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1. 发明专利

JP2012089466A Illumination device 有权
标题翻译：照明装置
公开(公告)号：JP2012089466A
公开(公告)日：2012-05-10
申请号：JP2011020995
申请日：2011-02-02
申请人： Suzuden Hanbai Co Ltd , Suzuden:Kk , 株式会社スズデン , 株式会社スズデン販売
发明人： KOBAYASHI SHINOBU , KAWASHIMA HIROAKI
IPC分类号： F21S4/00 , F21S2/00 , F21V31/00 , F21Y101/02 , H01L33/56 , H01L33/58
CPC分类号： F21S4/001 , F21S4/10 , F21V3/04 , F21V29/70 , F21V29/86 , F21V31/04 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide an illumination device having a light-emitting diode as a light source, which has light diffusion characteristics and heat dissipation characteristics, is superior in waterproof characteristics, durability, and impact resistance, capable of soft light irradiation without local glare or the like, and useful as a light guide lamp as well as a garden light.SOLUTION: As for the illumination device, a power feeding wire 5 is connected to a substrate 3 on which the light-emitting diode 2 is mounted, the substrate 3 including a connecting part to this power feeding wire 5 is enclosed by silicon resin 6 in which light diffusive particulates for scattering irradiation light from the light-emitting diode 2 is mixed, and furthermore, an outer peripheral part of this silicon resin 6 and an insulation-covered object 7 of the power feeding wire 5 in the vicinity site of the synthetic resin are molded by transparent acrylic resin 8.
摘要翻译：解决问题：为了提供一种具有光散射特性和散热特性的发光二极管作为光源的照明装置，具有优异的防水特性，耐久性和抗冲击性，能够实现柔光没有本地眩光等的照射，并且可用作导光灯以及花园灯。解决方案：对于照明装置，馈电线5连接到其上安装有发光二极管2的基板3，包括与该馈电线5的连接部分的基板3被硅包围将来自发光二极管2的用于散射照射光的光漫射粒子混合的树脂6，此外，该硅树脂6的外周部分和供电线5的绝缘被覆盖物7在附近的位置合成树脂由透明丙烯酸树脂8成型。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2011249249A Lighting device, and method of manufacturing lighting device 有权
标题翻译：照明装置及制造照明装置的方法
公开(公告)号：JP2011249249A
公开(公告)日：2011-12-08
申请号：JP2010123591
申请日：2010-05-28
申请人： Suzuden Hanbai Co Ltd , Suzuden:Kk , 株式会社スズデン , 株式会社スズデン販売
发明人： KOBAYASHI SHINOBU , KAWASHIMA HIROAKI
IPC分类号： F21S8/04 , F21Y101/02
CPC分类号： F21V3/0445 , F21S8/04 , F21S8/061 , F21V21/03 , F21V31/04 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide lighting devices of various shapes excellent in directivity and diffusivity of light, as well as durability and shock resistance in one using light-emitting diodes as light sources.SOLUTION: The lighting device 1 has light-emitting diodes 81 mounted on a substrate 8, and has an illumination unit 13 formed for surrounding the light-emitting diodes 81 with a synthetic resin material 9 made by mixing fine particles 92 for diffusing irradiation light from the light-emitting diodes 81 with a base material 91.
摘要翻译：要解决的问题：提供在使用发光二极管作为光源的一种使用光的方向性和扩散性优异的各种形状的照明装置以及耐久性和抗冲击性。解决方案：照明装置1具有安装在基板8上的发光二极管81，并且具有照明单元13，该照明单元13形成为用于通过混合用于扩散的细颗粒92制成的合成树脂材料9围绕发光二极管81 来自具有基材91的发光二极管81的照射光。（C）2012，JPO＆INPIT

3. 发明专利

JP2012235073A Resin sealing method of electronic component mounting substrate, electronic apparatus including resin sealing substrate and illumination apparatus 审中-公开
标题翻译：电子元件安装基板的树脂密封方法，包括树脂密封基板和照明设备的电子设备
公开(公告)号：JP2012235073A
公开(公告)日：2012-11-29
申请号：JP2011104609
申请日：2011-05-09
申请人： Suzuden:Kk , 株式会社スズデン , Suzuden Co Ltd , 株式会社スズデン販売
发明人： KOBAYASHI SHINOBU , KAWASHIMA HIROAKI
IPC分类号： H01L33/56 , H01L21/56 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide a resin sealing method of an electronic component mounting substrate for forming a periphery of an electronic substrate, various electronic elements loaded on the substrate and a light emitting diode by directly sealing it with thermoplastic resin by including the electronic substrate without much man hour during manufacture and to provide an electronic apparatus including a resin sealing substrate, and an illumination apparatus.SOLUTION: The electronic component is mounted on a fine ceramic substrate 5, and the substrate is installed in a mold for injection molding 1. The fine ceramic substrate 5 is injected and molded with thermoplastic resin material to surround the substrate. The electronic apparatus includes the fine ceramic substrate on which the electronic component is mounted and a thermoplastic resin section injected and molded on an outer side of the fine ceramic substrate so that the electronic component is surrounded. A light transmitting resin material is injected and molded on an outer side of the fine ceramic substrate to surround the fine ceramic substrate 5 on which light emitting diode elements 61 and 62 are mounted and the light emitting diode elements.
摘要翻译：要解决的问题：提供一种用于形成电子基板的周边的电子部件安装基板的树脂密封方法，通过将热塑性树脂直接密封在基板上的各种电子元件和发光二极管，通过包括电子基板在制造过程中没有多少小时，并且提供包括树脂密封基板和照明装置的电子设备。
解决方案：将电子部件安装在细陶瓷基板5上，将基板安装在注塑用模具1中。细陶瓷基板5由热塑性树脂材料注入并成型以包围基板。电子设备包括其上安装有电子部件的微细陶瓷基板和在微细陶瓷基板的外侧注入和模制的热塑性树脂部分，使得电子部件被包围。在微细陶瓷基板的外侧注入并模塑透光树脂材料，以包围其上安装有发光二极管元件61和62的微细陶瓷基板5和发光二极管元件。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2011129379A Luminaire 有权
标题翻译： LUMINAIRE
公开(公告)号：JP2011129379A
公开(公告)日：2011-06-30
申请号：JP2009286747
申请日：2009-12-17
申请人： Suzuden Hanbai:Kk , Suzuden:Kk , 株式会社スズデン , 株式会社スズデン販売
发明人： KAWASHIMA HIROAKI
IPC分类号： F21S2/00 , F21Y101/02
CPC分类号： F21V31/00 , F21S4/10 , F21S8/068 , F21V21/008 , F21V29/2212 , F21V29/767 , F21V29/85 , F21V29/86 , F21V29/89 , F21V31/04 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide a luminaire that can be used in a construction site, a greenhouse, a poultry house, in water, sea water and so on, the luminaire being waterproof, durable, shock-proof and pressure-resistant whose light sources are light-emitting diodes. SOLUTION: A luminaire includes light-emitting diodes 31, 32 and 33 implemented on a substrate 3 connected with wires, wherein the wires 52 and 53, the substrate 3, and the light-emitting diodes 31, 32 and 33 are integrally coated to be molded by using a synthetic resin. COPYRIGHT: (C)2011,JPO&INPIT

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