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81. 发明专利

JP2011205147A Method of fabricating led package 审中-公开
标题翻译：制造LED封装的方法
公开(公告)号：JP2011205147A
公开(公告)日：2011-10-13
申请号：JP2011156645
申请日：2011-07-15
申请人： Samsung Led Co Ltd , サムソンエルイーディーカンパニーリミテッド.
发明人： SHIN SANG HYUN , CHOI SEOG MOON , LEE YOUNG KI
IPC分类号： H01L33/44 , H01L33/64 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62
CPC分类号： H01L33/483 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a high-luminance and high-output LED package using an LED element as a light source, and a method of fabricating the same.SOLUTION: There is provided the LED package including: a substrate formed of an aluminum material and formed with a recessed multilayer reflecting surface on a side face; a light source mounted on the reflecting surface and electrically connected to an electrode pattern; an anodizing insulation layer formed between the electrode pattern and the substrate; and a molding part covering over the light source of the substrate; wherein an LED element of the light source has a multilayer reflecting surface structure structured to form an aluminum radiator part on its lower surface to excel in heat radiation performance, and the method of fabricating the same. According to the invention, the substrate is formed of an aluminum material and anodized to form insulation layers thereon, thereby a superior heat radiation effect of the LED element can be provided through the same, and thereby an effect capable of significantly increasing the lifetime and light emission efficiency of the LED package can be provided.
摘要翻译：要解决的问题：提供使用LED元件作为光源的高亮度和高输出LED封装及其制造方法。解决方案提供了LED封装，其包括：由铝制成的基板在侧面上形成凹陷的多层反射面; 光源，安装在所述反射表面上并电连接到电极图案; 在所述电极图案和所述基板之间形成的阳极氧化绝缘层; 以及覆盖在所述基板的光源上的成型部件; 其中，所述光源的LED元件具有多层反射面结构，其构造为在其下表面上形成铝散热器部件以具有优异的散热性能及其制造方法。根据本发明，基板由铝材料形成并阳极氧化以在其上形成绝缘层，由此可以提供LED元件的优异的散热效果，从而可以显着增加寿命和光线的效果可以提供LED封装的发光效率。

83. 发明专利

JP4777293B2 Nitride-based semiconductor light-emitting diode 有权
公开(公告)号：JP4777293B2
公开(公告)日：2011-09-21
申请号：JP2007119135
申请日：2007-04-27
申请人：サムソンエルイーディーカンパニーリミテッド.
发明人：コグンヨ , キムジェウォン , ファンソクミン , キムドンウ , オバンウォン , パクヒョンジン
IPC分类号： H01L33/32 , H01L33/38 , H01L33/40 , H01L33/42
CPC分类号： H01L33/38 , H01L33/20

84. 发明专利

JP4767684B2 Photo diodes and light-emitting diode package of integrated for monitoring 有权
公开(公告)号：JP4767684B2
公开(公告)日：2011-09-07
申请号：JP2005375514
申请日：2005-12-27
申请人：サムソンエルイーディーカンパニーリミテッド.
发明人：ジュンパク，ホ , リンファン，ウン , 相賢崔 , 碩文崔 , 成俊李 , 昶賢林
IPC分类号： H01L33/48 , H01L33/62
CPC分类号： H01L31/147 , H01L25/167 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2924/00014

85. 发明专利

JP2011171306A Planar light source device and lcd backlight unit provided with the same 有权
标题翻译：平面光源设备和LCD背光单元
公开(公告)号：JP2011171306A
公开(公告)日：2011-09-01
申请号：JP2011079106
申请日：2011-03-31
申请人： Samsung Led Co Ltd , サムソンエルイーディーカンパニーリミテッド.
发明人： JEONG YOUNG JUNE
IPC分类号： F21S2/00 , F21Y101/02 , G02F1/13357
CPC分类号： F21V21/00 , F21V11/00 , G02F1/133603 , G02F2001/133613
摘要： PROBLEM TO BE SOLVED: To provide a highly-efficient planar light source device for reducing the number of electroluminescent elements.
SOLUTION: A first matrix and second matrix where a plurality of electroluminescent elements 202 are displaced by means of lines and columns on a substrate are arranged on a planar light source device. A plurality of electroluminescent elements are displaced by means of lines and columns on the second matrix to make each electroluminescent element locate inside a square formed by four electroluminescent elements included in the first matrix and adjacent with each other. Further, the distance (S) from one electroluminescent element to the other electroluminescent element adjacent at most satisfies the formula, in which a distribution of brightness becomes uniform at a position separating an optical length (l) from a light emitting surface of the electroluminescent element, in an electroluminescent element matrix made of the first matrix and second matrix. Here, α satisfies -π/18≤α≤π/18, and θ is an pointing angle of the electroluminescent element.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于减少电致发光元件数量的高效平面光源装置。解决方案：通过基板上的线和列使多个电致发光元件202位移的第一矩阵和第二矩阵被布置在平面光源装置上。多个电致发光元件通过第二矩阵上的线和列移位，以使每个电致发光元件位于由包括在第一矩阵中并彼此相邻的四个电致发光元件形成的正方形内。此外，从一个电致发光元件到至多相邻的另一个电致发光元件的距离（S）至多满足其中在从电致发光元件的发光表面分离光学长度（I）的位置的亮度分布变得均匀的公式在由第一矩阵和第二矩阵制成的电致发光元件矩阵中。这里，α满足-π/18≤α≤π/ 18，θ是电致发光元件的指向角。版权所有（C）2011，JPO＆INPIT

