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81. 发明专利

JP2010138156A Nano-substance, nano-composite, nano liquid dispersion, method for producing the same, and various agents comprising the liquid dispersion 有权
标题翻译：纳米物质，纳米复合材料，纳米液体分散体，其生产方法以及包含液体分散剂的各种试剂
公开(公告)号：JP2010138156A
公开(公告)日：2010-06-24
申请号：JP2008335984
申请日：2008-12-11
申请人： Hirosaki Univ , Ishihara Chem Co Ltd , 国立大学法人弘前大学 , 石原薬品株式会社
发明人： SAWADA HIDEO , TAKASHIMA DAIKI , TAKISHITA KATSUHISA
IPC分类号： C07F7/18
摘要： PROBLEM TO BE SOLVED: To provide a new nano-substance, nano-composite or nano-dispersion, particularly those having excellent water-repellent and oil-repellent effects or hydrophilic and oil-repellent effects. SOLUTION: The nano-substance includes a fluorine-containing-based compound represented by general formula: Rf-[CH 2 CH(Si(OR) 3 )]n-Rf [wherein, Rf is perfluoroalkyl, perfluorooxaalkyl or group represented by general formula: -AfO(Af'O)mAf'F (wherein, Af is perfluoroalkylene; Af' is perfluoroalkylene which is the same as or different from Af; and m is 1-10); R is alkyl, alkoxyalkyl or hydrogen atom; and n is 2-100]. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供新的纳米材料，纳米复合材料或纳米分散体，特别是具有优异的拒水拒油作用或亲水和拒油效果的纳米材料。解决方案：纳米材料包括由以下通式表示的含氟基化合物：Rf- [CH 2 SBR 2（CH 3））（Si（OR）3 SB 3）] n-Rf [其中，Rf是全氟烷基，全氟代烷基或由通式-AfO（Af'O）mAf'F表示的基团，其中，Af是全氟亚烷基; Af'是与Af相同或不同的全氟亚烷基; m为1-10）; R是烷基，烷氧基烷基或氢原子; n为2〜100]。版权所有（C）2010，JPO＆INPIT

82. 发明专利

JP2010031293A Cleaning agent composition for oil-contaminated floor surface 有权
标题翻译：油污表面清洁剂组合物
公开(公告)号：JP2010031293A
公开(公告)日：2010-02-12
申请号：JP2009256342
申请日：2009-11-09
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： KOBAYASHI AKIO , TABATA CHIAKI , WAKAO HIDEKI
IPC分类号： C11D1/75 , C11D1/04 , C11D3/28 , C11D3/34
摘要： PROBLEM TO BE SOLVED: To provide a cleaning agent composition which exhibits good detergency in a floor cleaning treatment, does not contain an environmental pollutant in itself, and can separate contamination, such as an oil component, by only simple work in waste water treatment after cleaning, especially after floor cleaning.
SOLUTION: The cleaning agent composition for an oil-contaminated floor surfaces includes (A) 0.1-20 mass% fatty acid soap and (B) 0.5-10 mass% tetradecyldimethylamine oxide. The composition is characterized by the following: in a discharged water treatability evaluation performed about an underlayer which is obtained by adding 200 ml of a spindle oil to 1,800 ml of a 200 time-diluted solution by water, shaking the resultant liquid 50 times, and splitting after 15 hr lapse and which has a pH of 7.5-8.5, there are exhibited less than 5 mg/L of an n-hexane extract content and less than 40 mg/L of a chemical oxygen demand (COD).
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种在地板清洗处理中表现出良好去污力的清洁剂组合物，其本身不含有环境污染物，并且可以通过简单的废物处理来分离诸如油性成分的污染物清洗后进行水处理，特别是地板清洗后。解决方案：油污染地板表面的清洁剂组合物包含（A）0.1-20质量％脂肪酸皂和（B）0.5-10质量％的十四烷基二甲基氧化胺。该组合物的特征在于：在通过用水将1800毫升200倍时间稀释的溶液中加入200毫升纺丝油所得到的底层进行排出的水处理性评价中，摇动得到的液体50次，在15小时后分解，pH值为7.5-8.5，显示出小于5mg / L的正己烷萃取物含量和小于40mg / L的化学需氧量（COD）。版权所有（C）2010，JPO＆INPIT

83. 发明专利

JP2009298998A Humidity curing-type coating material for floor 有权
标题翻译：用于地板的湿度固化型涂料
公开(公告)号：JP2009298998A
公开(公告)日：2009-12-24
申请号：JP2008158567
申请日：2008-06-17
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： TAKASHIMA DAIKI , TAKISHITA KATSUHISA
IPC分类号： C09D183/04 , C09D7/12
摘要： PROBLEM TO BE SOLVED: To provide a floor surface coating material in which flaws into the material deeply are not caused and to which unremovable dirt is not attached when floor surfaces of factories, etc. are coated with the material.
SOLUTION: The material is produced by adding an organic aluminum compound as a curing catalyst to a condensate of methyltrichlorosilane with dimethyldimethoxysilane. The condensate is preferably produced by condensing 2 or more equivalents of dimethyldimethoxysilane with 1 equivalent of methyltrichlorosilane and has a methoxysilyl group at its molecule terminal.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种地板表面涂层材料，其中在工件等的地板表面涂覆有材料时，其中不会引起材料中的缺陷并且不附着不可移动的污物。解决方案：通过向甲基三氯硅烷与二甲基二甲氧基硅烷的缩合物中加入作为固化催化剂的有机铝化合物来制备该材料。缩合物优选通过将2当量或更多当量的二甲基二甲氧基硅烷与1当量的甲基三氯硅烷缩合并在其分子末端具有甲氧基甲硅烷基基团来制备。版权所有（C）2010，JPO＆INPIT

