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    • 87. 发明专利
    • VACUUM CLEANER
    • JP2001224535A
    • 2001-08-21
    • JP2000037845
    • 2000-02-16
    • MATSUSHITA ELECTRIC IND CO LTD
    • FUJIWARA YASUFUMIHAYASHI NOBUHIRO
    • A47L9/02
    • PROBLEM TO BE SOLVED: To provide a vacuum cleaner having a suction body to be connected to a suction tube to which suction force of an electric blower is applied capable of introducing outer air into a dust passage for reducing adsorption between a case and a cleaning surface, and reducing operation force to improve usability in the case of cleaning a low gap under a shelf or a narrow gap between furniture pieces. SOLUTION: A suction body 1 is connected to a suction tube to which suction force of an electric blower is applied, the suction body 1 has a suction port 5 to suck dusk, a pipe 13 to connect a dust passage 6 to the suction tube side is installed on a lower case 3 and an upper case 2 having the dust passage 6 communicated with the suction port 5 to be capable of inclining, and outer air is introduced into the dust passage 6 through a front shutter 16 and a side shutter 19 in accordance with inclination of the pipe 13. The front shutter 16 and the side shutter 19 introduce outer air into the dust passage 6 when the pipe 13 is inclined in such a way that its angle to the upper case 2 and the lower case 3 is large.
    • 88. 发明专利
    • MANUFACTURE OF PRINTED BOARD UNIT
    • JPH11233981A
    • 1999-08-27
    • JP3094998
    • 1998-02-13
    • MATSUSHITA ELECTRIC IND CO LTD
    • KITAGAWA AKIHIROHAYASHI NOBUHIRO
    • H05K7/12H01L23/36H05K1/18H05K3/32H05K3/34H05K7/20
    • PROBLEM TO BE SOLVED: To facilitate the mounting of a heat radiating board and a semiconductor element to a printed wiring board by mounting tightly the semiconductor on heat radiating board for radiating heat from the semiconductor element, screwing them, and soldering the screw and the lead part of the semiconductor element. SOLUTION: A semiconductor element 1 is mounted on a heat radiating board 2 with a screw hole for radiating a heat from the semiconductor element, by inserting a screw 3 into a hole for fitting the heat radiation board in the semiconductor element 1 and a hole provided on the heat radiation board 2, from the side of the semiconductor element 1 and tightening it, so that a semiconductor unit 4 is manufactured in advance. The screw 3 and lead part of the semiconductor element 1 can be soldered merely by placing them on a printed wiring board. The in-advance completed semiconductor unit 4 is mounted to the printed wiring board through manual insertion of robot, etc., in the final step before soldering, and the lead part 6 of the semiconductor element 1 and the projecting part of the screw 3 projecting from the surface of the printed wiring board 5 are soldered 10.