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71. 发明专利

JPS63123567A VAPOR PHASE SOLDERING DEVICE 失效
公开(公告)号：JPS63123567A
公开(公告)日：1988-05-27
申请号：JP27072486
申请日：1986-11-13
申请人： TAMURA SEISAKUSHO KK
发明人： ABE NOBUHIDE , TAKAHASHI TAKAO , HIRONO SHUNICHI
IPC分类号： B23K1/015 , H05K3/34
摘要： PURPOSE:To miniaturize an equipment line and to improve the product quality by variably controlling the speed of a conveyor at the low speed including a stoppage in case of a work being located between preheaters and under saturated vapor phase. CONSTITUTION:The variable speed motor 33 driving the endless chain of a conveyor 16 with its rounding is provided and the position detecting means of the works 17, 18 of a printed circuit board, etc., is arranged as well. At the time when the works 17, 18 are in an A-B zone they are transferred at comparatively low speed, temporarily stopped by preheaters 25, 26 and sufficiently preheated. The works 17, 18 are controlled at high speed at a cooling part 23, and transferred at variable speed at temporary stop and low speed under a saturated vapor phase 15 and in E-F zone. With this method, a good soldering can be performed as well as sufficient preheating. Consequently the preheaters 25, 26 and vapor tank 11 are miniaturized and the miniaturization of the equipment line and the improvement in the product quality are enabled.

72. 发明专利

JPS63123565A FILTERING METHOD IN VAPOR PHASE SOLDERING DEVICE 失效
公开(公告)号：JPS63123565A
公开(公告)日：1988-05-27
申请号：JP27072286
申请日：1986-11-13
申请人： TAMURA SEISAKUSHO KK
发明人： ABE NOBUHIDE , TAKAHASHI TAKAO , HIRONO SHUNICHI
IPC分类号： H05K3/34 , B23K1/015
摘要： PURPOSE:To improve a filtering efficiency, etc., by providing a liq. storage tank and filtering tank separately and storing once the liquid of the liq. storage part in a storing tank as well, then filtering the whole at one time by the filtering tank. CONSTITUTION:The liq. storage tank 33 having sufficient capacity at the lower part of a liq. storing part 12 is provided and the closed filtering tank 36 is arranged at the bottom part thereof by interposing a motor valve 34 as well. After completion of the work all of the liq. 13 of the liq. storing part 12 is discharged to the tank 33, first, and then the valve 34 is opened, the liq. inside the tank 33 is discharged and the liq. 13 is filtered. At the time when the tank 33 becomes empty the liq. 13 is circulated to the liq. storing part 12. With this method, the mixture of a dirty liq. and filtered liq. is eliminated and the filtering is completed in a short time, so the filtering efficiency is improved and moreover the liq. 13 is circulated after its cooling and the liq. 13 leakage is reduced.

73. 发明专利

JPS63115676A HYDROFLUORIC ACID GENERATION PREVENTING METHOD FOR GASEOUS PHASE TYPE SOLDERING DEVICE 失效
公开(公告)号：JPS63115676A
公开(公告)日：1988-05-20
申请号：JP26241686
申请日：1986-11-04
申请人： TAMURA SEISAKUSHO KK
发明人： ABE NOBUHIDE , TAKAHASHI TAKAO , HIRONO SHUNICHI
IPC分类号： B23K1/015
摘要： PURPOSE:To prevent the generation of hydrofluoric acid whose corrosiveness is strong, by supplying heated cooling water whose temperature is a little higher than an atmospheric temperature of the outside of a tank, to a water cooling type cooling part provided on work carrying in-and-out parts, in a vapor tank of a soldering device using a fluorine compound inert vapor phase. CONSTITUTION:A soldering device forms a fluorine compound inert vapor phase 15 in the inside of a vapor tank 11, and applies reflow soldering to works 17, 18 which are carried extending from a work carrying-in port part 21 to a carrying-out port part 22. This device prevents the vapor phase from leaking out to the outside, by a condensing action of water cooling type cooling parts 23, 24 provided on the carrying-in port part 21 and the carrying-out port part 22. At the time of operating, dewing on the surface of the cooling parts 23, 24 is prevented by supplying the cooling water which is heated to a temperature being a little higher than an atmospheric temperature of the outside of the tank, to the cooling parts 23, 24. In such a way, it can be prevented that hydrofluoric acid is generated on the surface of the water cooling type cooling part.

