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1. 发明专利

JP2006156628A Temperature control mechanism 审中-公开
标题翻译：温度控制机制
公开(公告)号：JP2006156628A
公开(公告)日：2006-06-15
申请号：JP2004343614
申请日：2004-11-29
申请人： Et System Engineering Kk , Tokyo Ohka Kogyo Co Ltd , イーティーシステムエンジニアリング株式会社 , 東京応化工業株式会社
发明人： NAKAMURA AKIHIKO , SASAKI TAMOTSU
IPC分类号： H01L21/027 , B05C9/14 , B05C11/10
摘要： PROBLEM TO BE SOLVED: To provide an effective temperature control mechanism when applied to a development device which has two series of pipe arrangements for developing solution.
SOLUTION: The inside of the jacket 10 of a temperature control mechanism 6 is divided into two channels 10a and 10b by a divider plate 14 whose one end is opened. These channels 10a and 10b are connected in the part of the end where the divider plate 14 is opened. At the end of one jacket 10 of the side where the divider plate 14 is not opened, a temperature control stream inlet 15 is provided while a temperature control water outlet 16 being provided under the same end. Further, the pipe arrangements 11 and 12 for chemical solution are penetrated in each channel 10a and 10b formed by being divided into two by the divider plate 14.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：当应用于具有两系列用于显影液的配管的显影装置时，提供有效的温度控制机构。解决方案：温度控制机构6的护套10的内部通过其一端打开的分隔板14分成两个通道10a和10b。这些通道10a和10b在分隔板14打开的一端的部分连接。在分隔板14未打开的一侧的一个护套10的端部，设置有温度控制流入口15，同时在同一端设置温度控制水出口16。此外，用于化学溶液的管道装置11和12穿过由分隔板14分成两部分形成的每个通道10a和10b中。（C）2006年，JPO和NCIPI

2. 发明专利

JP2004253649A Multistage processing apparatus 有权
公开(公告)号：JP2004253649A
公开(公告)日：2004-09-09
申请号：JP2003043068
申请日：2003-02-20
申请人： Et System Engineering Kk , Tokyo Ohka Kogyo Co Ltd , イーティーシステムエンジニアリング株式会社 , 東京応化工業株式会社
发明人： NAKAMURA AKIHIKO , AOKI TAIICHIRO , OISHI SEISHI , SASAKI TAMOTSU
IPC分类号： G03B27/32 , G03F7/30 , H01L21/027 , H01L21/60
CPC分类号： G03F7/3021 , Y10S134/902
摘要： PROBLEM TO BE SOLVED: To provide a multistage processing apparatus which can be arranged in a limited space without complicating a driving mechanism. SOLUTION: This processor is configured by vertically laminating processing units 1 in a cascade status. The processing unit 1 is configured of a cup 2 surrounding the periphery of a substrate and a chuck 3 for holding and rotating the substrate, and the cup 2 is configured to go up and down for the chuck 3. A cylinder unit 6 is reduced so that the upper edge face of the chuck 3 can be positioned at the relatively upper part of the upper edge of the cup 2, and a substrate W is loaded on the chuck 3 so as to be sucked and fixed in this status. Afterwards, the cylinder unit 6 is extended so that the substrate W can be held in the cup 2, developing solution is dropped to the center of the surface of the substrate W from a developing solution supply nozzle 9 in this status, and the chuck 3(substrate W) is rotated through a driving shaft 18 and a timing belt 23 by driving a motor 17 so that the developing solution can be spread to the surface of the substrate W. COPYRIGHT: (C)2004,JPO&NCIPI

3. 发明专利

JP4668350B1 Of semiconductor wafer separation device 有权
公开(公告)号：JP4668350B1
公开(公告)日：2011-04-13
申请号：JP2010122586
申请日：2010-05-28
申请人：イーティーシステムエンジニアリング株式会社
发明人：保佐々木
IPC分类号： H01L21/304 , B28D5/00
CPC分类号： B28D5/0082
摘要：【課題】切断後のウェーハを１枚づつ確実に分離できるとともに分離の際にウェーハを破損することがない半導体ウェーハの分離方法を提供する。
【解決手段】分離槽１内では、微粒子Ｐを含んだ分離液が循環しているため、切断されたウェーハ間に存在している冷却剤や切り屑等のスラッジはウェーハ間の隙間から除去され、分離槽１の底面からスラリーとして排出され、また、ウェーハ間からはスラッジが除かれるとともに微粒子Ｐが侵入して留まり、ウェーハ同士の張り付きを防止するとともに間隔を一定に維持する。
【選択図】図６

