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1. 发明专利

JP2012203974A Vehicular music selection-reproduction system 审中-公开
标题翻译：车载音乐选择 - 复制系统
公开(公告)号：JP2012203974A
公开(公告)日：2012-10-22
申请号：JP2011070092
申请日：2011-03-28
申请人： Toyotsu Electronics:Kk , Akita Denshi Systems:Kk , E License:Kk , 株式会社アキタ電子システムズ , 株式会社イーライセンス , 株式会社豊通エレクトロニクス
发明人： KOBAYASHI KANJI , TAKAHASHI FUJIO , MINO AKIHIRO
IPC分类号： G11B27/10 , G01C21/26 , G11B27/00
摘要： PROBLEM TO BE SOLVED: To enable automatic selection and reproduction of an optimum piece of music reflecting a traveling condition and user preference, thereby providing a continuous service, without making an on-vehicle device become larger or enhance its performance.SOLUTION: A vehicle-side terminal device 1 includes: a parameter input part 11 for accepting input of parameter information representing the status of a vehicle itself or that of the surrounding of the vehicle and the status of a user; transmission/reception control parts 12, 13 for transmitting the input parameter information and receiving the data on a piece of music; a temporary storage part 16 for temporarily storing the data on a distributed piece of music; and a music-piece reproduction control part 14 for controlling reproduction of the temporarily stored music piece. A music-piece selection/distribution device 2, installed outside the vehicle, includes: a storage part 26 for storing music-piece data having music-piece attribute data and sound-source data that are generated for each music-piece; a music-piece selection part 25 for selecting a music piece appropriate for the present status on the basis of the parameter information and music-piece attribute data; and transmission/reception control part 21, 22 for receiving the parameter information and transmitting the music-piece data by communicating with the vehicle-side terminal device 1.
摘要翻译：要解决的问题：为了能够自动选择和再现反映行驶状况和用户偏好的最佳音乐片段，从而提供连续的服务，而不使车载设备变大或增强其性能。车辆侧终端装置1包括：参数输入部11，用于接受表示车辆本身的状态或车辆周围的参数信息的输入以及用户的状态; 发送/接收控制部分12,13，用于发送输入参数信息并接收一段音乐上的数据; 临时存储部分16，用于临时存储分布的音乐片段上的数据; 以及用于控制临时存储的乐曲的再现的乐曲再现控制部分14。安装在车辆外部的音乐片选择/分配装置2包括：存储部分26，用于存储具有为每个音乐片段生成的乐曲属性数据和声源数据的乐曲数据; 音乐片段选择部分25，用于根据参数信息和乐曲属性数据选择适合于当前状态的乐曲; 以及发送接收控制部21,22，用于接收参数信息，并通过与车载终端装置1通信来发送乐曲数据。（C）版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP4877779B2 Light-emitting diode device and a method of manufacturing the same 有权
标题翻译：空值
公开(公告)号：JP4877779B2
公开(公告)日：2012-02-15
申请号：JP2006303449
申请日：2006-11-09
申请人：株式会社アキタ電子システムズ
发明人：一高崎
IPC分类号： H01L33/48 , H01L23/12 , H01L23/28 , H01L23/29 , H01L23/31 , H01L33/56 , H01L33/62 , H01L33/64
CPC分类号： H01L2224/16 , H01L2224/17 , H01L2224/73204 , H01L2924/12041 , H01L2924/181 , H01L2924/00 , H01L2924/00012

3. 发明专利

JP4282345B2 Semiconductor integrated circuit device 有权
公开(公告)号：JP4282345B2
公开(公告)日：2009-06-17
申请号：JP2003066628
申请日：2003-03-12
申请人：株式会社アキタ電子システムズ , 株式会社日立製作所
发明人：幾也大野 , 和祐田川 , 覚高橋
IPC分类号： H03D7/14 , H01L27/02 , H03D9/00 , H04B1/40
CPC分类号： H01L27/0207 , H03D7/1433 , H03D2200/0025 , H03D2200/0047 , H04B1/40

4. 发明专利

JP4159171B2 The push-pull circuit 有权
公开(公告)号：JP4159171B2
公开(公告)日：2008-10-01
申请号：JP8491199
申请日：1999-03-26
申请人：株式会社アキタ電子システムズ
发明人：浩井上 , 文人伊藤
IPC分类号： H03F3/30 , H03L7/08

5. 发明专利

JP3985094B2 Bone conduction speaker apparatus and communication system 有权
公开(公告)号：JP3985094B2
公开(公告)日：2007-10-03
申请号：JP2002220542
申请日：2002-07-30
申请人：透加藤 , 株式会社アキタ電子システムズ , 雅和真崎
发明人：透加藤 , 雅和真崎 , 弘毅石川
IPC分类号： H04R1/00 , H04R1/10 , H04R1/02

