专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

71. 发明专利

JP2005015310A Porous silica film and laminated body having it 有权
标题翻译：多孔硅胶膜和层压体
公开(公告)号：JP2005015310A
公开(公告)日：2005-01-20
申请号：JP2003185552
申请日：2003-06-27
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： FUNAYAMA KATSUYA , MORI HIROSHI , TAKABA HIROSHI
IPC分类号： B32B5/18 , B32B9/00 , C01B33/12 , H01L21/312
摘要： PROBLEM TO BE SOLVED: To provide a porous silica film excellent in low reflection having little wavelength dependency at a visible light range, in easiness at a laminating step, in stain-proof and in mechanical strength and to provide a laminated body suitable for an optical material and a semiconductor material using it.
SOLUTION: The porous silica film has successive variation of a void content in a film thickness direction and ten-point surface roughness Rz of 100 nm or less.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供在可见光范围内的波长依赖性低，在层压步骤的容易性，防污染和机械强度方面具有优异的低反射性的多孔二氧化硅膜，并且提供适合于用于光学材料和使用它的半导体材料。解决方案：多孔二氧化硅膜在膜厚度方向上的空隙含量和10点表面粗糙度Rz为100nm以下的连续变化。版权所有（C）2005，JPO＆NCIPI

72. 发明专利

JP2004002114A Silica gel for ionic conductor, ionic conductor, fuel cell and rechargeable lithium-ion battery 有权
公开(公告)号：JP2004002114A
公开(公告)日：2004-01-08
申请号：JP2002160636
申请日：2002-05-31
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： MORI HIROSHI , TEZUKA MAKOTO
IPC分类号： C01B33/152 , B82Y30/00 , B82Y99/00 , C08G77/06 , H01B1/06 , H01M8/02 , H01M10/05 , H01M10/0525 , H01M10/0565 , H01M10/40
CPC分类号： Y02E60/122 , Y02E60/50
摘要： PROBLEM TO BE SOLVED: To provide a silica gel capable of precisely controlling physical properties such as pore diameter, capable of designing an ionic conductor while making good use of these physical properties, having a large pore volume and suitably usable as a carrier of an ionic conductor into which an adequate amount of an ionic conductive compound can be incorporated.
SOLUTION: The silica gel has (a) 0.3-3.0 ml/g pore volume, (b) 200-1,000 m
2 /g specific surface area and (c) less than 20 nm maximum diameter (D
max ) of pores, (b) it is amorphous, and (e) when chemical shift of Q
4 peak in solid Si-NMR is represented by δ(ppm), δ satisfies the expression -0.0705×(D
max )-110.36>δ.
COPYRIGHT: (C)2004,JPO

73. 发明专利

JP2014043505A Liquid polysiloxane composition, kit for producing polysiloxane cured product, and production method of the same 有权
标题翻译：液体聚硅氧烷组合物，生产聚硅氧烷固化产品的工具包及其生产方法
公开(公告)号：JP2014043505A
公开(公告)日：2014-03-13
申请号：JP2012185996
申请日：2012-08-27
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： TERADA NORIAKI , MORI HIROSHI , TAKIZAWA KENICHI , NIIHARA MASATO , TAKASU MAYUKO
IPC分类号： C08G77/06
摘要： PROBLEM TO BE SOLVED: To provide a production method of a liquid polysiloxane composition suitable for a two-liquid curable silicone resin.SOLUTION: The production method of a liquid polysiloxane composition relating to an embodiment includes: a first step of preparing a mixture of a silane compound and/or a siloxane compound that can be subjected to polycondensation and has a silicon atom coupled to a hydroxyl group or a hydrolyzable group, and an organic-metal compound that acts as a condensation catalyst; a second step of thickening the mixture; and a third step of heating the mixture thickened in the second step with water to lose at least partially the condensation catalyst activity of the organic-metal compound.
摘要翻译：要解决的问题：提供适用于双液态可固化有机硅树脂的液体聚硅氧烷组合物的制备方法。溶液：与实施方案相关的液体聚硅氧烷组合物的制备方法包括：制备第一步骤硅烷化合物和/或可进行缩聚反应并具有与羟基或可水解基团偶联的硅原子的硅氧烷化合物和作为缩合催化剂的有机金属化合物; 第二步增稠混合物; 以及第三步骤，用水加热第二步中增稠的混合物，至少部分地损失有机金属化合物的缩合催化剂活性。