74. 发明专利

JPS62252668A GASEOUS PHASE SOLDERING DEVICE 失效
公开(公告)号：JPS62252668A
公开(公告)日：1987-11-04
申请号：JP9402486
申请日：1986-04-23
申请人： TAMURA SEISAKUSHO KK
发明人： ABE NOBUHIDE , TAKAHASHI TAKAO , OKANO TERUO
IPC分类号： B23K1/015 , B23K3/04 , H05K3/34
摘要： PURPOSE:To execute satisfactory soldering at an optimum temp. gradient and to reduce the size over the entire part of a device by preheating the work carried into the device, subjecting the same to gaseous phase soldering and quick cooling, ejecting the work from the device and feeding the vapor liquefied in a vapor condensation chamber into a liquid phase chamber. CONSTITUTION:The work 17 carried 17a into the device is preheated by an electric heater 31 and is passed in the vapor phase 15 of an evaporation vessel 11 where a fluorine base inert solvent 13 in a liquid tank part 12 is evaporated by a heater 14. The cream solder on the surface of the work 17 is melted and the work is satisfactorily soldered. The work is quickly cooled with the cooling gaseous nitrogen from a liquid nitrogen shower unit 32 of an ejection port part 18, then the work is ejected. On the other hand, the vapor 15 sucked by a fan 26 of a liquid recovering system 21 is liquefied at a high temp. by a cooling coil 35 of a condensation chamber 34 and the liquid is recovered through a flow passage 36 into the liquid tank part 12. The sucked 26 excess vapor is recovered by a cooler 24 and is pumped 27 into the liquid tank part 12. The work 17 is soldered at the optimum temp. gradient and the size over the entire part of the device is reduced to decrease vapor loss.

75. 发明专利

JPS62227571A SOLDERING METHOD 失效
公开(公告)号：JPS62227571A
公开(公告)日：1987-10-06
申请号：JP6915686
申请日：1986-03-27
申请人： TAMURA SEISAKUSHO KK
发明人： MASUDA TSUGUNORI , ABE NOBUHIDE , OKANO TERUO
IPC分类号： B23K31/02 , B23K1/00 , H05K3/34
摘要： PURPOSE:To prevent the generation of a pin hole and void at a soldering part by exhausting the gas contained in the molten solder and to perform the soldering of good quality by quickening the gasifying drying of a flux, by executing the soldering in a vacuum chamber. CONSTITUTION:The printed circuit board P transferred by a conveyor 21 is dried with a heater 13 after sticking a flux with a foaming type fluxor 12. It is in succession soldered in a jet type solder tank 15 by being transferred with the conveyor 3 located inside a vacuum chamber 14 from an open gate 22. In this case, the generation of a pin hole and void at the soldering part is eliminated by exhausting the contained gas in the molten solder and the gasifying dry of the flux is quickened as well. it is then cooled with a fan 16 by being carried out to the external part conveyor 25 from the open gate 24.

76. 发明专利

JPS62155904A METHOD FOR COOLING HEATING MEDIUM VAPOR IN VAPOR-PHASE SOLDERING DEVICE 失效
公开(公告)号：JPS62155904A
公开(公告)日：1987-07-10
申请号：JP29488085
申请日：1985-12-27
申请人： TAMURA SEISAKUSHO KK
发明人： ABE NOBUHIDE , ABE YOSHINOBU , TAKAHASHI TAKAO , OKANO TERUO
IPC分类号： B01D5/00 , B23K1/015
摘要： PURPOSE:To reduce the electric power necessary for reheating a heating medium by cooling the medium vapor at a high temp. below the b.p. of the medium and above 70 deg.C to condense the vapor, and controlling the unnecessary lowering of the temp. of the condensed medium. CONSTITUTION:Creamed solder intervening between a printed board P and loaded parts W is fused by the heating medium vapor 15 in the vapor-phase soldering device. The flowing out of the heating medium vapor 15 here used to the outside is prevented by cooling and condensing the vapor. Although the medium is cooled by using water in the conventional vapor-phase soldering device, the medium is excessively cooled in this case. Accordingly, cooling is carried out at a temp. below the b.p. of the medium and above 70 deg.C in this device. Concretely, such as a liq. cooling method using oil or a fluorine solvent and an air cooling method using a radiator fan are appropriately selected and used.

77. 发明专利

JPS62151265A VAPOR PHASE TYPE SOLDERING DEVICE 失效
公开(公告)号：JPS62151265A
公开(公告)日：1987-07-06
申请号：JP29437885
申请日：1985-12-26
申请人： TAMURA SEISAKUSHO KK
发明人： ABE NOBUHIDE , TAKAHASHI TAKAO , KAKIHARA KATSUYUKI
IPC分类号： B23K1/015 , H05K3/34
摘要： PURPOSE:To save the consumption of a solvent by inclining and providing the carrying conveyor of a printed circuit board in a carrying direction in a vapor tank. CONSTITUTION:In the inside of a vapor tank 11, sprockets 25, 26 are placed by providing the difference of height, with respect to the carrying conveyor 21 of the printed circuit board, and the inclined carrying part 27 of an ascending inclined state is formed. The printed circuit board carried into the vapor tank 11 through the conveyor 21 passes through a vapor phase 18, heated by the vaporized latent heat of a fluorine compound inactive solvent 13, and a lead of parts which have been loaded on the board is soldered. In this case, the vapor phase 18 is condensed and liquefied by the board and the surface of the loaded parts. Subsequently, when the board passes through the inclined carrying part 27, the liquefied solvent flows down by its dead weight along the inclined surface of the substrate, and collected into a solvent tank 12. According to this method, the consumption of an expensive fluorine compound inactive solvent 13 can be saved.

