会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 82. 发明专利
    • Epoxy resin cast product, its manufacturing method and gas insulating device equipped with epoxy resin cast product
    • 环氧树脂铸造产品,其制造方法和配有环氧树脂铸造产品的气体绝缘装置
    • JP2007021824A
    • 2007-02-01
    • JP2005205141
    • 2005-07-14
    • Toshiba Corp株式会社東芝
    • SHIMAGAMI KEISUKE
    • B29C39/42B29C39/02B29C39/26B29K63/00B29L31/34
    • PROBLEM TO BE SOLVED: To provide an epoxy resin cast product which contains no air bubbles and is made excellent in electric insulating capacity by preventing the sublimation of a curing agent when a resin is injected in the mold within a vacuum chamber, its manufacturing method and a gas insulating device equipped with the epoxy resin cast product.
      SOLUTION: In the manufacturing method of the epoxy resin cast product by injecting a pressurized thermosetting resin in the mold installed in the vacuum chamber under reduced pressure, the degree of vacuum in the vacuum chamber at the time of injection of the thermosetting resin is made higher than the vapor pressure at the temperature at the time of reaction of the thermosetting resin. For example, the vapor pressure in a case that the thermosetting resin at the highest temperature of 170°C at the time of reaction of the thermosetting resin is 100 Torr, the degree of vacuum in the vacuum chamber at the time of injection of the thermosetting resin is set to 150 Torr higher than the vapor pressure of 100 Torr at the highest temperature of 170°C at the time of reaction to inject the thermosetting resin and the injected thermosetting resin is cured to manufacture the epoxy resin cast product for an insulation space or the like.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:为了提供一种不含气泡的环氧树脂铸造产品,并且当在真空室内的模具中注入树脂时,通过防止固化剂的升华而使其具有优异的电绝缘能力, 制造方法和配备有环氧树脂铸造产品的气体绝缘装置。 解决方案:在环氧树脂铸造产品的制造方法中,通过在减压下将真空室中的加压热固性树脂注入到真空室中,在注入热固性树脂时真空室中的真空度 高于热固性树脂反应时的温度下的蒸气压。 例如,在热固性树脂反应时在170℃的最高温度下的热固性树脂为100托的情况下的蒸气压,在注入热固性树脂时的真空室中的真空度 在反应注入热固性树脂时,在最高温度为170℃的温度下将树脂设定为高于100托的蒸气压150托,并将注入的热固性树脂固化以制造用于绝缘空间的环氧树脂浇铸产品 或类似物。 版权所有(C)2007,JPO&INPIT
    • 86. 发明专利
    • JP3815725B2
    • 2006-08-30
    • JP2001393460
    • 2001-12-26
    • B29B9/04B29K61/04B29K63/00B29K67/00B29K79/00
    • PROBLEM TO BE SOLVED: To provide a method for granulating a resin composition molding material which facilitates obtaining uniform sized granules, allows a long continuous run, an excellent productivity and a minimum generation of fine powders at inter-step transfers and after production. SOLUTION: The method conducts following steps in sequence: a sheet formation step to form a molten state molding material into a sheet of a certain thickness and transfer it; a first processing step to obtain parallel works of slender ribbons by parting the transferred sheet into a given width in parallel to the transfer line; a cutting step to cut the works from the first processing step into a given length along the transfer line; a turnaround step to transfer the works from the cutting step with the transfer line turning by 90 degrees from their lengthwise parting lines and; a second processing step to obtain granules by cutting the turned around works into a given width in parallel with the new transfer line. COPYRIGHT: (C)2003,JPO
    • 87. 发明专利
    • Molding method of molded product made of frp having foam core
    • 具有泡沫核心的FRP成型产品的成型方法
    • JP2006218782A
    • 2006-08-24
    • JP2005035389
    • 2005-02-14
    • Toho Tenax Co Ltd東邦テナックス株式会社
    • SHIMA KENTAROONISHI HIROSHI
    • B29C43/20B29K63/00B29K105/04B29K105/08B29L9/00
    • PROBLEM TO BE SOLVED: To provide a method for molding a molded product made of FRP having a foam core, which is used as a molded product made of FRP or its component, with good production efficiency.
      SOLUTION: The molding method of the molded product made of FRP having the foam core is composed of processes of: (1) forming the foam core by a pressurization-compression method using a contracted mold similar to the mold of the target molded product; (2) laying a prepreg along the inner surface of the mold of the molded product, arranging a foamable sheet on the prepreg in a superposed state and subsequently arranging the foam core obtained in the process (1) in the mold of the molded product through the prepreg and the foamable sheet; and (3) heating the mold of the molded product not only to foam the foamable sheet but also to cure the prepreg.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 解决的问题:提供一种成型品,其由具有泡沫芯的FRP制成的成型品成型,该成型体用作由FRP或其成分制成的成型体,生产效​​率良好。 解决方案:由具有泡沫芯的FRP制成的成型体的成型方法由以下工艺组成:(1)使用类似于目标模塑的模具的收缩模具通过加压压缩法形成泡沫芯 产品; (2)沿着成形品的模具的内表面铺设预浸料坯,将发泡片材叠置在预浸料坯上,然后在工艺(1)中获得的泡沫芯材在模制品的模具中通过 预浸料和发泡片; 和(3)加热模塑制品的模具不仅使可发泡片材发泡,而且固化预浸料。 版权所有(C)2006,JPO&NCIPI
    • 88. 发明专利
    • Photoelectric unit
    • 光电单元
    • JP2006173475A
    • 2006-06-29
    • JP2004366354
    • 2004-12-17
    • Stanley Electric Co Ltdスタンレー電気株式会社
    • KANECHIKA MASAYUKI
    • B29C45/02B29C45/14B29K63/00B29K105/20B29L9/00B29L31/34H01L21/56H01L31/02H01L33/12H01L33/54H01L33/56
    • H01L2224/48091H01L2224/48227H01L2924/00014
    • PROBLEM TO BE SOLVED: To solve the problem that in a conventional photoelectric unit, the thermal expansion coefficient difference between the component forming a substrate 2 for elements and the component forming a casing is so large that exfoliation occurs in a reflow furnace when it is mounted e.g. on an equipment substrate. SOLUTION: In this photoelectric unit 1, a photoelectric element, and an electronic circuit 4 for carrying out the driving of the photoelectric element or signal processing as needed are mounted on the substrate 2 for elements, and the casing 5 covering the photoelectric element and the electronic circuit is integrally formed according to transfer molding of epoxy resin. In this photoelectric unit 1, a stress relaxation portion 6 consisting of a highly elastic resin is formed beforehand in the part of the circuit substrate into which the stress is concentrated upon the curing of the epoxy resin or the part of the substrate for elements where the concentration of the stress is to be avoided, prior to the execution of the transfer molding for the substrate for elements. COPYRIGHT: (C)2006,JPO&NCIPI
    • 解决的问题为了解决现有的光电单元的问题,形成元件用基板2的部件与形成外壳的部件之间的热膨胀系数差大到在回流炉中发生剥离, 它被安装例如 在设备基板上。 解决方案:在该光电单元1中,用于执行光电元件的驱动或需要的信号处理的光电元件和电子电路4安装在用于元件的基板2上,并且覆盖光电元件的壳体5 元件和电子电路根据环氧树脂的传递模塑一体形成。 在该光电单元1中,预先在电路基板的部分中形成由环氧树脂或元件的基板的固化部分在应力集中的部分中的高弹性树脂构成的应力松弛部6, 在执行元件用基板的传递模塑之前,应避免应力集中。 版权所有(C)2006,JPO&NCIPI