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1. 发明专利

JP2017088967A 三次元造形物の製造方法审中-公开
公开(公告)号：JP2017088967A
公开(公告)日：2017-05-25
申请号：JP2015222156
申请日：2015-11-12
申请人：セイコーエプソン株式会社 , Seiko Epson Corp
发明人： OKAMOTO EIJI , ISHIDA MASAYA , TOKUSHIMA HIROKI , HIRAI TOSHIMITSU
IPC分类号： B22F3/16 , B22F3/105 , B29C67/00 , B33Y10/00 , B33Y70/00
CPC分类号： B29C67/0059 , B22F3/008 , B29C64/112 , B29C64/124 , B29C64/165 , B29C64/386 , B29C64/40 , B29K2505/00 , B33Y10/00
摘要：【課題】迅速に高精度な三次元造形物を製造する。【解決手段】層を積層し積層体を形成することにより三次元造形物を製造する三次元造形物の製造方法であって、三次元造形物の構成領域に対応する構成層310を形成する構成層形成工程と、構成層310に接し該構成層310を支持する支持層300を、樹脂を含む流動性組成物を液滴の状態で吐出部から吐出させて形成する支持層形成工程と、支持層300を固める固化工程と、構成層形成工程、支持層形成工程及び固化工程により形成した積層体を加熱する加熱工程と、を有することを特徴とする三次元造形物の製造方法。【選択図】図11

2. 发明专利

JP2014141066A Recording device, winding device and method for winding recording medium 有权
标题翻译：记录装置，卷绕装置和用于卷绕记录介质的方法
公开(公告)号：JP2014141066A
公开(公告)日：2014-08-07
申请号：JP2013184750
申请日：2013-09-06
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： KANEDA HIDEMASA , MIHASHI MASAHITO , HIGUCHI KOJI , HIRAI TOSHIMITSU , ISOBE MITSUHIRO
IPC分类号： B41J15/16 , B41J15/08 , B65H18/12 , B65H19/22
CPC分类号： B41J15/04 , B41J3/4078 , B41J13/0009 , B41J15/02 , B41J15/048 , B41J15/165 , B41J25/001 , B65H19/2215 , B65H2301/46011 , B65H2404/20 , B65H2404/62 , B65H2408/23152 , B65H2515/31 , B65H2801/36 , B65H2220/03
摘要： PROBLEM TO BE SOLVED: To suppress deterioration in image quality of a recording image in a recording device including a turret in which multiple winding shafts for winding a recording medium are provided and performing recording by reciprocating scanning of a recording head.SOLUTION: The recording device includes: a conveying mechanism 40 capable of performing intermittent conveying of a recording medium P; a recording mechanism 3 for performing recording by reciprocating scanning of a recording head 7 in a direction B crossing a conveying direction A of the recording medium P by the conveying mechanism 40; a turret 12 in which multiple winding shafts 14, 15 for winding the recording medium P are provided; a rotation mechanism for the winding shafts 14, 15; a rotation mechanism for the turret 12; a control unit for controlling the rotation mechanism for the winding shafts 14, 15 and the rotation mechanism for the turret 12 so that at least one of the winding shafts 14, 15 and the turret 12 is rotated intermittently corresponding to the intermittent conveying by the conveying mechanism 40.
摘要翻译：要解决的问题：为了抑制包括设置有用于卷绕记录介质的多个卷绕轴的转台的记录装置中的记录图像的图像质量的劣化，并且通过记录头的往复扫描执行记录。解决方案：记录装置包括：能够执行间歇地传送记录介质P的输送机构40; 用于通过传送机构40在与记录介质P的传送方向A相交的方向B上往往扫描记录头7进行记录的记录机构3; 提供用于卷绕记录介质P的多个卷绕轴14,15的转台12; 用于卷绕轴14,15的旋转机构; 用于转台12的旋转机构; 用于控制卷绕轴14,15的旋转机构的控制单元和用于转台12的旋转机构，使得至少一个卷绕轴14,15和转台12相对于通过传送的间歇传送而间歇地旋转机构40。

