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    • 90. 发明专利
    • JPS5421538B1
    • 1979-07-31
    • JP5059668
    • 1968-07-19
    • H01C17/08H01C7/00H01C17/12H01C17/28H01L49/02H05K3/30
    • 1,238,504. Resistors. L.C.C.-C.I.C.E. COMPAGNIE EUROPEENNE DE COMPOSANTS ELECTRONIQUES. 18 July, 1968 [19 July, 1967], No. 34408/68. Heading H1S. [Also in Division C7] A method of making tantalum nitride film resistors in the shape of a predetermined pattern α including terminals # on an insulating substrate, e.g. of glass, ceramic or enamelled aluminium, comprises the following steps- (i) Depositing a layer of metal, e.g. by evaporation of copper, on the substrate; (ii) Removing the metal in the shape of the desired pattern, e.g. by using photo-resist techniques; (iii) Covering with a tantalum nitride layer, e.g. by cathodic sputtering to form a compact layer on the exposed substrate and a porous layer on the metal surface; (iv) Finally removing said metal and its porous tantalum nitride covering e.g. by etching. The substrate is made very smooth and chemically reduced or etched by acids to improve nucleation and obtain the necessary compactness of the tantalum nitride deposit on it. The metal surface is activated or oxidized to obtain the opposite effect. Between stages (iii) and (iv) gilded terminals 6 may be produced by coating with non-polymerizable varnish between the lines 5 and evaporating the solvent thus forming a plastics film having superficial cracking. A layer of gold preferably preceded by a layer of chrome or chrome alloy is deposited on the substrate, and said plastics film is removed, leaving gilded zones 6 and 7 of which 7 is removed along with the metal in stage (iv).