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1. 发明专利

JPWO2008096854A1 ダイヤモンド微細粉及びその捕集方法、並びに該ダイヤモンド微細粉を分散したダイヤモンドスラリー有权
公开(公告)号：JPWO2008096854A1
公开(公告)日：2010-05-27
申请号：JP2008557169
申请日：2008-02-08
申请人：博石塚 , 博石塚 , 直樹小松 , 直樹小松
发明人：陽一森田 , 陽一森田 , 竜哉瀧本 , 竜哉瀧本 , 直樹小松 , 直樹小松 , 博山中 , 博山中 , 寿男白澤 , 寿男白澤 , 博石塚 , 博石塚
IPC分类号： C01B31/06 , B01D21/00 , B01D21/01 , B01J3/06 , B01J3/08 , B03B5/28 , C02F1/52 , C09K3/14
CPC分类号： C01B31/065 , B82Y30/00 , C01B32/28 , C01P2004/64 , C09K3/1409 , C09K3/1463 , Y10T428/2982
摘要：【課題】本発明の主な目的の一つは、UPA150によるD50値粒径が20nm以下のダイヤモンド微細粒子を、高精度整粒微細粉として回収することである。【解決手段】本発明のダイヤモンド微細粉は、次の各工程を含む方法によって捕集される。(1) 一次粒子径が50nm以下のダイヤモンド粒子を含有する微細粉において、ダイヤモンド粒子表面に親水性官能基を結合乃至付着させて表面親水性とする工程、(2) 表面親水性ダイヤモンドを水中に分散させてスラリー化する工程、及び(3) スラリーを、4×103G以上の加速度及び加速度と遠心力負荷時間との積(以下「遠心負荷積」と言う) 200×103G・分以上(但しGは重力の加速度)にて超遠心分離操作に供し、比較的粒径の大きな粒子を沈降させて分離する工程、及び(4) スラリー中に陽イオンを添加することにより、スラリー中に懸濁している微細粒子を捕集する工程。【選択図】図1

2. 发明专利

JPWO2006075763A1 単結晶質ダイヤモンド微粉及びその製造方法有权
公开(公告)号：JPWO2006075763A1
公开(公告)日：2008-06-12
申请号：JP2006553026
申请日：2006-01-11
申请人：博石塚 , 博石塚
发明人：信之斎藤 , 信之斎藤 , 寿男白沢 , 寿男白沢 , 博山中 , 博山中 , 博石塚 , 博石塚
IPC分类号： C01B31/06
CPC分类号： C30B29/04 , B01D21/02 , B82Y30/00 , C01B32/28 , C01P2004/64 , C09K3/1409 , C30B29/605
摘要：本発明は、鋭利な形状及び狭い粒度範囲を持つ50nm未満の単結晶質ダイヤモンド微粉、及びそれを高効率に製造するための製造方法を提供することを目的としている。本発明に係る単結晶質ダイヤモンド微粉の製造方法は、まず、単結晶質原料ダイヤモンドの機械的破砕により粗微粒ダイヤモンドとし、さらに粗微粒ダイヤモンドの表面を親水化する。次いで、親水化粗微粒ダイヤモンドを水中に分散させたスラリーを、弱アルカリ性に保って前段分級工程に供し、D50値が60nm+の上方フラクションを除去する。次いで、上方フラクションを除去したスラリーのダイヤモンド濃度を0.1重量%以下に調節して遠心力に供することにより、スラリーからダイヤモンドの比較的粗い粒度範囲の部分を凝集・分離し、一方平均粒度が減少したフラクションを含む水媒体を流出液として遠心分離工程から流出させる。そして、上記流出液を、流出液に含有されるダイヤモンド粒子のD50値が50nm未満であり、かつ、D50値に対するD10値およびD90値の比がそれぞれ50%以上および200%以下になるまで、繰り返し、遠心力に供し、平均粒度がさらに減少したフラクションを含む水媒体を流出液として遠心分離工程から流出させる(図1)。

