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81. 发明专利

JPS59223174A FILLER METAL FEEDING DEVICE 失效
公开(公告)号：JPS59223174A
公开(公告)日：1984-12-14
申请号：JP9974783
申请日：1983-06-02
申请人： MITSUBISHI ELECTRIC CORP
发明人： HIRAMOTO MASATAKE , KAWAGUCHI KENJI , HAMADA OSAMU
IPC分类号： B23K9/12 , B23K9/04 , B23K35/02
摘要： PURPOSE:To stably and continuously feed a filler metal prepared in the form of pellets without slipping, by feeding the pellets by means of grooved rollers provided with rubber lining. CONSTITUTION:Pellets 21 are introduced to a pellet guide 82 by means of feeding devices, such as parts feeder, etc., and sent to a rod guide 8 by the drive rollers 51 of a filler metal feeding device 5. The drive roller 51 is composed of two sections, a main body 511 section and lining section 512 forming a grooved section, and the lining section 512 is made of rubber. Therefore, the pellets are drawn into the space between the drive rollers 51 without slipping, and thus, the pellet feeding can be performed stably and continuously.

82. 发明专利

JPS5717329A WORKING METHOD OF PIPE, ETC. 失效
公开(公告)号：JPS5717329A
公开(公告)日：1982-01-29
申请号：JP9197580
申请日：1980-07-02
申请人： MITSUBISHI ELECTRIC CORP
发明人： SHIMADA WATARU , KAWAGUCHI KENJI , HAMADA OSAMU
IPC分类号： B21D22/10 , B21D26/00 , B21D26/033 , B21D41/02
摘要： PURPOSE:To eliminate occurrences of wave-shaped wrinkles in the direction of axis at the outer circumferential surface of expanded part of pipes, by maintaining the front end of materials to be worked with an elastic body which is sufficiently small at the front end, so that the front end of materials to be worked does not touch a stool, in an elastoforming method in which a liquid of materials to be worked, such as pipe, etc., is charged. CONSTITUTION:A pipe to be worked M is inserted into the opened part of a metallic mold 1, and an elastic body 5 which is formed in such a way that the diameter at the front end part 5a may become smaller than the inner diameter of the pipe M, is inserted into the pipe M. The pipe M is maintained so that its lower end will not touch a stool 2. This condition is maintained not only before the working is started, but also during the course of working. Therefore, even when the pipe M works downward together with the elastic body 5 at the initial stage of working, no compressive force is applied to the pipe M in the direction of axis. Moreover, even when the cross section of the elastic body 5 in the cavity of the expanded pipe is increased at the middle stage of working, the diameter of the front end part 5a will not exceed the inner diameter of pipe M. As a result, the lower end of the pipe M will not be pushed up by the front end part 5a.

83. 发明专利

JPS5611113A FORMING APPARATUS BY RUBBER PRESSURE 失效
公开(公告)号：JPS5611113A
公开(公告)日：1981-02-04
申请号：JP8776479
申请日：1979-07-11
申请人： MITSUBISHI ELECTRIC CORP
发明人： SHIMADA WATARU , TAMURA YOSHIO , KAWAGUCHI KENJI , HAMADA OSAMU
IPC分类号： B21D22/10 , B21D22/20
摘要： PURPOSE:To make the sufficient metal inflow possible to be simply caused without risk of causing cracks and tears, by forming the oblique plane of an angle required for supporting the formed thin steel sheet, at the circumferential edge of the open mouth of the cavity of the forming die. CONSTITUTION:The oblique plane 1d of an angle of theta 20-45 deg. inclination is formed at the circumferential edge of the open mouth of the cavity 1a of the forming die 1. The outer diameter of the pressuring rubber 4 is made equal to the outer diameter of the formed thin sheet 2 plus 2-10mm., and the inner diameter of the container 3 is made equal to the rubber's outer diameter plus 10-30mm.. At first, the thin sheet 2 is arranged at the specified position in the oblique plane 1d of the sheet pressing block; next, the rubber 4 and the container 3 are set on the thin sheet 2, and the ram 5 is brought down; hereby, the rubber 4 is compressed to cause a deformation and goes down along the oblique plane 1d and contacts with the thin sheet 2. At this point, the rubber pressure generates a false hydrostatic pressure effect and its pressure direction is divided into one perpendicular to the oblique plane 1d and another one directing downward in the cavity 1a. The former pressure acts as the punch to press the sheet 2 and the latter pressure acts as the punch to feed the sheet downward, and hereby, the formed product of the same shape as the cavity 1a is obtained.

