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81. 发明专利

JPS5572770A COOLING SYSTEM 失效
公开(公告)号：JPS5572770A
公开(公告)日：1980-05-31
申请号：JP14640678
申请日：1978-11-27
申请人： HITACHI LTD
发明人： KOIKE KOUKICHI , KOBAYASHI FUMIYUKI , ZUSHI SHIZUO
IPC分类号： F25D17/02 , F24F5/00 , F25B1/00 , F25B49/00 , G06F1/20

82. 发明专利

JPS5561373A MICROOHEAT FUSION WELDING DEVICE 失效
公开(公告)号：JPS5561373A
公开(公告)日：1980-05-09
申请号：JP13369778
申请日：1978-11-01
申请人： HITACHI LTD
发明人： TANI MITSUKIYO , KOBAYASHI FUMIYUKI
IPC分类号： H05K3/34 , B23K3/00 , B23K3/03
摘要： PURPOSE:To enable fusion welding in fine patterns to be obtained readily and surely by providing a voltage stabilizer and voltage varying device to the input side of an AC welding power supply and controlling the welding waveforms of the specific firing angle used according to various print patterns through controlling of the voltage variable device with a numerical control unit. CONSTITUTION:A wire material 1 covered evaporatable material is held between an electrode 2 and printed substrate 11 and is pressed, at the same instant of which a micro-switch 23 is turned ON. A start pulse is applied through an actuator circuit 19 to a clock circuit 20. The circuit 20 in turn outputs an oscillation start signal to an SCR trigger generating circuit 14. The output signal receives a switching circuit 21 and applies the full wave voltage to an output transformer 30. This circuit 14 outputs the full wave current which is set at 180 deg. of firing angle. Next, arbitrary fusion welding conditions are set by automatically controlling a voltage varying device 27 with a numerical control unit, whereby automatic fusion welding is made possible.

83. 发明专利

JPS5559746A SEMICONDUCTOR DEVICE AND ITS MOUNTING CIRCUIT DEVICE 失效
公开(公告)号：JPS5559746A
公开(公告)日：1980-05-06
申请号：JP13163478
申请日：1978-10-27
申请人： HITACHI LTD
发明人： OOTSUKA KANJI , SEKIHASHI MASAO , USAMI TAMOTSU , FURUKAWA MICHIAKI , KOBAYASHI FUMIYUKI , ISHIDA MASAKATSU
IPC分类号： H01L23/12 , H01L21/60 , H01L23/02 , H01L23/32
摘要： PURPOSE:To better radiation, by sealing a semiconductor element chip to a ceramic laminating type lead-less package, and by ensuring connection with a wiring substrate by mounting a conductor terminal for external connection at the wire bonding surface side in a shape that is higher than an upper surface of the package. CONSTITUTION:A LSI chip 10 is connected onto a metallized portion 5, which is plated with gold, of a ceramic laminating type package 1, and pads on LSI wiring and metallized patterns 6 are bonded by means of gold wires 11. A cover 12, which coefficient of thermal expansion is closely resemble to ceramics, is connected onto a metallized portion 7, and seals the portion. When the cover 12 is mounted and the package is completed, the upper surface is located at the side lower than a surface of an electrode 8 installed being connected to a through hole metallized portion 9. The package is joined in a lead-less shape while directing the electrode 8 to a lower surface and opposing it to a wiring electrode 14 of a wiring substrate 15. A LSI is efficiently radiated from the back of the package positioned at a surface opposite to the wiring substrate 15. Radiation fins 10 may be mounted.

84. 发明专利

JPS5541651A METHOD OF JUDGING CONNECTION OF LEAD WIRES 失效
公开(公告)号：JPS5541651A
公开(公告)日：1980-03-24
申请号：JP11451678
申请日：1978-09-20
申请人： HITACHI LTD
发明人： SOGA TASAO , YASUDA TOMIROU , TAKAHASHI KAZUYA , SASAKI HIDEAKI , TSUNEKAWA AKIRA , KOBAYASHI FUMIYUKI
IPC分类号： G01R31/04 , H01R43/00

85. 发明专利

JPS53131708A LOOP COMMUNICATION SYSTEM 失效
公开(公告)号：JPS53131708A
公开(公告)日：1978-11-16
申请号：JP4574177
申请日：1977-04-22
申请人： HITACHI LTD
发明人： KOBAYASHI FUMIYUKI
IPC分类号： H04L12/42
摘要： PURPOSE:To enable the use of the loop transmission line between plural stations at one time and thus to increase the loop application efficiency, by controlling the loop switching by the station with use of the peculiar polling indication character for station use.

86. 发明专利

JPS5335341A INFORMATION PROCESSING UNIT 失效
公开(公告)号：JPS5335341A
公开(公告)日：1978-04-01
申请号：JP10887276
申请日：1976-09-13
申请人： HITACHI LTD
发明人： SHIMOTSUMA KEN , KOBAYASHI FUMIYUKI
IPC分类号： G06F11/22 , G06F3/00 , G06F11/00
摘要： PURPOSE:To secure a quick detection for the fault occurrence area and to perform a quick repair for the fault by dividing the multi-source bus itself into several blocks in order to secure a detection of the fault occurrence area within the minimum and interchangeable unit.