78. 发明专利

JPS61295637A METHOD FOR REMOVING EXCESSIVE MOLD FROM IC LEAD FRAME 失效
公开(公告)号：JPS61295637A
公开(公告)日：1986-12-26
申请号：JP13746485
申请日：1985-06-24
申请人： TAMURA SEISAKUSHO KK
发明人： MASUDA TSUGUNORI , ABE NOBUHIDE , KIMOTO HISASHI , OKANO TERUO , TAKAHASHI TAKAO
IPC分类号： H01L21/56 , B29C37/02 , B29L31/34
摘要： PURPOSE:To remove excessive mold to the details with high efficiency without damaging the lead frame metal surface by a method wherein the excessive mold is moistened and softened by exposure to a chemical solvent and then to a hyper-pressure water jet for removal. CONSTITUTION:A lead frame 2 being transported, by a conveyer 13 goes through a jet of a chemical solvent 34 in a pre-treatment unit 21, where excessive mold 3 is softened and moistened owing to the work of the chemical solvent 34. Further, while in a hyper-tension water jet unit 22, the lead frame 2 is attacked by a jet of hyper-pressure water 44, from an upper nozzle 41 and then from a lower nozzle 42. Exposed to the pressure and chock supplied by the hyper- pressure water 44, the now-softened excessive mold 3 is pushed through small holes on the lead frame 2 to the other side. At the same time, the chemical solvent 34 is washed away from the IC package 1 and lead frame 2.

79. 发明专利

JPS61293660A SOLDERING DEVICE 失效
公开(公告)号：JPS61293660A
公开(公告)日：1986-12-24
申请号：JP13318985
申请日：1985-06-19
申请人： TAMURA SEISAKUSHO KK
发明人： MASUDA TSUGUNORI , ABE NOBUHIDE , OKANO TERUO
IPC分类号： B23K1/08 , B23K3/06 , H05K3/34
摘要： PURPOSE:To improve the solder cut from a material to be soldered and to eliminate defective soldering by providing oscillation diaphragms near the molten solder surface with which the material to be soldered is brought into contact. CONSTITUTION:A partition plate 2 is provided to the inside of a solder tank 1 and a nozzle body 4 is erected to a solder discharge port 3. A solder gushing port 4a is provided to the top end of the nozzle body 4 and a route for conveying a printed wiring board P as the material to be soldered and parts W to be mounted thereon is provided on the side slightly upper than said port. The oscillation diaphragm 7 is provided to the outside of the port 4a and the upper side of a feed side solder receiving plate 5 and the oscillation diaphragm 8 is provided on the upper side of an ejection side solder receiving plate 6.

80. 发明专利

JPS60133351A METHOD FOR MEASURING SPECIFIC GRAVITY OF FLUX 失效
公开(公告)号：JPS60133351A
公开(公告)日：1985-07-16
申请号：JP24287083
申请日：1983-12-22
申请人： TAMURA SEISAKUSHO KK
发明人： ABE NOBUHIDE , TAKAHASHI HIDEAKI , HIKAGE KAZUO
IPC分类号： B23K1/00 , B23K35/363 , G01N9/18
摘要： PURPOSE:To automatically correct a temp. error, by electrically detecting the temp. of flux by an electric type thermometer inserted into the flux and adding quantity of electricity corresponding to the change in the temp. of the flux to quantity of electricity corresponding to the specific gravity of the flux. CONSTITUTION:The wt. 2 of a hydrometer in flux 1 is provided in a floated state and the slider 5 of a variable resistor 4 is connected to the wt. 2 moved and displaced in an up-and-down direction through a rod 3. Potential difference taken out from the slider 5 is amplified by an operation amplifier 6 and read by a voltometer 7 to measure the specific gravity of the flux 1. A thermister 8 as an electric type thermometer is inserted into the flux 1 in the vicinity of the wt. 2 so as to be provided in a protective pipe 9. For example, resistors 20 equal in a resistance value at 20 deg.C are connected to the thermistor 8 in series. A resistor 10 and the thermistor 8 are provided between a power source +E and a power source -E while the resistor 4 is provided between the power source -E and the earth, and the connection point of the resistor 10 and the termistor 8 is connected to the input of the amplifier 6. By this mechanism, a temp. error can be corrected automatically.

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