6. 发明专利

JP2007134376A Light emitting diode, and method of manufacturing same 审中-公开
标题翻译：发光二极管及其制造方法
公开(公告)号：JP2007134376A
公开(公告)日：2007-05-31
申请号：JP2005323291
申请日：2005-11-08
申请人： Akita Denshi Systems:Kk , 株式会社アキタ電子システムズ
发明人： TAKASAKI HAJIME , HATAKEYAMA KOICHI
IPC分类号： H01L33/32 , H01L33/50 , H01L33/54 , H01L33/56 , H01L33/62
CPC分类号： H01L24/97 , H01L2224/16245
摘要： PROBLEM TO BE SOLVED: To provide a high output white light emitting diode operating stably. SOLUTION: The high output white light emitting diode comprises a sealed body composed of transparent resin into which yellow phosphor is dispersed, a flat first electrode plate projecting and extending from one end of the sealed body, a flat second electrode plate projecting and extending from the other end of the sealed body, and a blue light emitting diode chip located in the sealed body and having a p electrode connected with the first electrode plate and an n electrode connected with the second electrode plate. The first and second electrode plates consist, respectively, of a flat planar body of a fixed thickness and the lower surface of the first and second electrode plates is exposed to the lower surface of the sealed body. Through holes and portions having offset periphery are provided at the first and second electrode plate portions in the sealed body, and the lower surface is partially removed and made thin. The through holes, openings, the offset space portion, the space portion made by thinning, and the opening between the first and second opposing electrode plates are filled with resin forming the sealed body. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供稳定工作的高输出白光发光二极管。解决方案：高输出白光发光二极管包括由分散有黄色荧光体的透明树脂构成的密封体，从密封体的一端突出并延伸的平坦的第一电极板，平坦的第二电极板，从密封体的另一端延伸出来，蓝色发光二极管芯片位于密封体内，并具有与第一电极板连接的p型电极和与第二电极板连接的n电极。第一和第二电极板分别由固定厚度的平坦平面体构成，第一和第二电极板的下表面暴露于密封体的下表面。在密封体的第一和第二电极板部分设置有具有偏移周边的通孔和部分，并且将下表面部分地移除并变薄。通孔，开口，偏移空间部分，通过变薄制成的空间部分以及第一和第二相对电极板之间的开口填充有形成密封体的树脂。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2007133118A Optical display device and optical pen 审中-公开
标题翻译：光学显示设备和光学笔
公开(公告)号：JP2007133118A
公开(公告)日：2007-05-31
申请号：JP2005325641
申请日：2005-11-10
申请人： Akita Denshi Systems:Kk , 株式会社アキタ電子システムズ
发明人： TAKASAKI HAJIME
IPC分类号： G09F13/20
摘要： PROBLEM TO BE SOLVED: To provide an optical pen irradiating a light storage sheet with UV and to provide an optical display device having the light storage sheet whose part irradiated with UV emits light.
SOLUTION: The optical pen emitting UV and the optical display device wherein the light storage sheet receiving UV and emitting light is stuck to a supporting plate are provided. The optical pen has a cylindrical pen main body, a light emitting diode emitting UV from the tip of the pen main body, a cell incorporated into the pen main body and applying a prescribed voltage to the light emitting diode, wiring connecting the cell to the light emitting diode, and a switch connected to the wiring and controlling light emission and suspension of the light emitting diode. The optical display device has the supporting plate and the light storage sheet which is stuck to one surface of the supporting plate and in which a light storage material is kneaded. A reflection layer of a white color is provided on a first surface of the supporting plate and the light storage sheet is formed on the reflection layer.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用UV照射光存储薄片的光笔，并提供一种具有由UV照射的部分的光存储片发光的光学显示装置。解决方案：提供了将UV和发光的光存储薄片粘贴到支撑板上的发光UV光学笔和光学显示装置。光笔具有圆柱形笔主体，从笔主体的顶端发射紫外线的发光二极管，并入笔主体中并向该发光二极管施加规定电压的电池，将电池连接到发光二极管和连接到布线的开关，并控制发光二极管的发光和悬挂。所述光学显示装置具有支撑板和所述光存储片，所述支撑板和所述光存储片粘贴在所述支撑板的一个表面上，并且所述光存储材料被揉合。在支撑板的第一表面上设置白色的反射层，并且在反射层上形成光存储片。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2007027157A Light emitting diode device, its manufacturing method, and illumination apparatus 审中-公开
标题翻译：发光二极管装置及其制造方法及照明装置
公开(公告)号：JP2007027157A
公开(公告)日：2007-02-01
申请号：JP2005202457
申请日：2005-07-12
申请人： Akita Denshi Systems:Kk , 株式会社アキタ電子システムズ
发明人： TAKASAKI HAJIME
IPC分类号： F21S2/00 , F21S8/04 , F21V19/00 , F21Y101/02 , H01L33/56 , H01L33/62
