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71. 发明专利

JPH09289267A WRITING BOARD 失效
公开(公告)号：JPH09289267A
公开(公告)日：1997-11-04
申请号：JP10111596
申请日：1996-04-23
申请人： KYOCERA CORP
发明人： NANJIYOU HIDEHIRO , KIMURA TETSUYA
IPC分类号： H05K1/09 , C04B41/51 , C04B41/88 , H01L23/15 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To bake an alumina ceramic insulation board and metallized wiring layer simultaneously at low temp. for a short period of time, by making this layer of a material contg. specified high-m.p. metal(s) as a main component and a metallized compsn. containing specified compds. at specified wt.% which form liq. phase in a specified temp. range. SOLUTION: The wiring board has a metallized wiring layer contg. at least one of high-m.p. metals W and Mo as a main component on an alumina ceramic insulation board. The metallized wiring layer contains a metallized compd. contg. alumina 0.5-10.0wt.%, niobium oxide 0.1-3.0wt.% and compd. 0.01-10.0wt.%. This compd. is composed of two or more of alumina, silica, magnesia and calcia each forming a liq. phase with alumina at 1200-1600 deg.C. Thus, the alumina and compd. in the metallized compsn. form a liq. phase at once and more accelerate the sintering whereby the baking is possible at low temp. for a short period of time.

72. 发明专利

JPH09263472A WIRING BOARD 失效
公开(公告)号：JPH09263472A
公开(公告)日：1997-10-07
申请号：JP7290096
申请日：1996-03-27
申请人： KYOCERA CORP
发明人： KIMURA TETSUYA , NANJIYOU HIDEHIRO
IPC分类号： H05K1/09 , C04B41/88 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a wiring board which enables the concurrent firing of both an insulating substrate consisting of an alumina based ceramic material and a metallized wiring layer without requiring any firing tool or plural firing stages and also can be manufactured at a low cost and causes no deformation such as warpage or waviness and further, on which semiconductor devices can compactly be mounted and also various electronic parts can densely be mounted at the time of using the wiring board as a semiconductor device receiving package, multilayer wiring board, or the like. SOLUTION: This wiring board is composed of an insulting substrate consisting of an alumina based ceramic material that contains SiO2 and a metallized wiring layer formed from a metallizing composition. At this time, the metallizing composition consists essentially of at least one high melting point metal selected from W and Mo and also contains a 0.05 to 10.0wt.% of a CaO- Al2 O3 -SiO2 based compound which forms a liquid phase together with SiO2 in the alumina based ceramics of the insulating substrate at a temp. in the range of 1,200 to 1,600 deg.C.

73. 发明专利

JPH09148175A CERAMIC CAPACITOR 失效
公开(公告)号：JPH09148175A
公开(公告)日：1997-06-06
申请号：JP31100995
申请日：1995-11-29
申请人： KYOCERA CORP
发明人： KIMURA TETSUYA , KOSAKA SHOJI , TAKENOSHITA TAKESHI
IPC分类号： C04B35/46 , H01B3/12 , H01G4/12
摘要： PROBLEM TO BE SOLVED: To enhance a ceramic capacitor in mechanical strength without influencing it in electrical properties as a dielectric ceramic. SOLUTION: This ceramic capacitor is formed through such a manner that dielectric layers 2 mainly formed of barium titanate (BaTiO3 ) and inner electrode layers 3 are alternately laminated for the formation of a laminated ceramic capacitor 4, outer layers 7 and 8 formed of material composed of compound mainly consisting of barium titanate (BaTiO3 ) and 40 to 90% by weight of stabilized zirconia are provided to the upside 5 and underside 6 of the ceramic capacitor 4 respectively, and a terminal electrode 9 is provided to each edge face of the ceramic capacitor 4.

