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    • 83. 发明专利
    • ELECTRON EMITTING ELEMENT
    • JP2001015010A
    • 2001-01-19
    • JP18654899
    • 1999-06-30
    • TOSHIBA CORP
    • ONO TOMIOSAKAI TADASHICHO TOSHI
    • G09G3/10H01J1/304
    • PROBLEM TO BE SOLVED: To provide an electron element for separating a short-circuit portion speedily and certainly, by dividing the element having many emitters as a plurality of blocks, and electrically separating a short-circuit block by an active element that automatically suppresses current during a short circuit between an emitter and a gate. SOLUTION: A portion sandwiched by two island-like p-type regions 52 forms a so called joint field-effect transistor(JFET), and an electrode 59 forms a short- circuit state between a source electrode and a gate electrode of the JFET. A voltage of a drain equals to a supply voltage and a source voltage during a short circuit between an emitter and a gate is null, so that saturated current flows. During normal operation only a slight part of an emitter current flows as a gate current, so that the source voltage decreases slightly than the supply voltage. The saturated current can be decreased by shortening a gap between the p-type regions 52 and increasing the length in the current flow direction to electrically separate a short-circuit block.
    • 88. 发明专利
    • ELECTRON EMISSION DEVICE
    • JPH07335116A
    • 1995-12-22
    • JP13148894
    • 1994-06-14
    • TOSHIBA CORP
    • SAKAI TADASHIONO TOMIONAKAMURA HIROYUKITANAMOTO TETSUSHINAKAMOTO MASAYUKI
    • H01J9/02H01J1/30H01J1/304
    • PURPOSE:To provide an electron emission device capable of emitting electrons with high intensity and uniformity by forming an electron emission cathode of a conductor region in the gap of fine skeletons formed on the main surface of a semiconductor board. CONSTITUTION:A silicon nitride film 2 is formed on one main surface of a silicon board 1, and an aluminium electrode 3 is deposited on the other main surface. The silicon board other than a part for forming an electron emission cathode is covered with an acid resistant protection film, and anodically formed in a hydrofluoric acid family etching solution to form silicon fine skeletons 4. Porous silicon obtained has the three dimensionally extended silicon fine skeletons 4, and gaps 5 exist between them. Anodic oxidation is conducted in a non-etching electrolyte solution by using silicon as an anode to form an anode oxide film 6 on the surface of the silicon fine skeleton 4. By using nickel for a conductor, a conductor region 7 is formed in the gap 5. Nickel electrodes 8 serving as electrodes in the conductor region 7 are arranged at both ends of a device by utilizing continuity in the lateral direction of the conductor region 7 to complete an electron emission device.