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JP2009302081A Method for producing molded interconnect device 有权
标题翻译：生产模制互连装置的方法
公开(公告)号：JP2009302081A
公开(公告)日：2009-12-24
申请号：JP2008151217
申请日：2008-06-10
申请人： Sankyo Kasei Co Ltd , Sulfur Chemical Institute Inc , Toa Electronics:Kk , 三共化成株式会社 , 株式会社いおう化学研究所 , 株式会社東亜エレクトロニクス
发明人： MORI KUNIO , TAKAHASHI KIYOMASA , YUMOTO TETSUO
IPC分类号： H05K3/18 , B32B7/02 , C23C18/30 , C25D5/56 , C25D7/00
摘要： PROBLEM TO BE SOLVED: To form a precise three-dimensional conductive circuit which exhibits excellent adhesion properties without roughening the surface of a substrate, and saves on the resource of precious noble metals contained in a catalyst. SOLUTION: An OH group 1a is formed on the surface of a first substrate 1, and then the first substrate is coated with a functional molecular adhesive 2 consisting of a thiol-reactive alkoxysilane compound and then heated and dried. After the non-reacted functional molecular adhesive 2 is removed by alcoholic cleaning, a coating material 3 consisting of polyglycolic acid is applied partially to form a second substrate 4. After a catalyst 5 is imparted to the surface of the second substrate 4, the catalyst remaining on the surface of the coating material 3 is washed with water and removed. The part not coated with the coating material 3 is then subjected to electroless plating A of acid or neutral bath composition, and the coating material 3 is removed by an alkaline aqueous solution. The functional molecular adhesive 2 is chemically bonded to the OH group on the surface of the first substrate 1 to form a thiol group, and the thiol group is chemically bonded to the electroless plating A firmly through the catalyst 5. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了形成一种精密的三维导电电路，其具有优异的粘合性能，而不会使基板的表面粗糙化，并且节省了催化剂中所含的贵重贵金属的资源。解决方案：在第一衬底1的表面上形成OH基团1a，然后用由硫醇反应性烷氧基硅烷化合物组成的功能分子粘合剂2涂覆第一衬底，然后加热干燥。在通过醇清洗除去未反应的功能性分子粘合剂2后，部分地涂敷由聚乙醇酸组成的涂料3，形成第二基材4.将催化剂5赋予第二基材4的表面后，保留在涂料3的表面上，用水洗涤并除去。然后将未涂覆有涂层材料3的部分进行酸性或中性浴组合物的无电镀A，并且通过碱性水溶液除去涂层材料3。功能性分子粘合剂2与第一基板1的表面的OH基化学键合，形成硫醇基，硫醇基通过催化剂5牢固化学键合到化学镀A上。 C）2010，JPO＆INPIT

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