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1. 发明专利

JP5990619B2 高エネルギー密度および高出力密度を有するバッテリ装置有权
标题翻译：具有高能量密度和高功率密度电池装置
公开(公告)号：JP5990619B2
公开(公告)日：2016-09-14
申请号：JP2015084471
申请日：2015-04-16
申请人：乾坤科技股▲ふん▼有限公司
发明人：陳錦明 , 楊忠晧 , 陳逸駿 , 蔡宏傑 , 温恵玲
IPC分类号： H01G11/54 , H01G11/78 , H01G11/84 , H01G11/10 , H01G11/08 , H01G11/04 , H01M2/14 , H01M10/04 , H01M2/30 , H01M2/02 , H01M2/06 , H01M2/18 , H01M2/16 , H01M2/22 , H01M2/36 , H01M2/26 , H01M2/10 , H01M16/00
CPC分类号： H01M2/1653 , H01M16/00 , H01M2220/30

2. 发明专利

JP5015273B2 Inductor 有权
公开(公告)号：JP5015273B2
公开(公告)日：2012-08-29
申请号：JP2010002331
申请日：2010-01-07
申请人：乾坤科技股▲ふん▼有限公司
发明人：國存 ▲呉▼ , 春條劉 , ▲うぇん▼雄廖 , 明家謝
IPC分类号： H01F27/24

3. 发明专利

JP2012095259A Filter, and layout structure of the same 有权
标题翻译：过滤器及其布局结构
公开(公告)号：JP2012095259A
公开(公告)日：2012-05-17
申请号：JP2011016870
申请日：2011-01-28
申请人： Qiankun Kagi Kofun Yugenkoshi , 乾坤科技股▲ふん▼有限公司
发明人： TSENG SHI-XUAN
IPC分类号： H03H7/01 , H03H7/075
CPC分类号： H03H7/0115 , H03H7/09 , H03H7/1708 , H03H7/1725 , H03H7/1758 , H03H7/1775 , H03H7/38 , H03H7/463 , H03H2001/0085
摘要： PROBLEM TO BE SOLVED: To provide a filter and a layout structure thereof which can meet requirements of advanced standards by providing a turning point to the right of a resonance frequency fof a frequency response.SOLUTION: A filter includes a substrate, a first capacitor, a second capacitor, a third capacitor, a first inductor, a second inductor and a third inductor. The first, second and third capacitors and the first and second inductors are positioned above an upper surface of the substrate. The third inductor is positioned on a side surface of the substrate. First electrodes of the first and third capacitors and a first end of the first inductor are electrically connected to a first end of the filter. A first electrode of the second capacitor, a second electrode of the third capacitor and a first end of the second inductor are electrically connected to a second end of the filter. A first end of the third inductor is electrically connected to second electrodes of the first and second capacitors.
摘要翻译：要解决的问题：通过在共振频率f 0 的右侧提供转向点来提供可以满足高级标准要求的滤波器及其布局结构，的频率响应。滤波器包括衬底，第一电容器，第二电容器，第三电容器，第一电感器，第二电感器和第三电感器。第一，第二和第三电容器以及第一和第二电感器位于衬底的上表面上方。第三电感器位于衬底的侧表面上。第一和第三电容器的第一电极和第一电感器的第一端电连接到滤波器的第一端。第二电容器的第一电极，第三电容器的第二电极和第二电感器的第一端电连接到滤波器的第二端。第三电感器的第一端电连接到第一和第二电容器的第二电极。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2011142232A Inductor 有权
标题翻译：电感器
公开(公告)号：JP2011142232A
公开(公告)日：2011-07-21
申请号：JP2010002331
申请日：2010-01-07
申请人： Qiankun Kagi Kofun Yugenkoshi , 乾坤科技股▲ふん▼有限公司
发明人： RYU SHUNJO , WU GWO-TSWIN , SHA MEIKA , LIAO WEN HSIUNG
IPC分类号： H01F27/24
摘要： PROBLEM TO BE SOLVED: To provide an inductor having at least two different reductions in its inductance. SOLUTION: The inductor 1 includes a first core 10, a second core 12, a projection structure 14, at least two gaps G1, G2, and a wire 16. The first core 10 includes a projection 100. The second core 12 is arranged to face the first core 10. The projection structure 14 projects from the projection 100 of the first core 10 toward the second core 12. The at least two gaps G1, G2 are located between the projection 100 of the first core 10 and the second core 12. The wire 16 winds around at least one of the first core 10 and the second core 12. The wire has a specific resistance value of 1.42 μΩm or lower. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种其电感具有至少两个不同的减小的电感器。解决方案：电感器1包括第一芯10，第二芯12，突起结构14，至少两个间隙G1，G2和导线16.第一芯10包括突起100.第二芯12 布置成面对第一芯10.突起结构14从第一芯10的突起100向第二芯12突出。至少两个间隙G1，G2位于第一芯10的突起100和线16围绕第一芯10和第二芯12中的至少一个缠绕。线的电阻值为1.42μΩm以下。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP4371324B2 Chip fuse and its manufacturing method 有权
公开(公告)号：JP4371324B2
公开(公告)日：2009-11-25
申请号：JP2007015436
申请日：2007-01-25
申请人：乾坤科技股▲ふん▼有限公司
发明人：王鐘雄
IPC分类号： H01H85/048 , H01H69/02 , H01H85/045 , H01H85/046 , H01H85/06 , H01H85/08