4. 发明专利

JP2011003837A Alignment device and alignment method 有权
标题翻译：对准设备和对齐方法
公开(公告)号：JP2011003837A
公开(公告)日：2011-01-06
申请号：JP2009147698
申请日：2009-06-22
申请人： Et System Engineering Kk , Tokyo Ohka Kogyo Co Ltd , イーティーシステムエンジニアリング株式会社 , 東京応化工業株式会社
发明人： NAKAMURA AKIHIKO , KATSURAGAWA JUNICHI , KOBARI RIN , SASAKI TAMOTSU
IPC分类号： H01L21/683 , H01L21/68
CPC分类号： G01D1/00 , G01D15/00
摘要： PROBLEM TO BE SOLVED: To provide alignment techniques for performing high-precision alignment while suppressing deformation of an alignment object.SOLUTION: An alignment device 100 includes a spin chuck 110 which sucks an alignment object 10 and rotates it. The alignment device 100 further includes a support member 130 for supporting the rotating alignment object 10 in a position different from a position where the spin chuck 110 sucks the object. Thus, deformation such as deflection of the alignment object 10 caused by its own weight can be suppressed and high-precision alignment can be performed.
摘要翻译：要解决的问题：提供用于执行高精度对准同时抑制对准物体的变形的对准技术。解决方案：对准装置100包括旋转卡盘110，其旋转对准物体10并使其旋转。对准装置100还包括用于将旋转的对准物体10支撑在与旋转卡盘110吸附物体的位置不同的位置的支撑构件130。因此，可以抑制由自身重量引起的对准物体10的偏转等变形，能够进行高精度对准。

5. 发明专利

JP2006156679A Support plate adhering apparatus 有权
标题翻译：支撑板附件
公开(公告)号：JP2006156679A
公开(公告)日：2006-06-15
申请号：JP2004344677
申请日：2004-11-29
申请人： Et System Engineering Kk , Tokyo Ohka Kogyo Co Ltd , イーティーシステムエンジニアリング株式会社 , 東京応化工業株式会社
发明人： MIYANARI ATSUSHI , INAO YOSHIHIRO , SASAKI TAMOTSU
IPC分类号： H01L21/02 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide an adhering apparatus for pressure-bonding a support plate while easily removing the gas held between a substrate such as semiconductor wafer or the like and the support plate. SOLUTION: A pressure reducing chamber 50 is connected with an evacuation apparatus via a pipe 51, allows formation of a carrying-in/out aperture 52 at its one side surface, and opens or closes this aperture 52 with a shutter 53. This shutter 53 is moved upward and downward with a cylinder unit 54 and when it is pushed with a pusher 55 from a side at the lifted position, a seal provided at the internal side surface of the shutter 53 is placed in close contact with the circumference of the aperture 52 to seal the inside of the chamber 50. When the pusher 55 is moved backward and the shutter 53 is moved downward, the aperture 52 is opened and a laminate of the wafer W and support plate 2 is carried in and out using a transferring apparatus under the above state. Within the chamber 50, a holding base 56 and a pressuring plate 57 are arranged for pressure-bonding the laminate. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于压力支撑板的粘合装置，同时容易地除去保持在诸如半导体晶片等的基板和支撑板之间的气体。解决方案：减压室50通过管道51与排气装置连接，允许在其一个侧表面形成进/出孔52，并用闸板53打开或关闭该孔52。该活门53通过气缸单元54向上和向下移动，并且当用推动器55从提升位置的一侧推动时，设置在活门53的内侧表面处的密封件被放置成与圆周孔52的内部密封。当推动器55向后运动并且活门53向下移动时，孔52打开，并且晶片W和支撑板2的层压体被携带进出，使用在上述状态下的转印装置。在室50内设置有保持基座56和加压板57，用于对层压体进行压接。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005191535A Sticking device and sticking method 审中-公开
标题翻译：手提装置和手提方法
公开(公告)号：JP2005191535A
公开(公告)日：2005-07-14
申请号：JP2004292089
申请日：2004-10-05
申请人： Et System Engineering Kk , Tokyo Ohka Kogyo Co Ltd , イーティーシステムエンジニアリング株式会社 , 東京応化工業株式会社
发明人： MIYANARI ATSUSHI , SASAKI TAMOTSU
IPC分类号： H01L21/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a sticking device and a sticking method that can easily eliminate a gas sandwiched between a substrate, such as a semiconductor wafer and a support plate for crimping. SOLUTION: The laminate of the semiconductor wafer W and the support plate 2 is set onto the upper surface of a holding stand 51, and a motor 55 is driven for lowering a pressing plate 52 for crimping between the holding stand 51 and the pressing plate 52. In crimping, bubbles present in between the semiconductor wafer W and the support plate 2 or a gas in which the solvent of an adhesive layer 1 has vaporized is removed to the outside via a ceramics sintered body 62. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够容易地消除夹在诸如半导体晶片的基板和用于卷曲的支撑板之间的气体的粘贴装置和粘贴方法。解决方案：将半导体晶片W和支撑板2的层压体设置在保持台51的上表面上，并且驱动电动机55以降低用于在保持台51和保持架51之间卷曲的按压板52 在压接时，存在于半导体晶片W和支撑板2之间的气泡或粘合剂层1的溶剂蒸发的气体经由陶瓷烧结体62除去到外部。（C）2005，JPO＆NCIPI