84. 发明专利

JP2001298134A BYPASS DIODE AND SOLAR BATTERY MODULE 失效
公开(公告)号：JP2001298134A
公开(公告)日：2001-10-26
申请号：JP2000113604
申请日：2000-04-14
申请人： MITSUBISHI ELECTRIC CORP
发明人： KAWASAKI NAOSHIGE , NONOGAKI MITSUHIRO , HAMADA OSAMU
IPC分类号： H01L23/36 , H01L31/042
摘要： PROBLEM TO BE SOLVED: To provide a bypass diode for reducing heating temperatures by mounting a heat radiation fin and a solar battery module for reducing the heating temperature by mounting the heat radiating fin. SOLUTION: A heat-radiating fin is joined by solder to the bypass diode having a lead, and the heat-radiating fin is integrated in the solar battery module or joined to the frame through an ending sealing member. Then, the heating temperature can be limited.

85. 发明专利

JPH10294544A FLEXIBLE WIRING BOARD, ITS CONNECTION METHOD, CONNECTION STATE CHECK METHOD, ITS CHECK DEVICE, AND ITS CONNECTION DEVICE 失效
公开(公告)号：JPH10294544A
公开(公告)日：1998-11-04
申请号：JP10169897
申请日：1997-04-18
申请人： MITSUBISHI ELECTRIC CORP
发明人： KIMURA SUSUMU , UMADONO SHINJI , SASAKI HIROSHI , SAKAGAMI YUKINOBU , HAMADA OSAMU
IPC分类号： G01D21/00 , G01N21/88 , G01N21/956 , H05K1/14 , H05K3/34 , H05K3/36 , H05K3/42
摘要： PROBLEM TO BE SOLVED: To enhance soldered connections in reliability so as to prevent a flexible wiring board fro deteriorating in quality by a method wherein the connection terminal of a multilayered rigid wiring board and the corresponding connection terminal of the flexible wiring board connected to a land through the intermediary of a metal plating provided inside the through-hole of the flexible wiring board are connected together. SOLUTION: The connection terminal 11 of a flexible wiring board 10 is positioned to the connection terminal 8 of a multilayered rigid wiring board 8, and the terminals 8 and 11 are made to overlap with each other through the intermediary of a solder plating 9. A heating tool 16 is made to bear against the land 12 of the flexible wiring board 10 and pressed against it to heat. By this setup, heat released from the heating tool 16 is transmitted to the connection terminal 11 through the intermediary of a metal plating 14 inside a through-hole 13 and furthermore to the solder plating 9 to melt it, molten solder comes into close contact with both the connection terminals 8 and 11 and moreover flows into the through-hole 13, and the connection terminals 8 and 11 are electrically connected together. This connection is surely carried out because a heat transmission path is lessened in heat resistance and improved in heat transmission efficiency to surely melt the solder plating 9.

86. 发明专利

JPH07262902A ELECTRIC LEAKAGE BREAKER 失效
公开(公告)号：JPH07262902A
公开(公告)日：1995-10-13
申请号：JP5422594
申请日：1994-03-24
申请人： MITSUBISHI ELECTRIC CORP
发明人： HAMADA OSAMU , NAKAOJI TOSHITAKA , KIMURA TOSHIFUMI , ADACHI EINOSUKE , HAMAGUCHI TSUNEO
IPC分类号： H01H83/02
摘要： PURPOSE:To reduce internal wiring work during assembling, enable assembling in one direction, and improve functionality by integrally arranging a load side terminal, an eddy current trip mechanism part, an opening and closing mechanism part, a movable contact part, and the others on the surface of a support member made of synthetic resin and attaching an electric leakage control part to the rear surface part. CONSTITUTION:First a zero phase current transformer 26 is mounted on a support member 41 made of synthetic resin via a protrusion part 41d, and a load side terminal 3 and an eddy current trip mechanism part 4 are mounted on the member 41. Then the ends of cables 6 and 7 led out of a through hole 26a and the ends of movable contact parts 18 and 17 are connected together by welding or brazing and mounted on the member 41 through a press member 42. Next a test switch part 8, opening and closing mechanism 11, and an electric leakage trip mechanism part 12 are mounted on the member 41, connectors 44 and 40, 45 and 38, and 46 and 39 are connected to each other in rospective pairs, and then an electric leakage control part 36 is mounted on the member 41 via a claw part 41C. The member 41 in which respective parts are incorporated, namely an internal element part 35 is incorporated in a main body case 43 via a recessed part 43b, an upper case 1 is mounted, and thus assembling is completed.