3. 发明专利

JP2014131879A Molding method 有权
标题翻译：成型方法
公开(公告)号：JP2014131879A
公开(公告)日：2014-07-17
申请号：JP2014084498
申请日：2014-04-16
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： HIRAI TOSHIMITSU , OKAMOTO EIJI , ISHIDA KOHEI
IPC分类号： B29C67/00
摘要： PROBLEM TO BE SOLVED: To provide a molding method for forming a molded article by removing unbound parts from layers having bound parts where granules are bound through a binder while suppressing protruding parts from being deformed.SOLUTION: There is provided a molding method for molding a molded article in which bound parts 22a, 22b, 22c, 22d, 22e are laminated by applying a removing step to a laminate after forming the laminate in which layers containing the bound parts 22a, 22b, 22c, 22d, 22e are laminated by alternately repeating a layer forming step and a binding step. The bound parts 22b, 22d are protruded from above the bound parts 22a, 22c, a slurry layer including the bound parts 22a, 22c is formed by using a first slurry, and a slurry layer containing the bound parts 22b, 22d, 22e is formed by using a second slurry whose solubility in a dissolving liquid is higher than that of the first slurry.
摘要翻译：要解决的问题：提供一种通过从抑制突出部分变形的同时通过粘合剂将颗粒结合的结合部分的层从未结合部分除去而形成成型体的成型方法。解决方案提供了一种成型方法，通过在形成层叠体之后，通过在其中层叠包含结合部分22a，22b，22c，22d，22e的层交替重复的层压体，通过在层压体上施加去除步骤来层压结合部分22a，22b，22c，22d，22e的模塑制品层形成步骤和结合步骤。结合部22b，22d从结合部22a，22c的上方突出，通过使用第一浆料形成包含结合部22a，22c的浆料层，形成含有结合部22b，22d，22e的浆料层通过使用在溶解液中的溶解度高于第一浆料的溶解度的第二浆料。

4. 发明专利

JP2014094490A Liquid discharge device and tool for three-dimensionally-shaped printing object 有权
标题翻译：三维打印对象的液体放电装置和工具
公开(公告)号：JP2014094490A
公开(公告)日：2014-05-22
申请号：JP2012246597
申请日：2012-11-08
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： TOGAWA HIROKI , HIRAI TOSHIMITSU , ISOBE MITSUHIRO
IPC分类号： B41J2/01
摘要： PROBLEM TO BE SOLVED: To improve convenience of a user.SOLUTION: A liquid discharge device has: a head for discharging liquid to the front face and the side face of a three-dimensionally-shaped printing object having the front face and the side face; and a rotary member which supports the three-dimensionally-shaped printing object, and which is rotated in the state where one face between the front face and the side face faces to the head, thereby to allow the other face to face to the head.
摘要翻译：要解决的问题：为了提高用户的便利性。液体排出装置具有：用于将液体排出到具有正面和侧面的三维形状的印刷对象物的正面和侧面的头部 ; 以及旋转构件，其支撑三维形状的打印对象，并且在前表面和侧面之间的一个面朝向头部的状态下旋转，从而允许另一面朝向头部。

5. 发明专利

JP2014040058A Virtual image appearing decorative body, method for manufacturing virtual image appearing decorative body 审中-公开
标题翻译：虚拟图像装饰装饰品，制造虚拟图像装饰装饰品的方法
公开(公告)号：JP2014040058A
公开(公告)日：2014-03-06
申请号：JP2012183896
申请日：2012-08-23
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： TAKANO YASUSHI , HIRAI TOSHIMITSU
IPC分类号： B44F1/04
CPC分类号： G02B3/0012 , G02B3/0056 , G09F19/12
摘要： PROBLEM TO BE SOLVED: To provide a virtual image appearing decorative body capable of adjusting density or the like of a virtual image to be appeared in the virtual image appearing decorative body, and to provide a method for manufacturing the virtual image appearing decorative body.SOLUTION: A virtual image appearing decorative body comprises: a unit aggregation comprising pixel units; and a condensation element aggregation comprising a plurality of condensation elements where the condensation elements are disposed at positions associated with the pixel units. One arrangement pitch of the pixel units or the condensation elements comprise an arrangement pitch having a value of integral multiples more than 2 of a value obtained by adding predetermined difference to a value of the other arrangement pitch.
摘要翻译：要解决的问题：提供一种能够调整出现在虚拟图像出现的装饰体中的虚拟图像的密度等的虚拟图像出现装饰体，并且提供一种制造出虚拟图像出现的装饰物体的方法。：虚拟图像出现的装饰体包括：包括像素单元的单元聚合; 以及包括多个冷凝元件的冷凝元件聚集体，其中所述冷凝元件设置在与所述像素单元相关联的位置处。像素单元或缩合元件的一个排列间距包括具有通过将预定差加到另一布置间距的值而获得的值的大于2的整数倍的值的排列间距。

