专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP4765226B2 Fingerprint detection device and a method of manufacturing the same 有权
公开(公告)号：JP4765226B2
公开(公告)日：2011-09-07
申请号：JP2001249294
申请日：2001-08-20
申请人：ソニー株式会社
发明人：清一宮井 , 修一岡
IPC分类号： A61B5/117 , G01B7/00 , C23C16/27 , G06T1/00
摘要： PROBLEM TO BE SOLVED: To reduce stresses applied to a protective film and to prevent stress migration, etc., of a wiring material in a semiconductor chip compared with conventional examples. SOLUTION: A fingerprint detection device is provided with a fingerprint sensor chip 10 and a carbon-based protective film 14 provided on the outermost surface of the chip 10. A diamond-like carbon is used for the protective film 14, and this carbon is formed at a film forming temperature of 200-450 deg.C. By this configuration, the stress applied to the carbon can be reduced compared with a protective film formed at not more than 200 deg.C. Also, since the upper limit of the film forming temperature is set at 450 deg.C, breakage of an aluminum wiring material, etc., due to the stress migration in the chip 10 can be suppressed, and peeling off of the film itself can be prevented.

3. 发明专利

JP3781141B2 Method of forming the hard carbon film 失效
公开(公告)号：JP3781141B2
公开(公告)日：2006-05-31
申请号：JP35070796
申请日：1996-12-27
申请人：ソニー株式会社
发明人：俊二天野 , 清一宮井 , 敦道川島 , 禎治本庄 , 弘志林
IPC分类号： C01B31/06 , C30B29/04 , C23C16/26 , C23C16/27 , C23C16/50 , G11B5/72 , G11B5/84

4. 发明专利

JP4244470B2 Non-contact type ic label and a method of manufacturing the same 有权
标题翻译：空值
公开(公告)号：JP4244470B2
公开(公告)日：2009-03-25
申请号：JP30456999
申请日：1999-10-26
申请人：ソニー株式会社
发明人：清一宮井 , 英雄山中
IPC分类号： G06K19/077 , B42D15/10 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To provide a non-contact type IC label and production thereof with which environment resistance characteristics are improved without generating any trouble in the display of recorded or reproduced contents. SOLUTION: A non-contact type IC label 1 is provided with an antenna substrate 3 having an IC 2 and a label 4 of paper, etc., on a substrate 5 such as PET film the antenna substrate 3 has a protecting layer 6 covering the entire surface of the antenna substrate 3 packaging the IC 2 at least, the antenna substrate 3 is provided while being placed on a first main surface 8 of the substrate 5 having a window 7 so as to insert the IC 2 from the side of surface packaging the IC 2 to the window 7, the label 4 is provided through a first adhesive layer 9 on the first main surface 8 and the surface of the antenna substrate 3 opposite to the surface packaging the IC 2, and a second adhesive layer 11 is provided on a second main surface 10 of the substrate 5.
摘要翻译：要解决的问题：提供一种非接触型IC标签及其制造，其环境特性得到改善，而不会在显示记录或再现的内容中产生任何麻烦。解决方案：非接触型IC标签1在PET膜等基板5上设置有具有IC2和纸张标签4等的天线基板3，天线基板3具有覆盖该保护层6的保护层6 天线基板3的整个表面至少包装IC2，天线基板3被设置在同时放置在具有窗口7的基板5的第一主表面8上，以便从表面封装的侧面插入IC2 IC2到窗口7，标签4通过第一主表面8上的第一粘合剂层9和与包装IC2的表面相对的天线基板3的表面提供，并且提供第二粘合剂层11 在基板5的第二主表面10上。

5. 发明专利

JP4552067B2 Adhesive tape and a method for manufacturing the electronic equipment 有权
公开(公告)号：JP4552067B2
公开(公告)日：2010-09-29
申请号：JP2004372127
申请日：2004-12-22
申请人：ソニー株式会社 , 独立行政法人産業技術総合研究所
发明人：芳規伊藤 , 義寛加藤 , 清一宮井 , 薫小林 , 克巳岡山 , 純明渡
IPC分类号： B32B9/00 , B05D5/12 , B05D7/24 , B32B5/16 , B32B27/00 , C09J7/02 , C23C24/04 , H05K9/00

6. 发明专利

JP4075481B2 Metal - graphite sheet complex and electronic equipment 有权
公开(公告)号：JP4075481B2
公开(公告)日：2008-04-16
申请号：JP2002180190
申请日：2002-06-20
申请人：ソニー株式会社
发明人：清一宮井 , 薫小林 , 克巳岡山 , 正樹折橋
IPC分类号： C01B31/04 , H05K7/20 , H05K9/00

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式