87. 发明专利

JPH06252325A INTEGRATED CIRCUIT PACKAGE AND PACKAGING METHOD FOR SAME, AND DECIDING METHOD FOR LEAD SHAPE AND COMPUTING METHOD FOR LEAD DEFORMATION TOLERANCE 失效
公开(公告)号：JPH06252325A
公开(公告)日：1994-09-09
申请号：JP3505793
申请日：1993-02-24
申请人： MITSUBISHI ELECTRIC CORP
发明人： KIMURA TOSHIFUMI , HAMADA OSAMU , NAKAOJI TOSHITAKA
IPC分类号： H01L23/50 , H05K13/04
摘要： PURPOSE:To stabilize the normal contact state by a method wherein the lead deforming process by the contact operation between the lead and a pad is computed in the state wherein the rear surface of a package is bonded onto a printed substrate so that the lead shape making a specific angle of the pad with the lead junction surface may be decided. CONSTITUTION:Within the title lead deformation tolerance computing method, a lead as a cantilever having the side of a package body as a supporting part is to be successively deformed since the lead end previously making an angle of about +70 deg. with a pad is brought into contact with the pad so as to compute the press down amount K1 as the lead deformation amount when the angle of the lead junction surface made with the pad is leveled with the pad (53-55). Furthermore, the heel part of the lead is pushed upward so as to compute the pushed, up amount K2 when the lead junction surface is paralleled with the pad surface (56-58). Finally, this position is further pushed upward so as to compute the pushed up amount K3 when the angle of the lead junction surface made with the pad becomes -7 deg. (59-61) thereby enabling the lead deformation tolerance to be computed by the following formula i.e. z=(K+(k2+3)).

88. 发明专利

JPH06224547A PRINTED WIRING BOARD, AND METHOD AND APPARATUS FOR FLATTENING PAD THEREOF 失效
公开(公告)号：JPH06224547A
公开(公告)日：1994-08-12
申请号：JP1144093
申请日：1993-01-27
申请人： MITSUBISHI ELECTRIC CORP
发明人： HAMADA OSAMU , KIMURA TOSHIFUMI , KIMURA SUSUMU , TAO KOICHI , MOTOHASHI MASAYA
IPC分类号： H05K3/34 , H05K3/00
摘要： PURPOSE:To make all upper faces at pads flat regardless of a warp in a printed wiring board or a deviation in height at the face of pads. CONSTITUTION:A roller 33 having a working face on a boundary part thereof is pushed to an upper face 6 of a pad in a printed wiring board body 1. The roller 33 is slid and rotated on a formation face of the pad. In this case, the upper face 6 of the pad is flattened when the roller 33 is rotated, and thereby the flattening step can be carried out for each pad. As a result, all the faces of pads are made flattened uniformly with small pushing force.

89. 发明专利

JPH05315498A MOLDING OF OUTER LEAD OF ELECTRONIC COMPONENT AND MOLDING DEVICE 失效
公开(公告)号：JPH05315498A
公开(公告)日：1993-11-26
申请号：JP11603292
申请日：1992-05-08
申请人： MITSUBISHI ELECTRIC CORP
发明人： HAMADA OSAMU , KIMURA TOSHIFUMI
IPC分类号： B21D5/01 , H01L23/50
摘要： PURPOSE:To obtain an electronic component outer lead molding method for performing a bend molding on the outer leads of an electronic component, such as an IC, with high precision and a molding device. CONSTITUTION:A molding device is constituted of a die 6 having support parts 6b for supporting base end parts 2a of outer leads 2 of an electronic component (an IC substrate) 1 and molding surfaces 6c for performing a bend molding on the leads 2, a lead press 4 for holding the base end parts 2a of the leads 2 in opposition to the support parts 6b of this die 6, elastic body punches 7, which are provided in opposition to the molding surfaces 6c of the die 6 and respectively have a tapered part 7b on each molding surface 6c, and pressing tools 8 for pressing these punches 7.

90. 发明专利

JPH04359589A CORRECTING METHOD FOR PRINTED WIRING BOARD-INTEGRATED MOLDED FORM 失效
公开(公告)号：JPH04359589A
公开(公告)日：1992-12-11
申请号：JP13482191
申请日：1991-06-06
申请人： MITSUBISHI ELECTRIC CORP
发明人： HAMADA OSAMU , KIMURA TOSHIFUMI
IPC分类号： B29C45/14 , B29C53/18 , B29K105/20 , B29L31/34 , H05K3/22
摘要： PURPOSE:To obtain a method for correcting a printed circuit board-integrated molded form, in which warpage of a housing can be reduced after an integral molding. CONSTITUTION:A warpage of a housing 1 molded integrally with a printed wiring board 2 is mounted between an upper mold 6 and a lower mold 10 in which many fine protrusions 11 are formed on a surface, and the mold 6 is pressed by a pressing device 8 in a state that vibration is applied to the mold 10 by an ultrasonic vibrator 12 to correct the warpage.

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