74. 发明专利

JP2013203874A Zirconium-containing liquid silicone resin composition 审中-公开
标题翻译：含锆含氟硅氧烷树脂组合物
公开(公告)号：JP2013203874A
公开(公告)日：2013-10-07
申请号：JP2012074085
申请日：2012-03-28
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： TAKASU MAYUKO , MORI HIROSHI
IPC分类号： C08L83/07 , C08G77/08 , C08L83/05 , C08L83/06 , H01L23/14
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a zirconium-containing liquid silicone resin composition, which shows good adhesiveness to a metal wiring board such as a lead frame, can be suitably used for manufacturing a semiconductor light-emitting device, has high reflectance, and is effective to enhance an LED output, and further is excellent in stability of the composition.SOLUTION: A zirconium-containing liquid silicone resin composition comprises the following components (A) and (B). (A) 100 parts by weight of a liquid polyorganosiloxane including an alkoxy group and including an alkenyl group and a hydrosilyl group in the range of 1/0.1 to 1/10 as a ratio of alkenyl group/hydrosilyl group (equivalent ratio). (B) 0.01 to 10 parts by weight of a zirconium chelate compound.
摘要翻译：要解决的问题：为了提供对诸如引线框架之类的金属布线板具有良好粘合性的含锆液体硅树脂组合物可以适用于制造半导体发光器件，具有高反射率，并且是有效提高LED输出，进一步具有优异的组成稳定性。解决方案：含锆液体硅酮树脂组合物包含以下组分（A）和（B）。（A）作为烯基/氢化硅烷基的比率（当量比），将100重量份含有烷氧基并且包括烯基和氢化硅烷基的液体聚有机硅氧烷在1 / 0.1〜1/10的范围内。（B）0.01〜10重量份锆螯合物。

75. 发明专利

JP2013183013A Package sheet for semiconductor light emitting device, manufacturing method of the same, package for semiconductor light emitting device, manufacturing method of package for semiconductor light emitting device, and semiconductor light emitting device 审中-公开
标题翻译：半导体发光装置的封装片及其制造方法，半导体发光装置的封装，半导体发光装置的封装的制造方法以及半导体发光装置
公开(公告)号：JP2013183013A
公开(公告)日：2013-09-12
申请号：JP2012045679
申请日：2012-03-01
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： KATO HANAKO , MORI HIROSHI
IPC分类号： H01L33/48 , H01L23/02
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a package sheet for a semiconductor light emitting device which enables a suspending part to be easily cut, and to provide a manufacturing method of the package sheet for the semiconductor light emitting device, a package obtained from the package sheet for the semiconductor light emitting device, a manufacturing method of the package, and a semiconductor light emitting device using the package.SOLUTION: A package sheet 1 for a semiconductor light emitting device includes: a lead frame 10 having multiple openings; and multiple light emitting element housing parts 21 formed by a resin molding 20 integrally molded with the lead frame 10. The light emitting element housing parts 21 are supported by the lead frame 10 through suspending parts 22 forming parts of the resin molding 20. A precut line 23 is provided in each suspending part 22.
摘要翻译：要解决的问题：提供一种能够使悬挂部分易于切割的半导体发光器件的封装片，并提供用于半导体发光器件的封装片的制造方法，从封装片获得的封装用于半导体发光器件，封装的制造方法和使用该封装的半导体发光器件。解决方案：用于半导体发光器件的封装片1包括：具有多个开口的引线框架10; 以及由与引线框架10整体模制的树脂模制件20形成的多个发光元件容纳部分21.发光元件收纳部分21通过形成树脂模制件20的部分的悬挂部分22由引线框架10支撑。线23设置在每个悬挂部分22中。

76. 发明专利

JP2013004923A Post attached reflector for semiconductor light-emitting device, resin package for semiconductor light-emitting device, and semiconductor light-emitting device 审中-公开
标题翻译：用于半导体发光器件的后连接反射器，用于半导体发光器件的树脂封装和半导体发光器件
公开(公告)号：JP2013004923A
公开(公告)日：2013-01-07
申请号：JP2011137727
申请日：2011-06-21
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： KATO HANAKO , MORI HIROSHI
IPC分类号： H01L33/48 , H01L33/60
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a post attached reflector for a semiconductor light-emitting device which is excellent in heat resistance and light resistance, which has high reflectivity even in a thin thickness in a wide range of wavelength, and which is excellent in formability, heat dissipation and mass productivity.SOLUTION: A post attached reflector for a semiconductor light-emitting device is made of a silicone resin compact obtained by forming a liquid thermosetting silicon resin composition by liquid state injection molding. The silicon resin compact has the light reflectivity of 80% or more obtained by measuring a molded form sample of thickness 0.4 mm under a condition of wavelength 460 nm.
摘要翻译：要解决的问题：为了提供耐热性和耐光性优异的半导体发光装置的后附装反射器，即使在宽波长范围内也具有较高的反射率，并且其是成型性，散热性和批量生产率优异。解决方案：用于半导体发光器件的柱式反射器由通过液态注射成型形成液态热固性硅树脂组合物获得的硅树脂压块制成。硅树脂成形体的光反射率通过在波长460nm的条件下测量厚度为0.4mm的成型样品而获得的80％以上。版权所有（C）2013，JPO＆INPIT