3. 发明专利

JPWO2007023949A1 焼結体研磨部を持つ工具およびその製造方法有权
公开(公告)号：JPWO2007023949A1
公开(公告)日：2009-03-05
申请号：JP2007532202
申请日：2006-08-25
申请人：博石塚 , 博石塚
发明人：博石塚 , 博石塚
IPC分类号： B24B53/12 , B24B53/017 , B24D3/00 , B24D7/00 , B24D7/06 , H01L21/304
CPC分类号： B24B53/017 , B24B53/12 , B24D7/00 , Y10T428/21 , Y10T428/24579 , Y10T428/24612
摘要：砥粒の基板への固着強度問題や不均一な研磨面の問題等が解決された高能率で加工可能な研磨工具およびその効果的な製造方法を提供する。本発明は、超硬合金の裏打ち材に焼結一体化した超砥粒焼結体からなる研磨部をもつ研磨工具(1)であって、研磨部が、頂部を有する複数の研磨単位(2)を含み、各頂部が相互に略同一平面上にあり、研磨単位(2)が、該研磨部に直線溝(3)群を設けることにより形成された、特にCMPパッドコンディショナーに用いられる前記研磨工具およびその製造方法に関する。

4. 发明专利

JP5276995B2 Method of collecting diamond fine powder 有权
标题翻译：空值
公开(公告)号：JP5276995B2
公开(公告)日：2013-08-28
申请号：JP2008557169
申请日：2008-02-08
申请人：博石塚 , 直樹小松
发明人：陽一森田 , 竜哉瀧本 , 直樹小松 , 博山中 , 寿男白澤 , 博石塚
IPC分类号： C01B31/06 , B01D21/00 , B01D21/01 , B01J3/06 , B01J3/08 , B03B5/28 , C02F1/52 , C09K3/14
CPC分类号： C01B31/065 , B82Y30/00 , C01B32/28 , C01P2004/64 , C09K3/1409 , C09K3/1463 , Y10T428/2982
摘要： [Task to be solved] One of the principal objects of the invention is to collect minute diamond particles of D 50 of 20 nm and smaller, by MICROTRAC UPA 150, in high precision and high definition. [Means for solving the task] The minute diamond particles of the invention are recovered by a method comprising: (1) joining or combining a hydrophilic functional group with a surface of diamond powder that comprises particles of a primary particle size of 50 nm or less, so as to impart hydrophilic nature on the surface, (2) placing the hydrophilic diamond particles to hold in suspension in water to form a slurry, (3) subjecting said slurry to a hyper-centrifugal process at a centrifugal force of 4x10 3 G and at the same time a centrifugal load product of 200x10 3 G·min. or more, in order to remove by depositing a fraction of coarser particles from the slurry, said load product being defined as product of centrifugal force, loaded, in G and duration of loading in minutes, where G represents the gravitational acceleration constant; (4) adding cations to said slurry, whereby the diamond particles in suspension in the water are deposited.
摘要翻译： [待解决的任务]本发明的主要目的之一是通过MICROTRAC UPA 150以高精度和高清晰度收集20nm以下的D 50的微小金刚石颗粒。 [解决任务的手段]通过以下方法回收本发明的微小金刚石颗粒：（1）将亲水性官能团与包含一次粒径为50nm以下的粒子的金刚石粉末的表面接合或组合，以便赋予表面亲水性，（2）将亲水性金刚石颗粒置于悬浮液中以形成浆料，（3）在4×10 3 G离心力下对所述浆料进行超离心过程并同时具有200×10 3 G·min的离心负荷产物。或更多，为了通过从浆料中沉积一部分较粗的颗粒来除去，所述负载产物被定义为离心力的乘积，G中的载荷和以几分钟的载荷持续时间，其中G表示重力加速常数; （4）向所述浆料中加入阳离子，由此沉积在水中悬浮液中的金刚石颗粒。

