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    • 88. 发明专利
    • METALLIC MULTILAYER FILM AND ITS MANUFACTURE
    • JPH03205807A
    • 1991-09-09
    • JP67590
    • 1990-01-08
    • HITACHI LTD
    • TAKEUCHI TERUAKIHIRAYAMA YOSHIYUKIFUTAMOTO MASAAKIHONDA YUKIO
    • G11B5/31H01F10/26H01F10/32H01F41/20
    • PURPOSE:To obtain a metallic multilayer film wherein the diffusion of the atoms between layers is so small that one can ignore and the epitaxy to a substrate is favorable by arranging the constitution such that the thickness of the first layer metallic film directly in contact with a substrate is larger than that of each layer of and after the second layer and that it has a region where substrate constituent elements are diffused on the side of the first layer near the boundary between the substrate and the first layer. CONSTITUTION:The thickness of the first layer overlaid directly on a substrate is larger than that of the second layer onward, and besides the vicinity of the boundary with the substrate in the first layer contains substrate constituent elements. For example, using a vacuum deposition method, a multilayer consisting of Fe and Cr is made on a GaAs (100) substrate. In this case, the degree of vacuum during deposition is about 1X10 Torr, and the deposition is performed at a speed of 0.5Angstrom /sec. and the first layer is Cr 500Angstrom in thickness, and this is deposited at a substrate temperature of 250 deg.C, and for the second layer on, Fe 12Angstrom in thickness and Cr 8Angstrom in thickness are deposited alternately in this order by 200 layers each under the substrate of -50 deg.C. In this case, the thickness of the region where Ga atoms are mixed in the first layer becomes about 20Angstrom .