7. 发明专利

JP2004342973A Rotation development apparatus 有权
公开(公告)号：JP2004342973A
公开(公告)日：2004-12-02
申请号：JP2003140240
申请日：2003-05-19
申请人： Et System Engineering Kk , Tokyo Ohka Kogyo Co Ltd , イーティーシステムエンジニアリング株式会社 , 東京応化工業株式会社
发明人： NAKAMURA AKIHIKO , SASAKI TAMOTSU
IPC分类号： G03F7/30 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a rotation development apparatus wherein the temperature of the whole of a matter to be treated is equally adjusted.
SOLUTION: A jacket 4 for temperature adjustment is fitted to an opening part at the upper end of the cylindrical inner plate 21 of a cup 1. The jacket 4 consists of an upper plate 41, a lower plate 42 and a barrier 43 formed between the plates, and all of them are made of aluminum (aluminum alloy) excellent in heat conductivity. On the surfaces which can contact with a developer of the upper plate 41 and the barrier 43 constituting the jacket 4, a Teflon (R) coating 50 is formed. At an opening formed in the center of the jacket 4, a chuck 7 is arranged. A path 71 connected with a vacuum pump is formed in the shaft of this chuck 7, and fins 72 for improving heat transmission effect are provided in the outer periphery of the shaft.
COPYRIGHT: (C)2005,JPO&NCIPI

8. 发明专利

JP5384220B2 Alignment apparatus and alignment method 有权
公开(公告)号：JP5384220B2
公开(公告)日：2014-01-08
申请号：JP2009147698
申请日：2009-06-22
申请人：東京応化工業株式会社 , イーティーシステムエンジニアリング株式会社
发明人：彰彦中村 , 純一桂川 , 倫小針 , 保佐々木
IPC分类号： H01L21/683 , H01L21/68
CPC分类号： G01D1/00 , G01D15/00

9. 发明专利

JP2011249640A Semiconductor wafer separation unit 有权
标题翻译：半导体分离单元
公开(公告)号：JP2011249640A
公开(公告)日：2011-12-08
申请号：JP2010122586
申请日：2010-05-28
申请人： Et System Engineering Co Ltd , イーティーシステムエンジニアリング株式会社
发明人： SASAKI TAMOTSU
IPC分类号： H01L21/304 , B28D5/00
CPC分类号： B28D5/0082
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor wafer separation unit for definitely separating sliced wafers one by one and the wafers are not damaged by separation.SOLUTION: The semiconductor wafer separation unit includes a separation tank 1 where a separation liquid containing particles P is circulating. As a result, sludge such as a cooling agent or slicing swarf remaining between sliced wafers are removed from spaces between the wafers and discharged from the bottom of the separation tank 1 as slurry. Additionally, the particles P enter and stay in the spaces between the wafers when the sludge is removed from the spaces between the wafers thereby preventing the wafers from sticking with each other and maintaining a clearance between the wafers constant.
摘要翻译：要解决的问题：为了提供一个一个地明确分离切片晶片的半导体晶片分离单元，并且晶片不会被分离而损坏。解决方案：半导体晶片分离单元包括分离槽1，其中含有颗粒P的分离液体循环。结果，从切片晶片之间留下的诸如冷却剂或切片屑之类的污泥从晶片之间的空间中排出并从分离槽1的底部排出作为浆料。此外，当从晶片之间的空间移除污泥时，颗粒P进入并停留在晶片之间的空间中，从而防止晶片彼此粘附并保持晶片之间的间隙恒定。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP4679890B2 Support plate of Paste equipment 有权
公开(公告)号：JP4679890B2
公开(公告)日：2011-05-11
申请号：JP2004344677
申请日：2004-11-29
申请人：イーティーシステムエンジニアリング株式会社 , 東京応化工業株式会社
发明人：保佐々木 , 淳宮成 , 吉浩稲尾
IPC分类号： H01L21/02 , H01L21/683

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