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    • 3. 发明专利
    • ORGANIC METAL VAPOR GROWTH APPARATUS
    • JPH06132230A
    • 1994-05-13
    • JP28118292
    • 1992-10-20
    • FUJITSU LTDFUJITSU KANTAMU DEVICE KK
    • GOTO OSAMU
    • C30B25/02H01L21/205
    • PURPOSE:To provide an organic metal vapor growth apparatus in which the whole surface of a substrate is uniformly heated to grow a compound semiconductor crystal of a uniform composition. CONSTITUTION:In an organic metal vapor growth apparatus wherein a substrate 1 is mounted on a table 13 in contact with the upper surface of a heating element 11, which is heated by high frequency induction heating, thereby heating the substrate 1 through the table 13 by thermal conduction, a plurality of ring- shaped recessed parts 11a of different diameters are concentrically provided on the upper surface of the heating element 11, and a plurality of filler rings 14 are prepared which are equal in size and shape to the individual ring-shaped recessed parts 11a. First, the filler rings 14 are inserted into all the ring-shaped recessed parts 11a, and thereafter the filler rings 14 are removed as appropriate and a cooling gas is made flow into the particular ring-shaped recessed parts 11a, thereby decreasing the temperature distribution of the heated substrate.
    • 6. 发明专利
    • JPH05243286A
    • 1993-09-21
    • JP4266492
    • 1992-02-28
    • FUJITSU LTDFUJITSU KANTAMU DEVICE KK
    • HASEGAWA YUICHIICHIKAWA SHINICHIRO
    • H01L21/52
    • PURPOSE:To prevent the element breakage by the occurrence of cracks and the electric inferiority in connection, concerning an FET using a large area of group III V compound semiconductor chip. CONSTITUTION:In a semiconductor device where a chip 3 consisting of a semiconductor thin piece where a semiconductor circuit 1a is made on the surface and a metallic film 2 is provided at the rear is die-bonded on a substrate, a dividing groove 4 for demarcating the position where the semiconductor thin piece 1 breaks and is divided when stress is applied when stress is applied to the semiconductor thin piece 1 is provided at the surface of the semiconductor thin piece 1. Furthermore, the semiconductor circuit 1a is arranged being divided into a plurality of regions being made by the dividing groove 4 separating the surface of the semiconductor thin piece 1, and the electric connection of divided each part of the semiconductor circuit 1a is performed by the wiring outside the semiconductor circuit 1a, and each thin piece of the semiconductor thin piece 1, broken and divided from the position of the dividing groove 4, is retained by the metallic film 2 provided all over the rear of the semiconductor thin piece 1.
    • 10. 发明专利
    • HIGH FREQUENCY AMPLIFIER CIRCUIT
    • JPH06164254A
    • 1994-06-10
    • JP31547192
    • 1992-11-26
    • FUJITSU LTDFUJITSU KANTAMU DEVICE KK
    • SANO SEIGO
    • H03F1/02H03F3/19
    • PURPOSE:To increase a voltage range that contribute to an amplifying action, to attain the effective use of the power voltage, and to acquire a useful technique for the use of the power voltage of a low level by setting the value of a resistance element at a level larger than a prescribed level and also smaller than infinity. CONSTITUTION:A line A' shows a load line defined when the value of a resistance element R is calculated from an equation, i.e., the line A' is equivalent to a conventional load line defined when the value of the element R is set at RLJ. A line B shows a load line that has a slant smaller than the load line A'. The value RL of the element R can be set larger (limited less than infinity) than the value RLJ for the load line B. In the equation, VDS shows the drain- source voltage (or collector-emitter voltage) of a transistor TR and ID shows the largest saturated current that can be supplied by the TR. As a result, a voltage range that contribute to an amplifying action is increased and the power voltage is effectively used. Then a useful technique is acquired for the use of the power voltage of a low level in particular.