84. 发明专利

JP2009191335A Plating solution and electronic parts 审中-公开
标题翻译：电镀解决方案和电子部件
公开(公告)号：JP2009191335A
公开(公告)日：2009-08-27
申请号：JP2008035092
申请日：2008-02-15
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： NISHIKAWA TETSUJI , SAKAEGAWA MASAHIRO , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/02 , C23C18/31 , C25D3/32
摘要： PROBLEM TO BE SOLVED: To provide an electrolytic or electroless plating solution which has excellent temporal stability and a wide gloss range, shows uniform plating appearance, can effectively provide an intended coating film composition and contains no cyanide, and to provide electronic parts having a metal film which has been formed by using the same. SOLUTION: The plating solution includes a chemical compound shown by Formula (1) and one or more water-soluble salts of a metal selected from the group consisting of the Group VIII, IB, IIB, IIIA, IVA and VA in the fourth period to the sixth period. The water-soluble salt of the metal in the plating solution is that of tin, silver, gold, platinum, palladium or copper in particular. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有优异的时间稳定性和宽光泽范围的电解或化学镀溶液，显示出均匀的电镀外观，可以有效地提供预期的涂膜组合物并且不含氰化物，并且提供电子部件具有通过使用其形成的金属膜。解决方案：电镀液包含式（1）所示的化合物和一种或多种选自第VIII，IB，IIB，IIIA，IVA和VA族的金属的水溶性盐，其中第四期至第六期。镀液中金属的水溶性盐特别是锡，银，金，铂，钯或铜的金属盐。版权所有（C）2009，JPO＆INPIT

85. 发明专利

JP4285855B2 Abrasive composition 有权
公开(公告)号：JP4285855B2
公开(公告)日：2009-06-24
申请号：JP25941199
申请日：1999-09-13
申请人： Toto株式会社 , 石原薬品株式会社
发明人：広長岩田 , 邦夫有本 , 千人田子 , 英夫西田 , 浩樹飛松
IPC分类号： C09K3/14 , C11D1/12 , C09D9/02 , C11D3/12 , C11D3/14

86. 发明专利

JP4273266B2 Tin alloy electroplating method of dissolution current suppression type 有权
公开(公告)号：JP4273266B2
公开(公告)日：2009-06-03
申请号：JP2005084399
申请日：2005-03-23
申请人：株式会社大和化成研究所 , 石原薬品株式会社
发明人：拓郎不可三 , 雅一吉本 , 惠吾小幡 , 正記芳賀 , 哲治西川
IPC分类号： C25D3/60 , C25D7/00
CPC分类号： H01L2224/11462
摘要： PROBLEM TO BE SOLVED: To smoothly prevent the substitution deposition for noble metals in a tin (alloy) anode during electrodeposition in electroplating of the alloy of tin and metals (silver, bismuth, copper, etc.) nobler than the tin. SOLUTION: The tin alloy elctroplating method comprises adding at least one dissolution current suppressing agent selected from the group consisting of glutamic acid-N, N-diacetic acid, methyl glycine-N, N-diacetic acid, aspartic acid and their salts to the tin electroplating bath to suppress the dissolution current of the anode and to attain the prevention of the substitution deposition of the noble metals to the anode during the electrodeposition. The dissolution current is suppressed by the addition of the suppressing agent and therefore, even if the anode current density is made lower than heretofore, the potential of the anode is shifted nobler than the natural electrode potential of the noble metal and thereby the substitution deposition to the anode of the nobler metal can be effectively prevented. COPYRIGHT: (C)2007,JPO&INPIT

87. 发明专利

JP4258011B2 Semiconductor device that has copper wiring formed by electrolytic copper plating bath and the plating bath 有权
公开(公告)号：JP4258011B2
公开(公告)日：2009-04-30
申请号：JP8282399
申请日：1999-03-26
申请人：石原薬品株式会社
发明人：衛内田 , 浩司北村 , 岡田　　隆 , 省三水本 , 秀美縄舟
IPC分类号： C25D3/38 , C25D7/12 , H01L21/288

88. 发明专利

JP4236195B2 Polishing α- alumina composition, and a method of manufacturing the same 有权
公开(公告)号：JP4236195B2
公开(公告)日：2009-03-11
申请号：JP2004318606
申请日：2004-11-01
申请人：有限会社和貴テック , 石原薬品株式会社
发明人：正光四條 , 勝久滝下 , 千人田子
IPC分类号： C09K3/14 , B24B37/00 , C01F7/44

89. 发明专利

JP4120791B2 Non-electrolytic tin plating bath 有权
公开(公告)号：JP4120791B2
公开(公告)日：2008-07-16
申请号：JP2002331592
申请日：2002-11-15
申请人：石原薬品株式会社
发明人：祥哉伊内 , 岡田　　隆
IPC分类号： C23C2/20 , C23C18/52 , C23C2/24

90. 发明专利

JP4025981B2 Non-electrolytic tin plating bath 有权
公开(公告)号：JP4025981B2
公开(公告)日：2007-12-26
申请号：JP2002149257
申请日：2002-05-23
申请人：石原薬品株式会社
发明人：祥哉伊内 , 岡田　　隆 , 薫田中
IPC分类号： C23C18/52

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