74. 发明专利

JPH07296838A MANUFACTURE OF FUEL CELL 失效
公开(公告)号：JPH07296838A
公开(公告)日：1995-11-10
申请号：JP9239094
申请日：1994-04-28
申请人： KYOCERA CORP
发明人： TOMISAKO MASAHIRO , AKIYAMA MASAHIDE , NANJIYOU HIDEHIRO , KIMURA TETSUYA
IPC分类号： H01M8/02 , H01M8/12 , H01M8/10
摘要： PURPOSE:To reduce the number of manufacturing processes of a fuel cell for enhanced productivity and to enhance the reliability of the fuel cell by interposing an intermediate layer between two layers which have different coefficients of contractions when baked simultaneously. CONSTITUTION:A cylindrical fuel cell comprises a stack consisting of a porous air electrode layer 2, a solid electrolyte layer 3, a porous fuel layer 4, and a collector layer 5 stacked on the surface of a cylindrical base 1 made of porous ceramic. A process for baking at least two adjacent layers in the stack simultaneously is carried out. In this case, it is most desirable that at least either one of the electrolyte layer 3 and the collector 5, both of which are solid, and at least either one of the cylindrical base 1, the air electrode layer 2, and the fuel electrode layer 4, be selected and combined for simultaneous baking. In this case, an intermediate layer is interposed between the two layers. It is important that the intermediate layer be made from a material whose coefficient of contraction has a value halfway between those of the air electrode and the solid electrolyte during baking.

75. 发明专利

JPH07138082A POROUS CERAMIC SINTERED COMPACT 失效
公开(公告)号：JPH07138082A
公开(公告)日：1995-05-30
申请号：JP28325693
申请日：1993-11-12
申请人： KYOCERA CORP
发明人： KIMURA TETSUYA , AKIYAMA MASAHIDE , OGAWA YUJI
IPC分类号： C04B38/00 , C01G45/00 , C04B38/06 , H01M4/86 , H01M4/90
摘要： PURPOSE:To obtain a ceramic sintered compact, excellent in strengths while having gas permeability and suitable as an air electrode of a fuel cell having a small shrinkage at high temperatures. CONSTITUTION:This porous ceramic sintered compact comprises a three- dimensional network structure containing a crystal in which a part of La in a perovskite type crystal expressed by LaMnO3 is substituted with at least one selected from rare earth and alkaline earth elements as a skeleton 5. In the ceramic sintered compact, the average grain diameter of grains 6 constituting the skeleton 5 is 1-20mum and pores having =70% of the whole pore volume.

76. 发明专利

JPH061670A JOINED BODY OF CERAMIC MEMBER AND METAL MEMBER 失效
公开(公告)号：JPH061670A
公开(公告)日：1994-01-11
申请号：JP15962892
申请日：1992-06-18
申请人： KYOCERA CORP
发明人： KIMURA TETSUYA
IPC分类号： C04B37/02
摘要： PURPOSE:To obtain a joined body having high bonding strength and excellent durability and capable of continuous use under a cooling-heating cycle for a long time by interposing a buffer layer having a specified multilayered structure between a ceramic member made of a silicon nitride-based sintered compact and a metal member. CONSTITUTION:When a buffer layer is interposed between a ceramic member made of a silicon nitride-based sintered compact and a metal member and they are brazed to obtain a joined body, the buffer layer used is formed by successively laminating a layer of a silicon nitride-based sintered compact contg. 5-20wt.% nitride of an active metal, a low Young's modulus metal layer of a transition metal or an alloy thereof, a low Young's modulus metal layer of a transition metal or an alloy thereof and a layer of a silicon nitride-based sintered compact contg. 25-70wt.% nitride of an active metal from the ceramic member side.

77. 发明专利

JPH05234665A 失效
公开(公告)号：JPH05234665A
公开(公告)日：1993-09-10
申请号：JP3182492
申请日：1992-02-19
申请人： KYOCERA CORP
发明人： KIMURA TETSUYA , OKUDA NORIO
IPC分类号： F23Q7/00 , H05B3/14
摘要： PURPOSE:To enhance durability and reliability in service at high temperatures for a long time by embedding an exothermic resistor which is made of non-organic conductive material, in a silicone nitriding sintered body where the molar ratio of silicone deoxide content to the content of rear earth elements converted to an oxide base lies in a specified range. CONSTITUTION:A ceramic exothermic body 1 is so constituted that an exothermic resistor 2 is embedded in a silicone nitriding sintered body 3 where the molar ratio of silicone dexide (SiO2) content to the content of rear earth elements converted to an oxide base is 1.0 to 2.5. The resistor 2 is composed of non-organic conductive material, such as W, Mo and the like, the negative electrode of the resistor 2 is formed into a fitting 6, and the positive electrode of the resistor is also formed into a terminal bar 13, and they are insulated to form a glow plug. In addition, the exothermic body 1 is so constituted that the resistor 2 is rested on a silicone nitriding compact in a semi-circular shape in cross section, and a separate silicone nitriding compact is piled up over the aforesaid compact thereafter, so that they are pressed so as to be sintered while being integrated. This configuration thereby allows deposition resistant strength in service at high temperatures for a long time to be maintained, and thereby allows durability and reliability to be increased without the occurrence of cracks and the deterioration of textures.