87. 发明专利

JP2002076194A ELECTRONIC CIRCUIT DEVICE, MODULE FOR ELECTRONIC COMPUTER, AND ELECTRONIC COMPUTER 失效
公开(公告)号：JP2002076194A
公开(公告)日：2002-03-15
申请号：JP2001185769
申请日：2001-06-20
申请人： HITACHI LTD
发明人： ISHIHARA SHOSAKU , KODAMA HIRONORI , OKAMOTO MASAHIDE , TANEI HEIKICHI , IWANAGA SHOICHI , SHOJI FUSAJI , KATSUMURA NOBUHITO , SATO RYOHEI , KOBAYASHI FUMIYUKI , TAGAMI BUNICHI , SENGOKU NORIO , YAGI KUNIHIRO , NAKAMURA MASATO , MORITA KOSAKU , FUJITA TAKESHI
IPC分类号： C04B35/14 , C04B35/16 , H01L23/15 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a ceramic wiring board which is sintered at 900-1,050 deg.C, whose dielectric constant is small, thermal linear expansion coefficient matches with silicon, and bending strength is large and to provide its manufacturing method. SOLUTION: In the glass of softening temperature of 850-1,100 deg.C, namely, Figure 1 (SiO2-B2O3-R2O based triangular composition figure. Each composition is shown by the position of a small circle, and numerals in the small circle show composition numbers), the glass having compositions showing points on an area (including an on-line) surrounding the points showing first, third, tenth, eleventh and fourth compositions by connecting lines respectively is made a raw material. Water based dispersion particles are used for a binder, and a burning process, a green sheet is pressurized in the thickness direction.

88. 发明专利

JPH08181441A CIRCUIT BOARD, MANUFACTURE THEREOF, ELECTRONIC DEVICE MOUNT AND GREEN SHEET 失效
公开(公告)号：JPH08181441A
公开(公告)日：1996-07-12
申请号：JP31848794
申请日：1994-12-21
申请人： HITACHI LTD
发明人： OKAMOTO MASAHIDE , ISHIHARA SHOSAKU , IWANAGA SHOICHI , AMI NORIHIRO , NAKAMURA MASATO , KOBAYASHI FUMIYUKI , SENGOKU NORIO
IPC分类号： H05K1/09 , C04B37/02 , H05K3/46
摘要： PURPOSE: To improve bondability with glass ceramics by forming a part made of a plurality of layers of wirings a first type conductor layer containing copper as main ingredient and bonding strengthening agent and second type conductor layer containing copper as a main ingredient without containing the agent. CONSTITUTION: The insulator 1 of a circuit board is made of glass ceramics which can be sintered at a temperature of a copper melting point or lower. Two types of pastes (first and second pastes) are printed on a rear surface layer. The first paste forms a first type conductor layer and the second paste forms a second type conductive layer. The rear surface layer is formed by printing the first paste and then printing the second paste at the same position. The first type layer contains copper as a main ingredient, and contains bonding strengthening agent. Thus, the bondability of the copper to the ceramics is improved. On the other hand, the second type layer is made only of copper powder as inorganic material to improve the bondability of the metal plated layer and a brazing agent.

89. 发明专利

JPH08125341A ELECTRONIC CIRCUIT DEVICE 失效
公开(公告)号：JPH08125341A
公开(公告)日：1996-05-17
申请号：JP26000094
申请日：1994-10-25
申请人： HITACHI LTD
发明人： ANDO AKIHIRO , YAMADA OSAMU , SATO RYOHEI , INOUE TAKASHI , OKAMOTO MASAHIDE , KOBAYASHI FUMIYUKI , OTA TOSHIHIKO , TANAKA MINORU
IPC分类号： H05K1/09 , B23K1/00 , H01L23/498 , H05K1/11 , H05K1/18 , H05K3/40 , H05K3/46
摘要： PURPOSE: To form the connecting electrode of Cu with high strength by simple steps by printing conductor pad of Cu having larger diameter than a predetermined electrode diameter in the case of forming the electrode, and by forming glass ceramic cover coating at the periphery by printing. CONSTITUTION: Glass ceramics are used as a board material, and Cu is used as a conductor material. A through hole 12 and a conductor pattern 13 are printed on a green sheet 11, and printed green sheet necessary to form a predetermined circuit is prepared. A conductor pad 14 of Cu larger than a predetermined electrode diameter is printed, and press-bonded as a laminate printed with cover coating glass ceramics 15 on the periphery. Thereafter, a protective film is formed on the Cu conductor pad on the ceramics sintered at the entirety by plating as required. Thus, Cu connecting electrode having high strength can be formed by simple steps. Since the connecting electrode is formed simultaneously upon sintering of the board, the steps can be simplified.

90. 发明专利

JPH03211760A REPAIRING AND CONNECTION OF INPUT/OUTPUT PIN 失效
公开(公告)号：JPH03211760A
公开(公告)日：1991-09-17
申请号：JP611190
申请日：1990-01-17
申请人： HITACHI LTD
发明人： KOJIMA HIROYUKI , HATSUDA TOSHIO , SAKATA SHOJI , SAKAMOTO TATSUJI , KOBAYASHI FUMIYUKI
IPC分类号： H01L23/50
摘要： PURPOSE:To enable the repair of broken input/output pin so as to establish pin grid array by fixing an i/o pin for repair to the electrically insulating member moored to a sound i/o pin, and connecting the i/o pin to an existing pad. CONSTITUTION:A through hole is provided, by the same knack as that performed in a printed board, is provided in an electrically insulating supporting plate 3 in advance, and a metallic land part 4b is plated, and an i/o pin 4 for repair is st herein, and is joined and fixed by solder. The electrically insulating supporting plate 3 is run through with an i/o pin 7a adjacent to the repair pin 4, and in the condition that the repair pin 4 is pressed against inner layer wiring 10 to such degree that the supporting plate 3 is deformed elastically, the supporting plate 3 is fixed to the i/o pin 7a by soldering itself to the soldering part 8a of the i/o pin 7a with solder 8b. Accordingly, making use of the elastic deformation of the electrically insulating support 3, to which the repair pin 4 is soldered in advance, the repair pin 4 is directly pressed against the metallized part of the wiring layer in the original pad position and is connected to it.

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