5. 发明专利

JP2008119802A Tabular resin material for polishing semiconductor and manufacturing method thereof 审中-公开
标题翻译：用于抛光半导体的片状树脂材料及其制造方法
公开(公告)号：JP2008119802A
公开(公告)日：2008-05-29
申请号：JP2006308563
申请日：2006-11-15
申请人： Hiroshi Ishizuka , 博石塚
发明人： ISHIZUKA HIROSHI
IPC分类号： B24D3/00 , B24D3/28
摘要： PROBLEM TO BE SOLVED: To provide a polishing material where submicron order fine diamond particles are not agglomerated, but dispersed and retained in a resinous bond material or a matrix material in a state of primary particles. SOLUTION: Fine diamond dispersed resin material where diamond particles having regulated particle size are individually coated with a resin layer in a non-agglomerated state is obtained by the production method including the following steps; (1) a step for dispersing the fine diamond powder having regulated D 50 value average particle size of 200 nm or less into water or an organic medium, (2) a step for dissolving a material of resins in the organic medium, (3) a step for mixing the dispersion liquid of (1) and solution of (2), removing water and the organic medium from the mixed liquid by heating or depressurizing or combinedly heating and depressurizing the mixed liquid obtained, and collecting a solid mixture of diamond and resin, and (4) a step for processing the solid mixture into tabular shape by pressurized hot molding, injection molding or hot rolling. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种抛光材料，其中亚微米级细金刚石颗粒不是聚集的，而是分散并保留在初级颗粒状态的树脂粘合材料或基质材料中。解决方案：通过包括以下步骤的制备方法获得具有调节粒度的金刚石颗粒分别用非凝聚状态的树脂层涂覆的金刚石分散树脂材料。（1）将具有规定的D 50 平均粒径为200nm以下的金刚石粉末分散在水或有机介质中的步骤，（2）将树脂材料溶解的步骤有机介质，（3）通过对获得的混合液进行加热或减压或组合加热和减压来混合（1）的分散液和（2）的溶液，从混合液中除去水和有机介质的步骤，以及收集金刚石和树脂的固体混合物，和（4）通过加压热成型，注射成型或热轧将固体混合物加工成平板状的步骤。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2007118581A Hard-brittle material thin sheet and production method thereof 审中-公开
标题翻译：硬质材料薄片及其生产方法
公开(公告)号：JP2007118581A
公开(公告)日：2007-05-17
申请号：JP2006253632
申请日：2006-09-20
申请人： Hiroshi Ishizuka , 博石塚
发明人： ISHIZUKA HIROSHI
IPC分类号： B28D5/00 , B28D5/02 , B28D5/04
摘要： PROBLEM TO BE SOLVED: To provide a production method of a hard-brittle material thin sheet for efficiently cutting a sheet from a hard-brittle semiconductor material selected from Si, SiC, Si
3 N
4 , SiO
2 , GaP, GaAs, GaN, InP, InS, InN, MgS, MgP, MgSe, ZnO, ZnS, ZnSe, CdS, CdSe, AlN, Al
2 O
3 and BeSe with material waste kept at a minimum.
SOLUTION: The production method of a hard-brittle material sheet comprises a cut of a sheet to be cut at a cutting speed within a mixed region of a brittle cutting region and a ductile cutting region within an elastic limit (or deformation limit) of the material so as not to cause breakage or crack on the sheet to be cut.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决问题的方案为了提供一种用于从选自Si，SiC，Si，S，N，C，C，C，C，C，C的硬脆性半导体材料有效地切割片材的硬脆材料薄片的制造方法， SB> 4 ，SiO 2，GaP，GaAs，GaN，InP，InS，InN，MgS，MgP，MgSe，ZnO，ZnS，ZnSe，CdS，CdSe，AlN， SB> 2 3 和具有废料的BeSe保持在最低限度。解决方案：脆性材料片的制造方法包括在脆性切割区域和弹性极限（或变形极限）内的脆性切割区域和延性切割区域的混合区域内以切割速度切割的片材切割），以免在要切割的片材上造成断裂或裂纹。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2008183640A Diamond dispersed synthetic resin molding material and its manufacturing method 审中-公开
标题翻译：金刚石分散合成树脂成型材料及其制造方法
公开(公告)号：JP2008183640A
公开(公告)日：2008-08-14
申请号：JP2007017185
申请日：2007-01-26
申请人： Hiroshi Ishizuka , 博石塚
发明人： ISHIZUKA HIROSHI
IPC分类号： B24D3/00 , B24D3/28
摘要： PROBLEM TO BE SOLVED: To provide a synthetic resin molding material of a monomer and a low grade polymer in which fine diamond particles of a sub micron class are dispersed and held in a primary particle state and its efficient manufacturing method. SOLUTION: Constituent particles of graded diamond powder are dispersed in a non-agglomerated state in a synthetic resin material body including a molding resin monomer or oligomer. This synthetic resin molding material is effectively manufactured under a method including following steps: (1) a step to prepare the graded fine diamond powder a D 50 value average grain diameter of which is 1,000 nm or lower, a surface layer of the diamond particles of which is surface-reformed by a hydrophilic, hydrophobic or anti-diamond carbonizing process, (2) a step to disperse the surface reformed diamond particles in the molding material body including the molding resin monomer or oligomer and (3) a step to make the molding resin monomer or oligomer the resin molding body by polymerizing it. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：待解决的问题：提供一种单体和低级聚合物的合成树脂成型材料，其中亚微米级的金刚石微粒分散并保持在初级粒子状态，并且其有效的制造方法。解决方案：分级金刚石粉末的成分颗粒以非凝聚状态分散在包括模塑树脂单体或低聚物的合成树脂材料体中。该合成树脂成型材料有效地制造在以下步骤的方法中：（1）制备其平均粒径为1000nm以下的分级金刚石粉末的步骤，a 金刚石颗粒的表面层通过亲水，疏水或抗金刚石碳化工艺进行表面改性，（2）将表面改性的金刚石颗粒分散在包含模塑树脂单体或低聚物的成型材料体中的步骤和（ 3）通过聚合使树脂成型体成型树脂单体或低聚物的步骤。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2006051578A Throw-away tip of sintered superabrasive grains 审中-公开
标题翻译：烧烤超级颗粒的粗略提示
公开(公告)号：JP2006051578A
公开(公告)日：2006-02-23
申请号：JP2004235467
申请日：2004-08-12
申请人： Hiroshi Ishizuka , 博石塚
发明人： ISHIZUKA HIROSHI
IPC分类号： B23B27/14 , B23B27/20 , C04B37/02
摘要： PROBLEM TO BE SOLVED: To provide a throw-away tip involving less risk of peeling owing to a residual stress and having a long lifetime as the whole tool life by applying a sinter of superabrasive grains rigidly to each of the main surfaces of a tip base by means of simultaneous sintering and forming on each surface two or more apices to serve as cutting edges. SOLUTION: A work to be sintered in which a powder of superabrasive grains is arranged adjacent to the top surface and undersurface of a disc of cemented carbide is set in a high-temperature, high-pressure device, and subjected to a pressure-temperature condition in which the superabrasive substance is stabilized thermodynamically. The work collected after being cooled and having got rid of pressure is subjected to removal of a pressure medium etc. and the superabrasive grain surface is exposed, and after undergoing a coarse polishing and a mirror polishing, the work is subjected to a wire cut and a further polishing, and cut out in a multi-apex shape at the apices of each of the main surfaces. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种丢弃尖端，其通过将超磨料颗粒的烧结体刚性地施加到每个主表面的主要表面上，由于残余应力而具有较小的寿命，并且具有长的寿命通过在每个表面上同时烧结和形成两个或更多个顶点以用作切割边缘的尖端基部。解决方案：一种待烧结的工件，其中将超硬磨料颗粒的粉末布置在硬质合金盘的顶表面和下表面附近，设置在高温高压装置中，并经受压力热磨性物质在热力学上稳定的温度条件。在冷却并收集压力之后收集的工作被除去压力介质等，并且超磨料颗粒表面暴露，经过粗抛光和镜面抛光后，工件进行线切割进一步抛光，并且在每个主表面的顶点处以多顶点形状切割。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP5325387B2 Monocrystalline diamond fine powder and a method of manufacturing the same 有权
公开(公告)号：JP5325387B2
公开(公告)日：2013-10-23
申请号：JP2006553026
申请日：2006-01-11
申请人：博石塚
发明人：信之斎藤 , 寿男白沢 , 博山中 , 博石塚
IPC分类号： C01B31/06
CPC分类号： C30B29/04 , B01D21/02 , B82Y30/00 , C01B32/28 , C01P2004/64 , C09K3/1409 , C30B29/605
摘要： An object of this invention is to provide a fine powder of diamond particles of less than 50 nm with a narrow particle size range. The diamond is single crystalline and characterized with a lot of sharp edges and sharp points. Another object is to provide a method for efficiently producing such fine powder. The method comprises mechanically crushing a raw material of single crystalline diamond particles to prepare starting minute particles of diamond, then imparting hydrophilic quality to the surface of diamond particles. As hydrophilic the diamond particles are dispersed in water to form a slurry, which is set and kept weakly alkaline. The slurry is then subjected to a preliminary grading step, whereby the slurry is removed of a top particle size fraction of the diamond particles that has a D 50 size of 60 nm or more. Eliminated of said top particle size fraction, the slurry is then diluted with water to regulate the diamond concentration to 0.1 % (by weight) or less. The slurry so conditioned is subjected to a centrifugal force, whereby a coarser particle size fraction of the diamond particles is condensed to a solid cake and removed from the slurry. Effluent slurry is taken out from the centrifugal grading that contains a fraction of the diamond particles having decreased particle sizes.

