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    • 81. 发明专利
    • Resistor and its production process, and electronic component
    • 电阻及其生产过程和电子元件
    • JP2005209748A
    • 2005-08-04
    • JP2004012492
    • 2004-01-20
    • Tdk CorpTdk株式会社
    • TANAKA HIROBUMIIGARASHI KATSUHIKO
    • H01C17/06H01C7/00
    • PROBLEM TO BE SOLVED: To obtain a resistor using resistor paste of lead-free composition system in which variation in characteristics due to a substrate is suppressed. SOLUTION: The resistor is produced by baking resistor paste containing a glass composition, a conductive material and an additive on a substrate. When the cross-section is viewed in a region within 200 nm from the substrate particle, the ratio of area composed of the conductive material is less than 20% and the reminder is composed of the glass composition and the additive. Mean distance between the substrate particle and the conductive material is 100 nm or more. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:为了获得使用阻止由于基板引起的特性变化的无铅组合物系统的电阻浆料获得电阻器。 解决方案:电阻器通过在基板上包含玻璃组合物,导电材料和添加剂的电阻器糊料制成。 当从基板颗粒在200nm以内的区域观察截面时,由导电材料构成的面积的比例小于20%,并且提醒由玻璃组合物和添加剂组成。 基板颗粒和导电材料之间的平均距离为100nm以上。 版权所有(C)2005,JPO&NCIPI
    • 83. 发明专利
    • Resistor paste, resistor, and electronic component
    • 电阻浆,电阻和电子元件
    • JP2005209746A
    • 2005-08-04
    • JP2004012487
    • 2004-01-20
    • Tdk CorpTdk株式会社
    • TANAKA HIROBUMIIGARASHI KATSUHIKO
    • H01C7/00H01B1/20
    • PROBLEM TO BE SOLVED: To provide a resistor paste having an ultra high resistance not lower than 1 MΩ/square in which variation of resistance can be suppressed and short time overload (STOL) characteristics can be improved. SOLUTION: The resistor paste contains at least a conductive material and a glass composition mixed with an organic vehicle. The conductive material contains a composite oxide of Lu and Ru. Preferably, the composite oxide of Lu and Ru is Lu 2 Ru 2 O 7 . Preferably, the conductive material further contains at least one kind selected from RuO 2 and other Ru based composite oxides. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种电阻器,其具有不低于1MΩ/□的超高电阻,其中可以抑制电阻的变化,并且可以提高短时间过载(STOL)特性。 电解质浆料至少含有与有机载体混合的导电材料和玻璃组合物。 导电材料含有Lu和Ru的复合氧化物。 优选地,Lu和Ru的复合氧化物是Lu 7 。 优选地,导电材料还包含选自RuO 2 SBB和其它Ru基复合氧化物中的至少一种。 版权所有(C)2005,JPO&NCIPI
    • 84. 发明专利
    • Thick film resistor paste, thick film resistor, electronic component
    • 厚膜电阻,厚膜电阻,电子元件
    • JP2005209744A
    • 2005-08-04
    • JP2004012484
    • 2004-01-20
    • Tdk CorpTdk株式会社
    • IGARASHI KATSUHIKOTANAKA HIROBUMI
    • H01C7/00