6. 发明专利

JP2009200456A Choke coil 审中-公开
标题翻译：选择线圈
公开(公告)号：JP2009200456A
公开(公告)日：2009-09-03
申请号：JP2008099347
申请日：2008-04-07
申请人： Qiankun Kagi Kofun Yugenkoshi , 乾坤科技股▲ふん▼有限公司
发明人： SHA MEIKA , HUANG YI-MIN , HSIEH LAN-CHIN , WANG YUNG-CHIEN
IPC分类号： H01F27/24 , H01F17/06
CPC分类号： H01F17/045 , H01F3/10 , H01F2017/048
摘要： PROBLEM TO BE SOLVED: To provide a choke coil composed of a magnetic core, a coil, and a magnetic material.
SOLUTION: The magnetic core has a first magnetic permeability of about 350 to 1,200. The coil is wound around the magnetic core. The magnetic material covers the coil and has a second magnetic permeability of about 5 to 30 that is smaller than the first magnetic permeability.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供由磁芯，线圈和磁性材料构成的扼流线圈。解决方案：磁芯具有约350至1,200的第一磁导率。线圈缠绕在磁芯上。磁性材料覆盖线圈，并且具有比第一磁导率小的约5至30的第二磁导率。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2009076838A Thermistor chip and manufacturing method thereof 审中-公开
标题翻译：热敏胶片及其制造方法
公开(公告)号：JP2009076838A
公开(公告)日：2009-04-09
申请号：JP2008006777
申请日：2008-01-16
申请人： Qiankun Kagi Kofun Yugenkoshi , 乾坤科技股▲ふん▼有限公司
发明人： O SHOYU , SONG YU LIANG , O TAIRA , TAI I
IPC分类号： H01C7/04
摘要： PROBLEM TO BE SOLVED: To provide a thermistor chip which has superior electric performance, small volume, and low material cost, and a manufacturing method thereof.
SOLUTION: Disclosed is the thermistor chip including a substrate, a first electrode, a second electrode, a thermistor layer and a first buffer layer, the substrate having a first surface. The first electrode is disposed on the first surface, the first buffer layer covers at least a portion of the first electrode, and the thermistor layer covers at least the first buffer layer. The first buffer layer has a fusion point higher the sintering temperature of the thermistor layer and the fusion point of the first electrode, which is electrically connected by the first buffer layer and thermistor layer. The second electrode and the first electrode are disposed at an interval, and electrically connected to the thermistor layer. Further, disclosed is the manufacturing method of the thermistor chip.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供具有优异的电性能，小体积和低材料成本的热敏电阻芯片及其制造方法。解决方案：公开了一种包括基板，第一电极，第二电极，热敏电阻层和第一缓冲层的热敏电阻芯片，所述基板具有第一表面。第一电极设置在第一表面上，第一缓冲层覆盖第一电极的至少一部分，并且热敏电阻层至少覆盖第一缓冲层。第一缓冲层具有使热敏电阻层的烧结温度和通过第一缓冲层和热敏电阻层电连接的第一电极的熔点更高的熔点。第二电极和第一电极以间隔设置，并且电连接到热敏电阻层。此外，公开了热敏电阻芯片的制造方法。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2006332573A Package structure of power module 审中-公开