10. 发明专利

JP2008115303A Resin material for polishing tool and its manufacturing method 审中-公开
标题翻译：抛光工具用树脂及其制造方法
公开(公告)号：JP2008115303A
公开(公告)日：2008-05-22
申请号：JP2006300941
申请日：2006-11-06
申请人： Hiroshi Ishizuka , 博石塚
发明人： ISHIZUKA HIROSHI
IPC分类号： C09K3/14 , B24D3/00 , C01B31/06
摘要： PROBLEM TO BE SOLVED: To provide a polishing material which has fine diamond particles of a submicrometer class size dispersed and held in a resinous bond material or matrix material in the state of the primary particles without causing cohesion.
SOLUTION: The fine diamond-dispersed resin material, in which particle size-regulated diamond particles are singly coated in the non-cohesion state with a resin layer, is obtained by the manufacturing method comprising the following steps: (1) hydrophilizing fine diamond powders having a D
50 average particle size of ≤1,000 nm by bonding a hydrophilic functional group to them or making it adsorbed on them; (2) heating the hydrophilized diamond particles at the hydrogen termination temperature in a hydrogen atmosphere to make the surfaces of the diamond particles hydrogen-terminated; (3) combining the hydrogen-terminated diamond particles, a resin and an organic medium to prepare slurry having the diamond particles dispersed therein; and (4) separating/removing the organic medium to recover the diamond-containing resin in the form of powders or flakes.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有亚微米级尺寸的细金刚石颗粒的抛光材料，其分散并保持在初级颗粒状态下的树脂粘合材料或基质材料中，而不会引起内聚力。解决方案：通过包括以下步骤的制造方法获得其中粒径调节金刚石颗粒以非粘结状态用树脂层单独涂覆的细金刚石分散树脂材料：（1）亲水化通过将亲水性官能团键合到其上或使其吸附在其上，具有平均粒径≤1000nm的平均粒径的平均粒度<10μm的细金刚石粉末; （2）在氢气氛中在氢终止温度下加热亲水化金刚石颗粒，使金刚石颗粒的表面氢终止; （3）结合氢封端的金刚石颗粒，树脂和有机介质以制备其中分散有金刚石颗粒的浆料; 和（4）分离/除去有机介质以回收粉末或薄片形式的含金刚石的树脂。版权所有（C）2008，JPO＆INPIT

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