片12从安装部17朝向灯轴方向的另一端部延伸。各散热片12与灯轴CL分离，并相对于灯轴CL径向放置。在散热片10的灯轴方向的另一端部，安装有照明电路单元60的电路壳体21。在安装部分17相对于电路壳体21的一侧，每个散热片12的一部分被放置在翅片的一部分与电路壳体12之间形成空间的状态。

10. 发明专利

JP2014146568A Lamp and illumination device 审中-公开
标题翻译：灯和照明装置
公开(公告)号：JP2014146568A
公开(公告)日：2014-08-14
申请号：JP2013016006
申请日：2013-01-30
申请人： Panasonic Corp , パナソニック株式会社
发明人： KAI MAKOTO , YAMASHITA MASAHITO , MATSUI NOBUYUKI
IPC分类号： F21S2/00 , F21V29/00 , F21Y101/02
CPC分类号： F21V29/83 , F21K9/23 , F21V3/00 , F21V23/002 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide a lamp including a prompt heat reducing property from an LED module and a sufficient heat radiation property, and also, capable of suppressing a heat load of a lighting circuit unit due to the heat from the LED, and an illumination device using the lamp.SOLUTION: A lamp has a configuration in which a semiconductor light-emitting element 171 is lit by a lighting circuit unit 150, and heat of the semiconductor light-emitting element 171 at the time of lighting is radiated by a heat sink 130. The heat sink 130 has: a cylinder part 131 having internal space 133; and a plurality of fins 132 erected radially from an outer peripheral surface 131d of the cylinder part 131 with a cylindrical axis X being the center. The lighting circuit unit 150 is arranged on one end side in the cylindrical axis X direction, and the semiconductor light-emitting element 171 is arranged on the other end side in the cylindrical axis X direction. At an end part of the one end side of the cylinder part 131, a communication passage 131c is formed for communicating the internal space 133 of the cylinder part 131 and an outside part, and at an end part of the other end side of the cylinder part 131, the communication passage 131c is not formed.
摘要翻译：要解决的问题：提供一种包括来自LED模块的快速减热性能和足够的散热性的灯，并且还能够抑制由于来自LED的热量引起的点亮电路单元的热负荷，并且使用该灯的照明装置。解决方案：一种灯具具有通过点亮电路单元150点燃半导体发光元件171的结构，并且在照明时将半导体发光元件171的热辐射为散热器130具有：具有内部空间133的圆筒部131; 以从圆筒部131的外周面131d径向突出的多个翅片132以圆筒轴X为中心。照明电路单元150配置在圆筒轴X方向的一端侧，半导体发光元件171配置在圆筒轴X方向的另一端侧。在圆筒部131的一端侧的端部，形成有连通通路131c，用于使筒部131的内部空间133与外部部分连通，并且在筒体的另一端侧的端部部分131，没有形成连通通道131c。

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