会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 79. 发明专利
    • Optical communication device substrate, method for manufacturing same, and optical communication device using same
    • 光通信设备基板,其制造方法和使用该光通信设备的光通信设备
    • JP2005070751A
    • 2005-03-17
    • JP2004202626
    • 2004-07-09
    • Nippon Electric Glass Co Ltd日本電気硝子株式会社
    • MATANO TAKAHIROYOSHIHARA SATOSHI
    • G02B6/00C03B37/00G02B1/02G02B6/02G02B6/10G02B6/16
    • C03C3/083G02B6/0218
    • PROBLEM TO BE SOLVED: To provide a an optical communication device substrate which has a negative coefficient of thermal expansion necessary for temperature compensation and a little thermal expansion hyesteresis and provide a method for manufacturing the same and an optical communication device using the same. SOLUTION: The optical communication device substrate is composed of ceramics or glass ceramics each containing a main crystal of a β-quartz solid solution or β-eucryptite solid solution of an average coefficient of thermal expansion -55 to -120x10 -7 /°C at -40 to +100°C and 12 ppm or less in the thermal expansion hysteresis at the time of elevating and lowering the temperature, respectively, at 1°C/min from -40 to 100°C and from 100 to -40°C. The manufacturing method comprises subjecting the substrate alternately to high-temperature processing at ≥20°C and low-temperature processing at ≥20°C, respectively, a plurality of times at a difference of 40 to 240°C between the high-temperature and low-temperature processing. The optical communication device is 12 ppm or less in the thermal expansion hysteresis at the time of elevating the temperature and lowering the temperature respectively at 1°C/min from -40 to 100°C and from 100 to -40°C. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种具有温度补偿所需的负的热膨胀系数和少量的热膨胀性经纬度的光通信装置基板,并提供其制造方法和使用其的光通信装置 。 解决方案:光通信设备基板由陶瓷或玻璃陶瓷组成,每个陶瓷或玻璃陶瓷均含有平均热膨胀系数为-55至-120×10 的β-石英固溶体或β-堇青石固溶体的主晶体, -7℃/℃,-40〜+ 100℃,升温降温时的热膨胀滞后为12ppm以下,以1℃/分钟从-40℃升至100℃ ℃至100℃至-40℃。 该制造方法包括在高温和高温处理之间交替进行高温处理,在≥20℃,低温处理在≥20℃,多次在40〜240℃的高温和 低温处理。 光通信装置在温度升高时的热膨胀滞后为12ppm以下,分别以-40℃〜100℃和100℃〜40℃以1℃/分钟降温。 版权所有(C)2005,JPO&NCIPI