77. 发明专利

JP2013004905A Semiconductor light-emitting device package and semiconductor light-emitting device 审中-公开
标题翻译：半导体发光器件封装和半导体发光器件
公开(公告)号：JP2013004905A
公开(公告)日：2013-01-07
申请号：JP2011137440
申请日：2011-06-21
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： KATO HANAKO , MORI HIROSHI , KURIYAMA TOSHIHIKO , TAKASU MAYUKO , HARAGUCHI YUKIYA
IPC分类号： H01L33/48
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide: a semiconductor light-emitting device package that prevents an occurrence of breakage, such as cracks, and has high strength and high heat dissipation; and a semiconductor light-emitting device using the semiconductor light-emitting device package.SOLUTION: A resin molded body 2 has on a first surface thereof a concave part 8 for mounting a semiconductor light-emitting element 5. The resin molded body contains polyorganosiloxane, and a content of bifunctional silicon of the resin molded body is equal to or greater than 5% by weight and equal to or less than 12% by weight. A first lead frame 3a includes: a first exposed lead part 11a exposed to a bottom surface of the concave part; a first outer lead part 12a located outside the resin molded body; a first connection lead part 13a to connect one end of the first exposed lead part and the first outer lead part; and a first extended lead part 14a which extends from the other end of the first exposed lead part toward a second surface opposed to the first surface, and is exposed from the second surface. A second lead frame 3b includes a second exposed lead part 11b, a second outer lead part 12b and a second connection lead part 13b.
摘要翻译：要解决的问题：提供：防止诸如裂纹的破裂发生的半导体发光器件封装，并且具有高强度和高散热性; 以及使用该半导体发光元件封装的半导体发光元件。解决方案：树脂成型体2在其第一表面上具有用于安装半导体发光元件5的凹部8.树脂成型体包含聚有机硅氧烷，树脂成型体的双功能硅含量相等至5重量％以上且等于或小于12重量％。第一引线框架3a包括：暴露于凹部的底面的第一露出引线部11a; 位于树脂成形体外部的第一外引线部12a; 第一连接引线部分13a，用于连接第一裸露引线部分和第一外引线部分的一端; 以及从第一露出引线部分的另一端向与第一表面相对的第二表面延伸并从第二表面露出的第一延伸引线部分14a。第二引线框架3b包括第二裸露引线部分11b，第二外部引线部分12b和第二连接引线部分13b。版权所有（C）2013，JPO＆INPIT

78. 发明专利

JP2013001776A Resin molding material for semiconductor light-emitting device, and molding thereof 有权
标题翻译：用于半导体发光器件的树脂模塑材料及其模制品
公开(公告)号：JP2013001776A
公开(公告)日：2013-01-07
申请号：JP2011133178
申请日：2011-06-15
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： TAKASU MAYUKO , TAKIZAWA KENICHI , MORI HIROSHI
IPC分类号： C08L83/04 , B29C45/14 , B29L11/00 , C08K3/22 , H01L33/48
CPC分类号： H01L2224/48091 , H01L2224/49107 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a resin molding material bringing a resin molding for a semiconductor light-emitting device high in durability (light fastness, heat resistance), and capable of enhancing an LED output by an excellent reflectance, and a resin molding material for the semiconductor light-emitting device easy in molding, or the like.SOLUTION: The resin molding material for the semiconductor light-emitting device contains (A) a polyorganosiloxane. (B) a white pigment, and (C) a curing catalyst, where (B) the white pigment is (a) a white pigment containing alumina as a principal component, (b) the alumina contains (B1) a component having an average secondary particle size of 0.2 μm or more to 1.5 μm or less, and (B2) a component having an average secondary particle size of 2 μm or more to 30 μm or less, and (c) a mass ratio [(B1)/(B2)] of the content of the (B1) component to the content of the (B2) component is within a range of 1/5 to 3/1, in the resin molding material. There are disclosed a method for producing the resin molding for the semiconductor light-emitting device of liquid-injection-molding the material, the resin molding for the semiconductor light-emitting device molded with the material, and the semiconductor light-emitting device provided with the resin molding.
摘要翻译：要解决的问题：提供一种树脂成型材料，其具有高耐久性（耐光性，耐热性）的半导体发光元件的树脂成型体，能够通过良好的反射率提高LED的输出，用于模制成型的半导体发光元件的树脂成型材料等。解决方案：用于半导体发光器件的树脂模制材料包含（A）聚有机硅氧烷。（B）白色颜料和（C）固化催化剂，其中（B）白色颜料是（a）含有氧化铝作为主要成分的白色颜料，（b）氧化铝含有（B1）二次粒径为0.2μm以上至1.5μm以下，（B2）平均二次粒径为2μm以上且30μm以下的成分，（c）质量比[（B1）/（ B2）成分的含量相对于（B2）成分的含量在树脂成型材料中在1/5〜3/1的范围内。公开了一种用于液体注射成型材料的半导体发光器件的树脂模制品，用该材料模制的半导体发光器件的树脂模制品和设置有该材料的半导体发光器件的方法树脂成型。版权所有（C）2013，JPO＆INPIT

