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71. 发明专利

JPH06285753A CENTERLESS GRINDER 失效
公开(公告)号：JPH06285753A
公开(公告)日：1994-10-11
申请号：JP7724193
申请日：1993-04-02
申请人： MITSUBISHI MATERIALS CORP
发明人： KIMURA YOSHIHIKO , TANAKA HIROSHI , SHIRATORI MASATAKA
IPC分类号： B24B5/22 , B24B5/313
摘要： PURPOSE:To extremely enhance circularity at the ground portion of a round bar by forming a case guide plane in a maximum depth grinding area in a concentric shape with the outer periphery of a disc grinding wheel. CONSTITUTION:When a round bar is moved a distance to a grinding guide plane 14a along a cutting guide plane 14b, the partial area of the round bar A is put in contact with a rotating grinding wheel 10 and its peripheral face is ground little by little while gradually increasing the grinding depth. When the round bar A reaches the grinding guide plane 14a, the advancing depth (d1-d2)/2 of the grinding wheel 10 to the outer periphery of the round bar A is maximum (d1 is the outer diameter of the round bar). Also, as the guide plane 14a is formed in a concentric curve with the outer periphery of the grinding wheel 10, the round bar A is ground at the same depth all over the guide plane 14a area with the small column of diameter d2 stepped down as predetermined.

72. 发明专利

JPH0681185A PROTECTIVE BODY FOR EDGE OF ELECTRODE PLATE FOR ELECTROLYSIS AND ITS FASTENER AND MOUNTING METHOD THEREFOR 失效
公开(公告)号：JPH0681185A
公开(公告)日：1994-03-22
申请号：JP8893293
申请日：1993-04-15
申请人： MITSUBISHI MATERIALS CORP
发明人： TANAKA HIROSHI , MASUDA YASUO
IPC分类号： C25C1/12 , C25C7/02
摘要： PURPOSE:To produce the protective body for the edge of an electrode plate for electrolysis which is greatly improved in stress corrosion crack resistance by providing the one flank of a bar-shaped body with a groove for mounting the electrode plate forming a fitting recess for mounting a fastener on the other flank and providing the other two flanks with specific curves. CONSTITUTION:The mounting groove 22A for mounting the electrode base plate is formed on one flank 21 of the bar-shaped body 20A made of a synthetic resin and an arc-shaped fitting recess 25A for mounting a tightening rod 40 is formed on the other flank 23 respectively, in the longitudinal direction of the bar-shaped body 20A at the time of extrusion molding the bar-shaped body 20A. The spacing between a pair of the outside surfaces 26A continuous with both flanks 21, 23 of the bar-shaped body 20A is so set as to be held from the fitting hollow recess 25A side to the mounting groove 22A side and the arc-shaped recess lines 27A are formed in the middle part of the respective outside surfaces 26A along the longitudinal direction of the bar-shaped body 20A. The bar-shaped body 20A having such shape is used as the protective body for the edge of the electrode plate for electrolysis, by which the shape deformation in resin molding is suppressed, the mountability of the electrode plate is improved, thermal stresses are suppressed as far as possible and the crackability is greatly ameliorated.

73. 发明专利

JP2001315054A DRESSER AND DRESSING DEVICE USING THE SAME 失效
公开(公告)号：JP2001315054A
公开(公告)日：2001-11-13
申请号：JP2000131785
申请日：2000-04-28
申请人： MITSUBISHI MATERIALS CORP
发明人： KOBAYASHI TATSUNOBU , ATAKA YOSHITADA , TANAKA HIROSHI
IPC分类号： B24B53/017 , B24B53/02 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a dresser and a dressing device using it hardly causing vibrations and capable of suppressing a vibration in a short time even when it does occur. SOLUTION: This dresser 21 is composed of a substantially a disc-like dresser main body 22 and a plurality of dressing action parts B arranged in an outer circumference lower part of the dresser main body 22 in its circumferential direction. The dressing action parts B are provided in the circumferential direction of the dresser main body 22 with unequal intervals.

74. 发明专利

JP2001315053A DRESSER AND DRESSING DEVICE USING THE SAME 失效
公开(公告)号：JP2001315053A
公开(公告)日：2001-11-13
申请号：JP2000131784
申请日：2000-04-28
申请人： MITSUBISHI MATERIALS CORP
发明人： KOBAYASHI TATSUNOBU , TANAKA HIROSHI , OWADA ISAO
IPC分类号： B24B53/017 , B24B53/02 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide an economically usable dresser and a dressing device using this. SOLUTION: This dresser 21 is composed of a substantially a disc-like dresser main body 22 and a dressing action part 23 provided individually from the dresser main body 22. A holding means detachably holding the dressing action part 23 with respect to the dresser main body 22 is provided in the dresser 21.

75. 发明专利

JP2001277107A HEAD FOR POLISHING WAFER AND POLISHING DEVICE USING THIS 失效
公开(公告)号：JP2001277107A
公开(公告)日：2001-10-09
申请号：JP2000099649
申请日：2000-03-31
申请人： MITSUBISHI MATERIALS CORP
发明人： KOBAYASHI TATSUNOBU , TANAKA HIROSHI , EMORI HARUYOSHI
IPC分类号： B24B37/04 , B24B37/30 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a head for polishing a wafer and a polishing device using this head for polishing the wafer capable of improving polishing accuracy of the wafer. SOLUTION: In this head 1 for polishing a wafer, a sub-carrier 6 of almost disc shape with a lower surface serving as a wafer support surface 6a is provided, a vibration isolation sheet 11 is fixed over a total surface to the wafer support surface 6a. At least one part of the vibration isolation sheet 11 is constituted by a gel-state substance having a vibration isolating character with silicon serving as a main agent.