标题翻译：电源模块的封装结构
公开(公告)号：JP2006332573A
公开(公告)日：2006-12-07
申请号：JP2005209092
申请日：2005-07-19
申请人： Qiankun Kagi Kofun Yugenkoshi , 乾坤科技股▲ふん▼有限公司
发明人： RYU SHUNJO , CHEN DA-JUNG , HAYASHI SHUNRYO , LEE SEIJIN , JO SHINKETSU , WEN CHAU CHUN
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H01L23/49575 , H01L23/4334 , H01L23/49531 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/49 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/19107 , H01L2224/45099 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a package structure of a power module whose reliability is raised. SOLUTION: A control circuit is not directly formed on a substrate, but formed on a circuit board. A possessed substrate area is reduced to save a manufacturing cost, as well as a power element is installed on a material having a high thermal conductivity, and consequently a heat generated by the power element is quickly propagated and diverged. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供可靠性提高的功率模块的封装结构。解决方案：控制电路不直接形成在基板上，而是形成在电路板上。降低了所拥有的基板面积以节省制造成本，并且将功率元件安装在具有高导热性的材料上，并且因此功率元件产生的热量被快速传播和分散。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2006310895A Filter circuit, band pass filter, and method of manufacturing filter circuit 审中-公开
标题翻译：滤波电路，带通滤波器及制造滤波电路的方法
公开(公告)号：JP2006310895A
公开(公告)日：2006-11-09
申请号：JP2004377478
申请日：2004-12-27
申请人： Qiankun Kagi Kofun Yugenkoshi , 乾坤科技股▲ふん▼有限公司
发明人： WANG KENG-HONG , WANG CHUNG-HSIUNG
IPC分类号： H03H7/09 , H01F27/00 , H01G4/40 , H01P1/20 , H01P11/00 , H03H7/075
CPC分类号： H01P1/20381
摘要： PROBLEM TO BE SOLVED: To provide a filter circuit including a thin film layer supported on a substrate serving as a medium layer for a capacitor formed between a top electrode layer and a bottom layer formed above and below the thin film layer. SOLUTION: The top electrode layer of the filter circuit that includes the thin film layer supported on the substrate serving as the medium layer for the capacitor formed between the top electrode layer and the bottom electrode layer formed above and below the thin film layer is patterned into microstrips for functioning as an inductor for the filter circuit. COPYRIGHT: (C)2007,JPO&INPIT

10. 发明专利

JP5923153B2 保護装置有权
标题翻译：保护装置
公开(公告)号：JP5923153B2
公开(公告)日：2016-05-24
申请号：JP2014210266
申请日：2014-09-25
申请人：乾坤科技股▲ふん▼有限公司
发明人：王鐘雄 , 林鴻銘 , 江朗一 , 羅文翔 , 陳國樞
IPC分类号： H01M2/34 , H01H37/76
CPC分类号： H02H5/00 , H01H85/0047 , H01H85/0411 , H01H2085/466 , H01H69/022 , H01H85/0065 , H01H85/046 , H01H85/048 , H01H85/11

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