6. 发明专利

JP2013091198A Method for manufacturing virtual image emerging ornamental structure, and virtual image emerging ornamental structure 有权
标题翻译：虚拟图像初始化结构的制作方法及虚拟图像新生代结构
公开(公告)号：JP2013091198A
公开(公告)日：2013-05-16
申请号：JP2011233665
申请日：2011-10-25
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： OKAMOTO EIJI , HIRAI TOSHIMITSU
IPC分类号： B44F1/04 , G02B3/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a virtual image emerging ornamental structure configured to adjust gray levels of a virtual image to be revealed in an image display area of a virtual image emerging ornamental structure, and the virtual image emerging ornamental structure.SOLUTION: A virtual image emerging ornamental structure comprises an image display part which includes: a unit assembly formed by regularly arranging pixel units in a two-dimensional manner; and a lens assembly formed by arranging each lens body of a plurality of lens bodies at a position associated with the position of the pixel unit. The pixel unit includes a pixel dot arranged in a predetermined positional relationship. The method of manufacturing the virtual image emerging ornamental structure has a correction step of correcting the total number of pixel dots in the unit assembly close to the total number of the pixel dots in a reference unit assembly which is a unit assembly as a reference.
摘要翻译：要解决的问题：提供一种用于制造虚拟图像出现的装饰结构的方法，其被配置为调整要在虚拟图像出现的装饰结构的图像显示区域中显示的虚拟图像的灰度级，并且虚拟图像出现装饰结构。解决方案：一种虚拟图像出现的装饰结构包括图像显示部分，其包括：通过以二维方式规则地排列像素单元而形成的单元组件; 以及透镜组件，其通过将多个透镜体的每个透镜体布置在与像素单元的位置相关联的位置处而形成。像素单元包括以预定位置关系布置的像素点。制造虚拟图像出现的装饰结构的方法具有校正步骤，该单元组件中的像素点的总数接近作为单元组件的参考单元组件中的像素点的总数作为参考。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2011197516A Method of bonding substrates and method of forming sealing film 审中-公开
标题翻译：粘结基材的方法和形成密封膜的方法
公开(公告)号：JP2011197516A
公开(公告)日：2011-10-06
申请号：JP2010065863
申请日：2010-03-23
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： HIRAI TOSHIMITSU
IPC分类号： G02F1/1339
摘要： PROBLEM TO BE SOLVED: To provide methods of bonding substrates and of forming a sealing film, capable of achieving a sufficient contact width for reliably performing sealing and securing bonding strength between substrates.SOLUTION: The method of bonding substrates is the method of bonding them through a bonding film and includes: a first bonding film layer drawing step of impacting liquid droplets containing the material of the bonding film in a fist impact specified section comprising a plurality of impact point sections and drawing a first bonding film layer extending in the first direction on one substrate; and a second bonding film layer drawing step of impacting the liquid droplets containing the material of the bonding film in a second impact specified section comprising the plurality of impact point sections and drawing a second bonding film layer extending in the first direction superimposed on the first bonding film layer. The width of the second direction crossing the first direction of the first impact specified section is wider than the width of the second direction of the second impact specified section.
摘要翻译：要解决的问题：提供接合基板和形成密封膜的方法，其能够实现足够的接触宽度以可靠地进行密封并确保基板之间的接合强度。解决方案：接合基板的方法是通过一种接合膜，包括：第一接合膜层拉伸步骤，在包含多个冲击点部分的第一冲击指定部分中冲击含有接合膜材料的液滴，并且将沿第一方向延伸的第一接合膜层拉到一个底物; 以及第二接合膜层拉伸步骤，在包括所述多个冲击点部分的第二冲击指定部分中冲击含有所述接合膜材料的液滴，并且拉伸在所述第一方向上延伸的第二接合膜层，所述第二接合膜层叠加在所述第一接合电影层。与第一冲击指定部分的第一方向交叉的第二方向的宽度比第二冲击指定部分的第二方向的宽度宽。