76. 发明专利

JP2001260004A WAFER POLISHING HEAD 失效
公开(公告)号：JP2001260004A
公开(公告)日：2001-09-25
申请号：JP2000071210
申请日：2000-03-14
申请人： MITSUBISHI MATERIALS CORP
发明人： KOBAYASHI TATSUNOBU , TANAKA HIROSHI , RIKITA NAOKI
IPC分类号： B24B37/005 , B24B37/30 , H01L21/304 , B24B37/00 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a wafer polishing head capable of uniformly pressing a wafer against the polishing pad by pressing pressure smaller than conventional one. SOLUTION: A wafer polishing head 1 is provided with a head main body 6, a diaphragm 7 stretched in the head main body 6, a first pressure adjusting mechanism 9 for adjusting fluid pressure filled in a fluid chamber 17, a carrier 8 fixed to the diaphragm 7 and having the lower surface 8a for holding one surface of a wafer W to be polished, and a retainer ring 20 fixed to the diaphragm 7 and to be brought into contact with the polishing pad in polishing. An elastic film 22 is provided in the position on the carrier lower surface 8a surrounded with the retainer ring 20, a fluid supplying passage 25 for supplying fluid to a part between the carrier lower surface 8a and the elastic film 22 is provided on the carrier 8, and a second pressure adjusting mechanism 10 for adjusting pressure of fluid to be supplied to a part between the carrier lower surface 8a and the elastic film 22 is connected to the fluid supplying passage 25.

77. 发明专利

JP2001088010A DRESSING DEVICE 失效
公开(公告)号：JP2001088010A
公开(公告)日：2001-04-03
申请号：JP27117699
申请日：1999-09-24
申请人： MITSUBISHI MATERIALS CORP
发明人： KOBAYASHI TATSUNOBU , TANAKA HIROSHI , RIKITA NAOKI , ATAKA YOSHITADA
IPC分类号： B24B53/017 , B24B53/12 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide the subject device having a good dressing performance kept at all times and being used economically. SOLUTION: The tip of a cutter 15 provided protrusinvely at a lower surface 13 of a dresser 12 is made to abut against the surface of polishing cloth, then it is relatively moved parallel with the surface thereof. Thereby the surface is cut.

78. 发明专利

JP2000343409A WAFER POLISHING DEVICE AND MANUFACTURE OF WAFER 失效
公开(公告)号：JP2000343409A
公开(公告)日：2000-12-12
申请号：JP15073099
申请日：1999-05-28
申请人： MITSUBISHI MATERIALS CORP
发明人： KOBAYASHI TATSUNOBU , TANAKA HIROSHI
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a wafer polishing device capable of improving the uniformity of a polished face of wafer and its manufacturing method. SOLUTION: A wafer holding head 1 is provided with a head main body 2, a diaphragm 5 stretched in the head main body 2, a pressure adjusting mechanism 30 adjusting pressure of fluid filled in a fluid chamber 14, a carrier 6 for holding one face of a wafer W to be polished, a retainer ring 7 provided concentrically at outer periphery of the carrier 6, a dome member 20 which is formed like an upward projection, whose hem part 24 adheres closely on an upper face of the carrier 6, and which has a sealed space 25 therein, and a second pressure adjusting mechanism 31 communicated with the sealed space 25 and adjusting pressure of the sealed space 25 independently from the pressure adjusting mechanism 30.

79. 发明专利

JP2000334657A SUBCARRIER, POLISHING DEVICE INCOPORATING THEREOF AND MANUFACTURE OF WAFER 失效
公开(公告)号：JP2000334657A
公开(公告)日：2000-12-05
申请号：JP21293999
申请日：1999-07-27
申请人： MITSUBISHI MATERIALS CORP
发明人： KOBAYASHI TATSUNOBU , TANAKA HIROSHI
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a polishing device equipped with a subcarrier, and a method of manufacturing a wafer, wherein the subcarrier can flatlymirror- surface-finish a workpiece to be polished so as to allow the workpiece to have a uniform polished surface, and it is possible to enhance the productivity. SOLUTION: A subcarrier has a pressure receiving surface 21b which receive a static hydraulic pressure from a compressed air (fluid) in an air chamber (fluid chamber) and which has a large area in comparison with the area of 2 attaching surface 21a to which a wafer W (workpiece to be polished). With this arrangement, the pressure receiving surface 21b side overhangs outward from the outer peripheral part 21c of the attaching surface 21a so as to define an overhanging part 21d.

80. 发明专利

JP2000263401A WAFER POLISHING DEVICE AND WAFER MANUFACTURING DEVICE 失效
公开(公告)号：JP2000263401A
公开(公告)日：2000-09-26
申请号：JP6758399
申请日：1999-03-12
申请人： MITSUBISHI MATERIALS CORP
发明人： KOBAYASHI TATSUNOBU , TANAKA HIROSHI
IPC分类号： B24B49/16 , B24B1/00 , B24B7/04 , B24B37/04 , B24B37/30 , B24B37/32 , G01L5/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a wafer polishing device and a wafer manufacturing method for stably detecting a complicated state of the polishing work to a wafer. SOLUTION: A wafer holding head 1 is provided with a carrier 6 fixed to a diaphragm 5 spread within a head main body 2 so as to hold one surface of a wafer W to be polished, a plurality of torque transmitting mechanisms 20 provided along the circumferential direction between the carrier 6 and the head main body 2 and each having a sensor part 21, and an operation part 31 for operating the output from individual sensor part 21 so as to detect the force acting on the wafer W. The diaphragm 5 is so formed as not to be affected by excessive torque from the torque transmitting mechanism 20, while the force acting on the wafer W is directly observed by the sensor part 21 via the carrier 6. Therefore, the polishing work to the wafer W is carried out stably, with the force acting on the wafer W being detected.

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