79. 发明专利

JP2012256651A Resin package for semiconductor light-emitting device and manufacturing method therefor and semiconductor light-emitting device having resin package 审中-公开
标题翻译：用于半导体发光器件的树脂封装及其具有树脂封装的半导体发光器件的制造方法
公开(公告)号：JP2012256651A
公开(公告)日：2012-12-27
申请号：JP2011127638
申请日：2011-06-07
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： TAKASU MAYUKO , KATO HANAKO , MORI HIROSHI
IPC分类号： H01L33/60 , B29C45/14 , B29K83/00 , B29K105/16 , B29L31/34 , H01L23/12
CPC分类号： H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a package for semiconductor light-emitting device having excellent heat resistance and light resistance, and exhibiting a high reflectance with thin thickness over a wide wavelength range, and excellent moldability, heat dissipation and mass productivity.SOLUTION: In the package for semiconductor light-emitting device having a circuit board on which a semiconductor light-emitting element is mounted, and a wall formed on the circuit board in order to reflect the light from the light-emitting element, the wall is formed tightly to the circuit board by injection molding a liquid thermosetting silicon resin composition, and the resin molding composing the wall has an optical reflectance of 80% or higher when measured for a molding specimen of 0.4 mm thick under a condition of 460 nm wavelength.
摘要翻译：要解决的问题：提供一种具有优异的耐热性和耐光性的半导体发光器件的封装，并且在宽波长范围内具有薄的厚度的高反射率，以及优异的成型性，散热性和批量生产率。解决方案：在具有安装有半导体发光元件的电路板的半导体发光器件的封装中，以及形成在电路板上以便反射来自发光元件的光的壁，通过注射成型液态热固性硅树脂组合物而将壁紧密地形成在电路板上，构成壁的树脂成形体在460mm的条件下测量厚度为0.4mm的成型试样时的光反射率为80％以上 nm波长。版权所有（C）2013，JPO＆INPIT

80. 发明专利

JP2012064928A Resin molding material for semiconductor light-emitting device and resin molding 审中-公开
标题翻译：用于半导体发光器件和树脂模塑的树脂模塑材料
公开(公告)号：JP2012064928A
公开(公告)日：2012-03-29
申请号：JP2011175526
申请日：2011-08-11
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： HARAGUCHI YUKIYA , MORI HIROSHI
IPC分类号： H01L33/60 , B29C45/00 , C09J11/04 , C09J183/04 , H05K1/05
CPC分类号： H01L2224/48091 , H01L2224/49107 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a resin molding material for an optical semiconductor light-emitting device having high heat conductivity and high optical reflectance of wavelength in a near ultraviolet region, and provide a resin molding for the optical semiconductor light-emitting device having high moldability in the molding.SOLUTION: In a resin molding material for a semiconductor light-emitting device, (A) polyorganosiloxane, (B) inorganic filler, and (C) curing catalyst are included, and boron nitride or aluminium nitride having the primary particle diameter of not less than 0.1 μm but not more than 7.0 μm is included as the (B) inorganic filler.
摘要翻译：要解决的问题：提供一种用于在近紫外区域中具有高导热性和高光波长的反射率的光半导体发光器件的树脂模制材料，并且提供用于光学半导体发光的树脂模制品在模制中具有高模塑性的装置。解决方案：在用于半导体发光器件的树脂模制材料中，包括（A）聚有机硅氧烷，（B）无机填料和（C）固化催化剂，并且包含一次粒径为作为（B）无机填料，不包括0.1μm以上且7.0μm以下。版权所有（C）2012，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式