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71. 发明专利

JPS5491289A RADIATION DETECTING ELEMENT BODY 失效
公开(公告)号：JPS5491289A
公开(公告)日：1979-07-19
申请号：JP15731277
申请日：1977-12-28
申请人： TOKYO SHIBAURA ELECTRIC CO
发明人： MIZUNOYA NOBUYUKI , UCHIDA NOBUO , SUZUKI SHIGEO , OCHIAI TOSHIHIKO , YAMAMOTO MINORU , MURATA MORIYOSHI
IPC分类号： A61B6/03 , G01T1/18 , H01J47/00 , H01J47/02
摘要： PURPOSE:To enable the thickness of insulator to be reduced and facilitate wiring formation by forming the insulator opposedly disposed with a linear electrode and a plate form electrode with ceramics. CONSTITUTION:Metallized surfaces 4 are provided on both surfaces of ceramics 3 like alumina and a guard electrode 4a formed of metallized face is provided on one surface. Brazing surfaces 5 and further metals 6 such as Ni-plated Kovar are provided on the surfaces 4. This insulator 3 is bonded onto a plate form electrode 2 such as Mo via the metals 6 by soldering parts 7. Linear electrodes 1 such as W fine wires are bonded between the two insulators 3 onto the metals 6 by the soldering parts 7 parallel in a plurality in opposition to the electrode 2. A plurality of such radiation detecting element bodies are sealed in a high pressure gas and are used for Computerized Tomography scanners.

72. 发明专利

JPS5483005A HIGH PURITY ALUMINA SINDERED BODY AND METHOD OF MEKING SAME 失效
公开(公告)号：JPS5483005A
公开(公告)日：1979-07-02
申请号：JP14931677
申请日：1977-12-14
申请人： TOKYO SHIBAURA ELECTRIC CO
发明人： MIZUNOYA NOBUYUKI , SUZUKI SHIGEO , SAKAI MASATO
IPC分类号： C04B35/111 , C04B35/10

73. 发明专利

JPS5462209A CERAMIC SINTERED BODY 失效
公开(公告)号：JPS5462209A
公开(公告)日：1979-05-19
申请号：JP12867377
申请日：1977-10-28
申请人： TOKYO SHIBAURA ELECTRIC CO
发明人： HASE FUMIO , MIZUNOYA NOBUYUKI , SUZUKI SHIGEO , OCHIAI TOSHIHIKO , KAMIYA MAKIO
IPC分类号： C04B35/20 , C04B35/16

74. 发明专利

JPH0516398B2 失效
公开(公告)号：JPH0516398B2
公开(公告)日：1993-03-04
申请号：JP3382986
申请日：1986-02-20
申请人： TOKYO SHIBAURA ELECTRIC CO
发明人： SATO HIDEKI , MIZUNOYA NOBUYUKI , NAGATA MITSUHIRO
IPC分类号： C04B41/90 , C04B41/52 , C04B41/89 , C23C18/54 , C23C28/00 , C23C30/00 , H05K1/09 , H05K3/38

75. 发明专利

JPH0476500B2 失效
公开(公告)号：JPH0476500B2
公开(公告)日：1992-12-03
申请号：JP5143786
申请日：1986-03-11
申请人： TOKYO SHIBAURA ELECTRIC CO
发明人： KOJIMA SHINJIRO , MIZUNOYA NOBUYUKI
IPC分类号： H01L21/60 , H01L21/52 , H01L23/32
摘要： PURPOSE:To improve the reliability and production yield of a semiconductor device such as a power transistor module by a method wherein the belt-shaped portions where the thicknesses of the plates are thinner are provided along the circumferences of element mounting pads, wire bonding pads and bonding metal plates. CONSTITUTION:A 98% alumina plate of 0.635mm thickness is used as an insulating plate 33. Wire bonding pads 23 and chip mounting pads 24 formed on one main surface of the insulating plate 33 and bonding metal plates 25 formed on the other main surface of the insulating plate 33 are composed of tough-pitch copper plates. Steps are formed on the upper surfaces of the circumference portions of the metal plates such as the pads 23 and 24 and the bonding metal plates 25 and the plated thicknesses along those portions are formed to be as thin as 0.1mm. With this constitution, contraction forces of a group of the metal plates are reduced so that cleaving and cracking of the insulating plate can be avoided. If a semiconductor device is formed by employing the substrate like this, the yield and reliability of the products can be improved.

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