    • PROBLEM TO BE SOLVED: To provide a high resistance lead-free thick film resistor exhibiting excellent temperature characteristics (TCR) without employing any additive. SOLUTION: The thick film resistor paste and the thick film resistor contain at least one kind of RuO 2 and an Ru composite oxide as a conductive material, and contain a glass composition. They have a resistance not lower than 10 kΩ/square. The conductive material and the glass composition are composed with such a compositional ratio as 14-70 wt% of conductive material, 4-15 wt% of B 2 O 3 , 2-11 wt% of SiO 2 , 8-35 wt% of BaO, 1-12 wt% of MgO, 0.5-6 wt% of ZnO, 3-15 wt% of Al 2 O 3 , and 0.5-5 wt% of CaO. The Ru composite oxide is at least one kind selected from RuO 2 , CaRuO 3 , SrRuO 3 , BaRuO 3 , and Bi 2 Ru 2 O 7 . COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供不使用任何添加剂的具有优异的温度特性(TCR)的高电阻无铅厚膜电阻器。

      解决方案:厚膜电阻浆料和厚膜电阻器含有至少一种RuO 2 和Ru复合氧化物作为导电材料,并含有玻璃组合物。 它们的电阻不低于10kΩ/平方。 导电材料和玻璃组合物的组成比例为导电材料的14-70重量%,B 2 3 4-15重量% -11重量%的SiO 2 ,8-35重量%的BaO,1-12重量%的MgO,0.5-6重量%的ZnO,3-15重量%的Al 3 和0.5-5重量%的CaO。 Ru复合氧化物是选自RuO 2 SB 3,CaRuO 3,SBR 3,SbR 3 O 3,SBR 3 O 3,SBR 3, ,和Bi 2 2 7 。 版权所有(C)2005,JPO&NCIPI

    • 86. 发明专利
    • Glass composition, thick film resistor paste using it, thick film resistor, electronic component
    • 玻璃组合物,厚膜电阻使用它,厚膜电阻,电子元件
    • JP2005209741A
    • 2005-08-04
    • JP2004012480
    • 2004-01-20
    • Tdk CorpTdk株式会社
    • IGARASHI KATSUHIKOTANAKA HIROBUMI
    • H01C7/00
    • PROBLEM TO BE SOLVED: To provide a glass composition capable of realizing a low resistance lead-free thick film resistor exhibiting excellent temperature characteristics (TCR) in which aging is suppressed. SOLUTION: The glass composition contains CaO, B 2 O 3 , SiO 2 and MnO and has compositional ratio of 10-30 wt% of CaO, 25-40 wt% of B 2 O 3 , 15-30 wt% of SiO 2 , and 10-40 wt% of MnO. The glass composition is mixed with an organic vehicle together with a conductive material to produce thick film resistor paste. The thick film resistor paste contains at least one kind selected from CuO, Cu 2 O, MnO 2 , Mn 3 O 4 , V 2 O 5 , GaO, Dy 2 O 3 , Sm 2 O 3 , Lu 2 O 3 , La 2 O 3 , ZnO, and Bi 2 O 3 as an additive. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种能够实现具有优异的耐老化性的温度特性(TCR)的低电阻无铅厚膜电阻器的玻璃组合物。

      解决方案:玻璃组合物含有CaO,B 2 3 ,SiO 2 和MnO,组成比为10-30wt CaO的比例为25-40重量%,B 2 3 ,15-30重量%的SiO 2 SB 2,和10-40重量% %的MnO。 将玻璃组合物与导电材料一起与有机载体混合以产生厚膜电阻膏。 厚膜电阻膏包含选自CuO,Cu 2 O,MnO 2 ,Mn 3 O 4 < / SB>,V 2 5 ,GaO,Dy 2 3 / SB> O 3 ,Lu 2 3 ,ZnO和Bi O 3 SB 3作为添加剂。 版权所有(C)2005,JPO&NCIPI

    • 87. 发明专利
    • Solder composition
    • 焊接组合物
    • JP2005125408A
    • 2005-05-19
    • JP2004351198
    • 2004-12-03
    • Mitsui Mining & Smelting Co LtdTdk CorpTdk株式会社三井金属鉱業株式会社
    • IGARASHI KATSUHIKOTANAKA HIROBUMISOTOMI TORUNINOMIYA RYUJIMATSUNAGA JUNICHI
    • B23K35/22B23K35/30C22C13/00H05K3/34
    • PROBLEM TO BE SOLVED: To provide a solder composition which is lead-free and forms an alloy having a melting point higher than that of the composition by forming the alloy during reflow soldering, and as a result can carry out soldering under almost the same temperature condition even when the soldering is further carried out on an already soldered substrate.