8. 发明专利

JP2011091237A Method of manufacturing circuit board, touch panel, electro-optical apparatus, and electronic apparatus 审中-公开
标题翻译：制造电路板，触控面板，电光设备和电子设备的方法
公开(公告)号：JP2011091237A
公开(公告)日：2011-05-06
申请号：JP2009244207
申请日：2009-10-23
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ISHIDA KOHEI , HIRAI TOSHIMITSU
IPC分类号： H05K3/46 , G06F3/041 , G06F3/044
摘要： PROBLEM TO BE SOLVED: To prevent bleeding-up of an insulating film inducing a conductive failure of bridge wirings mutually intersecting to wire over the insulating film via the insulating film. SOLUTION: A method of manufacturing a circuit board including a plurality of mutually intersecting wirings, and the insulating film formed between the wirings at an intersecting part of the plurality of wirings, includes the board wiring forming step, the insulating film forming step of forming the insulating film, and the bridge wiring forming step of forming the bridge wiring intersecting with the board wiring on a surface of the insulating film. The insulating film forming step includes the droplet ejecting step of ejecting a functional liquid that contains the material of the insulating film as droplets. The functional liquid contains a leveling agent. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了防止绝缘膜的渗出，导致通过绝缘膜在绝缘膜上引起与线相互相交的桥接线的导电故障。解决方案：一种制造包括多个相互交叉的配线的电路板的方法，以及在所述多条配线的交叉部分处的布线之间形成的绝缘膜包括所述板布线形成步骤，所述绝缘膜形成步骤以及在绝缘膜的表面上形成与基板布线交叉的桥接布线的桥接布线形成步骤。绝缘膜形成步骤包括将包含绝缘膜的材料的功能液喷射为液滴的液滴喷射步骤。功能性液体含有流平剂。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2011082263A Method for bonding substrate, and bonded substrate 审中-公开
标题翻译：用于粘结基板和粘结基板的方法
公开(公告)号：JP2011082263A
公开(公告)日：2011-04-21
申请号：JP2009231688
申请日：2009-10-05
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： HIRAI TOSHIMITSU , TAKANO YASUSHI , SAITO HIROMI
IPC分类号： H01L21/02 , H01L23/10
摘要： PROBLEM TO BE SOLVED: To provide a method for bonding a substrate, capable of selectively and surely bonding only a specific region of a substrate without a gap, wherein a material of the substrate is not limited.
SOLUTION: Surface tension in a coated film formed by jetting a resin solution can be controlled by allowing the resin solution to contain a leveling agent. Since, for example, in a coated film 41 formed of a resin solution containing a leveling agent, surface tension generated through jetting of the resin solution is regulated by the leveling agent, generation of a crater resulting from edge line forming caused by evaporation of solvent or the like (coffee-stain effect) in a fringe portion and surface unevenness are prevented.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够选择性且可靠地仅接合基板的特定区域而没有间隙地接合基板的方法，其中基板的材料不受限制。解决方案：可以通过使树脂溶液含有流平剂来控制通过喷射树脂溶液形成的涂膜中的表面张力。由于例如在由含有流平剂的树脂溶液形成的涂膜41中，由流平剂调节由树脂溶液喷射产生的表面张力，由溶剂蒸发引起的边缘线形成引起的火山口的产生等等（咖啡污渍效应）和表面凹凸。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2011077530A Thin-film pattern substrate, electro-optical device and electronic apparatus 审中-公开
标题翻译：薄膜图案，电光器件和电子设备
公开(公告)号：JP2011077530A
公开(公告)日：2011-04-14
申请号：JP2010248796
申请日：2010-11-05
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： SAKAI MARI , HIRAI TOSHIMITSU
IPC分类号： H05K3/10 , G02F1/1343 , G09F9/30 , H05K3/24 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide a thin-film pattern forming substrate on which a fine linear thin-film fine pattern are formed accurately and stably, and to provide a method of forming a device, an electro-optical device and an electronic apparatus. SOLUTION: A substrate P has the thin-film pattern formed on the surface of the substrate, and the substrate P has a liquid pouring portion A2 which is to be poured with a functional liquid L, and a liquid-flowing portion A1 disposed while being connected to flow the functional liquid L. In the line widths of the liquid-pouring portion A2 and the liquid-flowing portion A1, the line width d of the liquid-pouring portion A2 is less than twice the line width b of the liquid-flowing portion A1 and larger than the diameter of the functional liquid L. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供精细稳定地形成精细线性薄膜精细图案的薄膜图案形成基板，并且提供一种形成器件的方法，电光器件和电子仪器解决方案：基板P具有形成在基板表面上的薄膜图案，基板P具有要与功能液L一起注入的液体倾倒部分A2和液体流动部分A1 在液体注入部A2和液体流通部A1的线宽度中，液体注入部A2的线宽d小于液体注入部A2的线宽b的两倍液体流通部分A1并且大于功能液体L的直径。版权所有：（C）2011，JPO＆INPIT

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