CPC分类号： H01L24/97 , H01L25/0753 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/12041 , H01L2924/14 , H01L2933/005 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a triangular light emitting diode device and its manufacturing method capable of being densely arranged. SOLUTION: An illumination apparatus is configured such that a light emitting diode device 1 of a flip chip connection structure with emission colors of three kinds of red, green, and blue is mounted on one surface of a mounting substrate. The light emitting diode device comprises a triangular sealing state 2 made of a transparent insulating resin; a circular first electrode layer 3a provided at the center of a lower surface of the sealing structure; a second electrode layer formed from each apex of a triangle of a lower surface of the sealing structure over the interior of the triangle; a light emitting diode chip 4 located in the sealing structure and electrically connected with an internal surface of the first electrode via a rear surface electrode; and a conductive wire 8 for connecting electrodes on an upper surface of the light emitting diode chip and one second electrode layer. The respective light emitting diode devices of the triangle are disposed in alignment such that sides of facing mutual triangles in the light emitting diode devices disposed adjacently are located in parallel. Hereby, there is ensured a high output white colored illumination apparatus. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够密集布置的三角形发光二极管装置及其制造方法。解决方案：照明装置被配置为使得具有三种红色，绿色和蓝色三种发光颜色的倒装芯片连接结构的发光二极管装置1安装在安装基板的一个表面上。发光二极管装置包括由透明绝缘树脂制成的三角形密封状态2; 设置在密封结构的下表面的中心的圆形第一电极层3a; 由所述密封结构的下表面的三角形的每个顶点在所述三角形的内部形成的第二电极层; 位于密封结构中的发光二极管芯片4，经由背面电极与第一电极的内表面电连接; 以及用于连接发光二极管芯片的上表面上的电极和一个第二电极层的导线8。三角形的各个发光二极管器件被排列成对准，使得相邻设置的发光二极管器件中的相对三角形的面相平行设置。因此，确保了高输出白色照明装置。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2006216823A Semiconductor device, its manufacturing method and electronic device 有权
标题翻译：半导体器件及其制造方法和电子器件
公开(公告)号：JP2006216823A
公开(公告)日：2006-08-17
申请号：JP2005028812
申请日：2005-02-04
申请人： Akita Denshi Systems:Kk , Akita Semiconductor:Kk , 株式会社アキタセミコンダクタ , 株式会社アキタ電子システムズ
发明人： SATO NOBUE , SAGA TORU , TAKESHIMA HIDEHIRO , INAGAWA SUSUMU , WATANABE FUMITOMO
IPC分类号： H01L23/12
CPC分类号： H01L24/97 , H01L2224/48091 , H01L2924/07802 , H01L2924/15787 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To miniaturize and thin a semiconductor device and improve mounting performance. SOLUTION: The semiconductor device has a semiconductor chip with an electrode in a first surface, a first part consisting of an insulating plate, and a second part which is extended from the first part and is thinner than the first part. The first surfaces of the first part and the second part are positioned on the same plane, and the first surface is bonded to the first surface of the semiconductor chip aside an arrangement position of an electrode via an insulating adhesive. The second surfaces of the first part and the second part, which are opposite surfaces of the first surface have a plurality of conductor layers, respectively. The prescribed conductor layer of the first part and the prescribed conductor layer of the second part have a wiring block formed of a structure to be electrically connected via a conductor provided to an inside; a conductive wire connecting the prescribed conductor layer of the second part of a wiring block and a prescribed electrode of the semiconductor chip; and an insulating sealing body covering the first surface of the semiconductor chip, the second part of the wiring block, and the wire. The surface of the sealing body is lower than the second surface of the first part of the wiring block by a prescribed height. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了使半导体器件小型化和薄型化，提高安装性能。解决方案：半导体器件具有在第一表面中具有电极的半导体芯片，由绝缘板构成的第一部分和从第一部分延伸并且比第一部分更薄的第二部分。第一部分和第二部分的第一表面位于相同的平面上，并且第一表面通过绝缘粘合剂结合到半导体芯片的第一表面，而不是电极的布置位置。第一部分和第二部分的与第一表面相对的表面的第二表面分别具有多个导体层。第一部分的规定导体层和第二部分的规定导体层具有由通过设置在内部的导体电连接的结构形成的布线块; 连接布线块的第二部分的规定导体层和半导体芯片的规定电极的导线; 以及覆盖半导体芯片的第一表面，布线块的第二部分和导线的绝缘密封体。密封体的表面比布线块的第一部分的第二表面低规定的高度。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP3795451B2 Implementation method of the semiconductor device 有权
公开(公告)号：JP3795451B2
公开(公告)日：2006-07-12
申请号：JP2002344932
申请日：2002-11-28
申请人：株式会社アキタ電子システムズ , 株式会社日立製作所
发明人：敏幸高橋
IPC分类号： H01L23/12
CPC分类号： H01L2224/48091 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012

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