      SOLUTION: The soldering composition does not contain lead, but contains a first metal component and a second metal component. The first metal component is Sn-3.5 Ag and the second metal component is Ag. The ratio of the first metal component to the second metal component is determined such that the second metal component can diffuse in the molten first metal component during the reflow soldering, and then can produce the alloy having the melting point higher than that of the composition by alloying.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:为了提供无铅焊料组合物,通过在回流焊接期间形成合金,形成熔点高于组合物的合金,结果可以在几乎可以进行焊接 即使在已焊接的基板上进一步进行焊接也是相同的温度条件。 焊料组合物不含铅,但含有第一金属组分和第二金属组分。 第一金属成分为Sn-3.5 Ag,第二金属成分为Ag。 确定第一金属组分与第二金属组分的比例,使得第二金属组分可以在回流焊接期间在熔融的第一金属组分中扩散,然后可以通过以下方式制备熔点高于组成的合金: 合金。 版权所有(C)2005,JPO&NCIPI
    • 88. 发明专利
    • Resistor and electronic component
    • 电阻和电子元件
    • JP2005123584A
    • 2005-05-12
    • JP2004240051
    • 2004-08-19
    • Tdk CorpTdk株式会社
    • TANAKA HIROBUMIIGARASHI KATSUHIKO
    • H01C7/00
    • PROBLEM TO BE SOLVED: To provide a lead-free resistor having a high resistance value and yet a small short-time overload (STOL). SOLUTION: This resistor has a resistor layer on a substrate and is obtained by forming a glass material containing CaO and B 2 O 3 without containing lead substantially, an electrically conductive material without containing lead substantially, and a resistor paste containing an organic vehicle on the substrate, and then carrying out baking at a temperature of 830-870°C for 5-15 minutes. When the cross-section in the thickness direction of the resistor layer is observed with a transmission electron microscope (TEM), the area occupied by a crystal material CaB 2 O 4 deposited in the resistor layer in the observed cross-section is less than 30.0% of the area of the resistor layer in the observed cross-section. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供具有高电阻值和小的短时过载(STOL)的无铅电阻器。 解决方案:该电阻器在基板上具有电阻层,并且通过形成含有CaO和B O 3 的玻璃材料而不含铅,而不含电 基本上不含铅的导电材料和在基板上含有有机载体的电阻浆料,然后在830-870℃的温度下进行烘烤5-15分钟。 当用透射电子显微镜(TEM)观察电阻层的厚度方向的截面时,沉积的结晶材料CaB <2> 所占的面积 在电阻层中观察到的截面积小于观察截面电阻层面积的30.0%。 版权所有(C)2005,JPO&NCIPI
    • 90. 发明专利
    • Composite electronic component
    • JP2004241521A
    • 2004-08-26
    • JP2003027802
    • 2003-02-05
    • Tdk CorpTdk株式会社
    • TANAKA HIROBUMIIGARASHI KATSUHIKO
    • H01G4/40
    • PROBLEM TO BE SOLVED: To provide a composite electronic component that is high in mountability and reliability though its resistance value can be adjusted easily.
      SOLUTION: This composite electronic component has a laminate formed by alternately laminating first and second internal electrode layers upon another with dielectric layers in between. In the laminate, only one first internal electrode layer has a resistor connection connected to one external electrode through a protruded section for outside connection exposed on one end face of the laminate and exposed on the side face of the laminate. In addition, only another first internal electrode layer has a protruded section for inside connection exposed on the end face and a resistor connection exposed on the side face. The other first internal electrode layers have protruded sections for inside connection exposed on the end face and the exposed surfaces of a plurality of protruded sections for inside connection are connected to each other through a connecting member provided on the end face. In addition, insulating layers are interposed between the connecting members and external electrodes and the second internal electrode layers are led out to the other end face of the laminate and connected to the other external electrode and the two resistor connections exposed on the side faces are connected to each other through a resistor which is set in a state where the resistor does not come into contact with the external electrodes.
      COPYRIGHT: (C)2004,JPO&NCIPI