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    • 81. 发明专利
    • Proton conductor and method of manufacturing the same
    • 原型导体及其制造方法
    • JP2009110716A
    • 2009-05-21
    • JP2007279431
    • 2007-10-26
    • Mitsui Mining & Smelting Co Ltd三井金属鉱業株式会社
    • HOSHINO KAZUTOMOKUNISAKI TOSHIYATAKAHASHI KAZUAKI
    • H01B1/06C01B25/37H01B1/08H01B13/00H01M8/02H01M8/10
    • Y02P70/56
    • PROBLEM TO BE SOLVED: To provide a proton conductor that has proton conductivity equivalent to or better than a conventional phosphate type proton conductor, and that is easy to be taken out of a reaction vessel and to carry out operation such as crushing after taking out, thereby providing a superior handleability. SOLUTION: The proton conductor has Al 3+ and/or Ca 2+ doped in TiP 2 O 7 . The proton conductor is suitably manufactured by crushing titanium compounds as well as aluminum compounds and/or calcium compounds in a ball mill so as a mean particle size to be 3 μm or less, mixing the crushed titanium compounds as well as the aluminum compounds and/or calcium compounds with phosphoric acid aqueous solution, and heating while stirring that mixed solution to make it gel-like, and heating that gel up to 400 to 800°C. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供具有等于或优于常规磷酸盐型质子导体的质子传导性的质子导体,并且容易从反应容器中取出并进行诸如粉碎后的操作 取出,从而提供优异的可操作性。 解决方案:质子导体具有在TiP 2 SB 7中掺杂的Al 3 + 和/或Ca 2 + SB>。 质子导体适当地通过在球磨机中粉碎钛化合物以及铝化合物和/或钙化合物来制造,以使平均粒径为3μm以下,混合破碎的钛化合物以及铝化合物和/ 或钙化合物与磷酸水溶液混合,并在搅拌下加热混合溶液使其呈凝胶状,并将该凝胶加热至400至800℃。 版权所有(C)2009,JPO&INPIT
    • 90. 发明专利
    • Material for electronic component firing
    • 电子元件闪光材料
    • JP2003073183A
    • 2003-03-12
    • JP2001340518
    • 2001-11-06
    • Mitsui Mining & Smelting Co Ltd三井金属鉱業株式会社
    • IZUTSU YASUHISAUCHIDA TOMIHIROHOSHINO KAZUTOMO
    • C04B41/87C04B35/64H01G13/00
    • PROBLEM TO BE SOLVED: To provide a material for electronic component firing prepared by covering the surface of a substrate with a zirconia layer, which can solve the problems of exfoliation of the zirconia layer and lack of strength thereof being found in a conventional material and can be produced economically. SOLUTION: This material for electronic components firing is prepared by covering a brick or porcelainous substrate with the zirconia layer which is formed by bonding coarse zirconia particles having an average particle diameter of 30-500 μm and fine particles having the average diameter of 0.1-10 μm with a partially melting binder comprising two or more metal oxides. In this case, the weight ratio of the coarse particle to the sum of the fine particle and binder is made to be 75:25 to 25:75, and that of the binder to the sum of the coarse/fine particles and binder is regulated to be 0.5% or more but less than 3%. By firing the coarse particles or the mixture of coarse and fine particles using the binder comprising yttrium oxide and aluminum oxide, the bonding strength of the zirconia layer and the adhesiveness thereof to the substrate can be improved, thus obtaining the high performance material for electronic component firing.
    • 要解决的问题:提供一种通过用氧化锆层覆盖基材表面而制备的电子元件烧制材料,其可以解决在常规材料中发现的氧化锆层的剥离和缺乏强度的问题,并且可以 经济生产。 解决方案:用于电子元件烧制的材料是通过用平均粒径为30-500μm的粗大的氧化锆颗粒和平均直径为0.1-10μm的细颗粒形成的氧化锆层覆盖砖或瓷基底来制备的 具有包含两种或更多种金属氧化物的部分熔融粘合剂。 在这种情况下,粗粒子与微粒和粘合剂之和的重量比为75:25〜25:75,粘合剂与粗/细粒子和粘合剂之和的调整 为0.5%以上且小于3%。 通过使用包含氧化钇和氧化铝的粘合剂烧制粗颗粒或粗粒和微粒的混合物,可以提高氧化锆层的结合强度和与基材的粘附性,从而获得电子部件用高性能材料 射击