86. 发明专利

JP4746026B2 Vertical structure led element and a method of manufacturing the same 有权
公开(公告)号：JP4746026B2
公开(公告)日：2011-08-10
申请号：JP2007317668
申请日：2007-12-07
申请人：サムソンエルイーディーカンパニーリミテッド.
发明人：ヨブソン、サン , スーチョ、ミョン , ジェチョイ、プン , ヨルパク、キ , ヒュクリー、シ
IPC分类号： H01L33/36 , H01L33/32 , H01L33/40
CPC分类号： H01L33/0079

87. 发明专利

JP4728264B2 LED package, LED circuit board and a manufacturing method thereof packaging 有权
公开(公告)号：JP4728264B2
公开(公告)日：2011-07-20
申请号：JP2007039445
申请日：2007-02-20
申请人：サムソンエルイーディーカンパニーリミテッド. , サムソンエレクトロ−メカニックスカンパニーリミテッド.
发明人：碩文崔 , 栄基李 , 常 ▲弦▼ 申
IPC分类号： H01L33/54 , H01L33/64 , H01L23/02 , H01L23/12 , H01L33/56
CPC分类号： H01L33/486 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01322 , H05K1/053 , H05K3/0052 , Y10T29/49155 , H01L2924/00014 , H01L2924/00
摘要： A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance.

88. 发明专利

JP4727617B2 Surface mount-type light-emitting diode element 有权
公开(公告)号：JP4727617B2
公开(公告)日：2011-07-20
申请号：JP2007110434
申请日：2007-04-19
申请人：サムソンエルイーディーカンパニーリミテッド.
发明人：ヒョンホキム , ヨンシクキム , ソグムンチェ
IPC分类号： H01L33/22 , H01L33/58 , H01L33/50 , H01L33/54 , H01L33/56 , H01L33/62
CPC分类号： H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2933/0091 , H01L2924/00014
摘要： A surface mounting device-type light emitting diode (SMD-type LED) comprises a lead frame composed of a pair of lead terminals; a package housing a portion of the lead frame therein, the package having an emission window which is opened so that light is emitted through the emission window; an LED chip mounted on the lead frame inside the package; a wire for electrically connecting the LED chip and the lead frame; and a molding material filled in the package, the molding material having surface irregularities with a predetermined shape formed on the surface thereof which is exposed through the emission window of the package.

89. 发明专利

JP4727533B2 Nanowire light-emitting element and a method of manufacturing the same 有权
公开(公告)号：JP4727533B2
公开(公告)日：2011-07-20
申请号：JP2006229485
申请日：2006-08-25
申请人：サムソンエルイーディーカンパニーリミテッド.
发明人：元河文 , 鍾波洪 , 東雲金
IPC分类号： H01L33/32 , H01L33/04 , H01L33/44
CPC分类号： H05B33/145 , B82Y20/00 , B82Y30/00 , H01L33/18 , Y10S977/764 , Y10S977/816 , Y10S977/90 , Y10S977/95

90. 发明专利

JP2011139078A Led package and backlight unit using the same 有权
标题翻译：使用相同的LED封装和背光单元
公开(公告)号：JP2011139078A
公开(公告)日：2011-07-14
申请号：JP2011011132
申请日：2011-01-21
申请人： Samsung Led Co Ltd , サムソンエルイーディーカンパニーリミテッド.
发明人： KIM DAE YEON , PARK YOUNG SAM
IPC分类号： H01L33/54 , H01L33/58 , F21S2/00 , F21V5/00 , F21V5/04 , F21V13/04 , F21Y101/02 , H01L33/56 , H01L33/60
CPC分类号： H01L33/58 , H01L33/46
摘要： PROBLEM TO BE SOLVED: To provide an LED package capable of forming the directivity angle of light emitted from an LED to be large and simplifying the lens shape and the assembling steps, and to provide a backlight unit that uses the same.
SOLUTION: The LED package includes: a housing 100 in which a stably attached grooves 110 is formed; one or more LEDs 200 stably attached to the stably attached grooves; and a lens 300 formed to be inclined so as to form on a curved surface with a convex-shaped upper surface and connected, so as to cover the upper side of the LED. A reflective board 120 is formed in the inner wall of the stably attaching grooves. The LED package and the backlight unit that use the same have the advantage that light can be emitted uniformly so that hot spots will not be formed in the output window, the directivity angle can be enlarged by using a further simply shaped lens, and a thinner shaped product can be obtained, by minimizing the color-mixing zone where rays of light mutually different color phases are mixed.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供能够形成从LED发射的光的方向角度大的LED封装，并且简化透镜形状和组装步骤，并提供使用该LED封装的背光单元。解决方案：LED封装包括：壳体100，其中形成有稳定连接的沟槽110; 一个或多个LED 200稳定地附接到稳定连接的凹槽; 以及透镜300，其被形成为倾斜形成在具有凸形上表面的曲面上并被连接，以便覆盖LED的上侧。反射板120形成在稳定安装槽的内壁中。 LED封装和使用该LED封装的背光单元具有能够均匀地发光以使输出窗口中不形成热点的优点，通过使用另外简单的形状的透镜可以扩大方向角，并且更薄可以通过使混合有不同颜色相位的光线的混色区域最小化来获得形状的产品。版权所有（C）2011，JPO＆INPIT

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