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71. 发明专利

JP2006515900A Platinum electrode and a method of manufacturing the same 有权
公开(公告)号：JP2006515900A
公开(公告)日：2006-06-08
申请号：JP2003584365
申请日：2003-04-10
申请人：セカンドサイトメディカルプロダクツインコーポレイテッド
发明人：ドーミンゾウ
IPC分类号： C25B11/08 , A61F2/14 , A61N1/05 , C25D3/50 , C25D7/00
CPC分类号： A61N1/0543 , C25D3/50 , Y10S428/935 , Y10T428/12875 , Y10T428/12993
摘要：改良された電極、及び該電極を製造する方法であって、前記電極は、同一ジオメトリの光沢白金と比較して少なくとも５倍は表面積が増加しており、また同一表面積を有する白金黒と比較して物理的応力に対する耐性が改善されている白金のフラクタル表面コーティング［発明者らは、“白金グレイ”と称している］を有している。白金グレイの表面コーティングを電気めっきするプロセスは、光沢白金を発生させるのに必要な速度より速く且つ白金黒を発生させるのに必要な速度より遅い中庸の速度でめっきすることからなる。

72. 发明专利

JP3601005B2 Palladium plating solution 有权
公开(公告)号：JP3601005B2
公开(公告)日：2004-12-15
申请号：JP2000211927
申请日：2000-06-09
申请人：小島化学薬品株式会社
发明人：陽太郎新井 , 武海秋元
IPC分类号： C25D3/50 , C25D3/52 , C25D3/56
CPC分类号： C25D3/567 , C25D3/52 , C25D3/56

73. 发明专利

JP3411688B2 失效
公开(公告)号：JP3411688B2
公开(公告)日：2003-06-03
申请号：JP22077994
申请日：1994-08-24
IPC分类号： C25D3/50

74. 发明专利

JP3256912B2 失效
公开(公告)号：JP3256912B2
公开(公告)日：2002-02-18
申请号：JP12467293
申请日：1993-04-30
IPC分类号： C25D3/50

75. 发明专利

JP2002500772A 失效
公开(公告)号：JP2002500772A
公开(公告)日：2002-01-08
申请号：JP54888099
申请日：1999-03-30
IPC分类号： G21G4/08 , A61M36/00 , A61M36/12 , A61N5/10 , C25D3/50 , C25D5/10

76. 发明专利

JP2001355093A PALLADIUM ELECTROPLATING SOLUTION AND METHOD FOR PLATING USING THE SOLUTION 失效
公开(公告)号：JP2001355093A
公开(公告)日：2001-12-25
申请号：JP2000178537
申请日：2000-06-14
申请人： MATSUDA SANGYO CO LTD
发明人： ODA KAZUHIRO
IPC分类号： C25D3/50
摘要： PROBLEM TO BE SOLVED: To provide an acidic palladium electroplating solution with which plating is carried out hardly causing hydrogen coprecipitation as a pending problem. SOLUTION: This palladium electroplating solution contains at least 1-60 g/l soluble palladium slat, expressed in terms of palladium, 0.1-300 g/l complexing agent and 1-300 g/l carboxylic buffer, and the solution is kept at pH 1-7.

77. 发明专利

JP2000034593A AQUEOUS SOLUTION FOR REDUCTION PRECIPITATION OF METAL 失效
公开(公告)号：JP2000034593A
公开(公告)日：2000-02-02
申请号：JP19876398
申请日：1998-07-14
申请人： DAIWA KASEI KENKYUSHO
发明人： OKUHAMA YOSHIAKI , TAKEUCHI TAKAO , YOSHIMOTO MASAKAZU , TAKATANI SHIGERU , TANAKA EMIKO , NISHINO MASAYUKI , KATO YUJI , KOBASHI YASUTO , HISAYOSHI KYOKO , KONDO TETSUYA , SHIOMI KEIJI , OBATA KEIGO , KOMATSU MITSUO , NAWAFUNE HIDEMI
IPC分类号： C22B3/44 , B22F9/24 , C22B3/38 , C23C18/16 , C23C18/31 , C25C1/20 , C25D3/02 , C25D3/12 , C25D3/20 , C25D3/22 , C25D3/26 , C25D3/32 , C25D3/36 , C25D3/38 , C25D3/46 , C25D3/48 , C25D3/50 , C25D3/52 , C25D3/54 , C25D3/56 , C25D3/58 , C25D3/60 , C25D3/62 , C25D3/64
摘要： PROBLEM TO BE SOLVED: To enable formation of a good plating film of a single metal and/or alloy or formation of fine particles by incorporating a phosphine and a soluble metal compd. or a metal compd. which forms a soluble complex with the phosphine and is made soluble. SOLUTION: The phosphine included in the aq. soln. is expressed by the formula. In the formula, R1, R2 and R3 are lower alkyl groups and at least one of them is hydroxy or an amino-substd. lower alkyl group, and especially, tris(3-hydroxypropyl)phosphine is preferable. The metal used for the aq. soln. is one or more kinds selected from 24 elements such as Cu, Ag, Au, Zn, Cd, In, Ge and Sn. When these metals are to be coprecipitated, one or more kinds of compds. containing P, B, and W are preferably further incorporated.

78. 发明专利

JP2990917B2 失效
公开(公告)号：JP2990917B2
公开(公告)日：1999-12-13
申请号：JP2652692
申请日：1992-02-13
申请人： SEIKOO EPUSON KK
发明人： SHINHO AKIRA , IMAI KYOHIRO , IWANAMI WATARU , SASAKI SHIGEMI
IPC分类号： A44C5/00 , C23C30/00 , C25D3/50 , C25D5/10 , C25D5/12 , C25D5/14 , G04B37/22

79. 发明专利

JPH10330986A PLATINUM PLATING BATH AND ITS PLATING METHOD 失效
公开(公告)号：JPH10330986A
公开(公告)日：1998-12-15
申请号：JP14615697
申请日：1997-06-04
申请人： ELECTROPLATING ENG
发明人： KISHIMOTO KEISUKE
IPC分类号： C25D3/50
摘要： PROBLEM TO BE SOLVED: To obtain a platinum plating bath which is stable, is hardly decomposable and is high in current efficiency and high in plating speed by adding satd. mono- or dicarboxylic acid, its salt, satd. hydroxycarboxylic acid, its salt, primary amide and urea to a water-soluble bivalent platinum salt, stirring the mixture and using the resulted platinum compd. SOLUTION: The compds. of >=1 kinds among the monocarboxylic acid, dicarboxylic acid, hydroxycarboxylic acid, their salts, primary amide and urea are added preferably at 0.001 to 1.0 mol/l to the water-soluble bivalent platinum salt soln., such as tetrachloroplatinate (II), tetrabromoplatinate (II) or tetraamineplatinate (II), and the mixture is stirred. The resulted mixture is used as the platinum compd. and the platinum plating bath having a platinum concn. of 1 to 200 g/l is obtd. The platinum plating bath is preferably used under the operation conditions of pH 1 to 8, 50 to 98 deg.C, preferably about 80 to 90 deg.C and current density 0.01 to 3.0 A/dm , more preferably about 0.10 to 0.20 A/dm .

80. 发明专利

JPH09312369A LEAD FRAME 失效
公开(公告)号：JPH09312369A
公开(公告)日：1997-12-02
申请号：JP12668196
申请日：1996-05-22
申请人： HITACHI METALS LTD
发明人： HIRABAYASHI TAKESHI , NAKANISHI HIROKI
IPC分类号： C25D3/46 , C25D3/48 , C25D3/50 , C25D5/12 , H01L23/48 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To provide a lead frame where the deterioration of corrosion resistance when the coating layers of noble metal are formed on a material which is mainly composed of iron is improved. SOLUTION: The lead frame where the first base coating layer which is mainly composed of the noble metal of palladium, silver, rhodium and gold, whose standard single electrode potential is not less than +0.79V, for example, is formed on the face of the alloy material which is mainly composed of iron, a second base coating layer which is mainly composed of nickel and cobalt, whose standard single electrode potential is -0.4V to +0.1V, for example, is formed on the first base coating layer and a third coating layer of palladium whose standard single electrode potential is not less than +0.79V, for example, is formed on the second base coating layer is provided.

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