78. 发明专利

JP2009206135A Multilayer wiring board, and manufacturing method thereof 审中-公开
标题翻译：多层接线板及其制造方法
公开(公告)号：JP2009206135A
公开(公告)日：2009-09-10
申请号：JP2008044226
申请日：2008-02-26
申请人： Kyocera Corp , 京セラ株式会社
发明人： KIMURA TETSUYA , TOMISAKO MASAHIRO
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer wiring board which is free from breaking, and has nearly rectangularly sectioned wiring of ≤30 μm in line width with a high aspect ratio (a value obtained by dividing a thickness by a line width) in a ceramic insulating layer, and to provide a manufacturing method thereof.
SOLUTION: The multilayer wiring board includes an insulating base formed by layering a plurality of ceramic insulating layers and the nearly rectangularly sectioned wiring made of conductor paste in the ceramic insulating layer, wherein the line width of the wiring is ≤30 μm in plan view and the value obtained by dividing the thickness by the width of the wiring is 0.7 to 2.0.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种不破裂的多层布线板，并且具有纵横比（高厚度除以线宽度获得的值），线宽为30μm的近似矩形截面布线）在陶瓷绝缘层中，并提供其制造方法。解决方案：多层布线板包括通过在陶瓷绝缘层中层叠多个陶瓷绝缘层和由导体膏形成的近似矩形截面的布线而形成的绝缘基底，其中布线的线宽≤30μm 平面图和通过将厚度除以布线的宽度获得的值为0.7至2.0。版权所有（C）2009，JPO＆INPIT

79. 发明专利

JP2005136007A Composite sheet and manufacturing method for laminated part 审中-公开
标题翻译：复合板及其制造方法
公开(公告)号：JP2005136007A
公开(公告)日：2005-05-26
申请号：JP2003368006
申请日：2003-10-28
申请人： Kyocera Corp , 京セラ株式会社
发明人： KIMURA TETSUYA , FUKAMIZU NORIMITSU , TATENO SHUICHI , YAMAMOTO KOJI
IPC分类号： B28B1/30 , H05K3/20 , H05K3/22 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a composite sheet simultaneously satisfying thinning of an insulating layer and the thickening of a wiring layer, while easily forming a fine wiring, and to provide a manufacturing method for a laminated part. SOLUTION: A photoresist layer 13 is formed on the surface of a carrier film 10 through which a light can be transmitted, and recessed-shaped patterns 13b are formed to the photoresist layer 13 by exposure and development. The patterns 13b are filled with light-nontransparent conductor paste, and the photoresist layers 13a are removed. The upper section of the carrier film 10 with a wiring layer 3a formed thereto is coated with a light-curable insulator paste, containing a ceramic material at a thickness larger than the thickness of the wiring layer 3. Only a light-curable ceramic-layer forming section is cured by irradiating the rear of the film 10 with light, and the light uncured section of the light-curable ceramic layer is dissolved and removed, thus manufacturing the composite sheet composed of the light-curable ceramic-layer wiring layer 3a. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种同时满足绝缘层的薄化和布线层的增厚的复合片材，同时容易形成精细的布线，并提供层压部件的制造方法。解决方案：光致抗蚀剂层13形成在载体膜10的表面上，通过该表面可以透射光，并且通过曝光和显影将光刻胶层13形成凹形图案13b。图案13b填充有不透明的导体膏，并且除去光致抗蚀剂层13a。具有形成有布线层3a的载体膜10的上部涂覆有含有厚度大于布线层3的厚度的陶瓷材料的光固化绝缘体糊料。仅光固化陶瓷层通过用光照射膜10的后部来固化成型部，并且将光固化陶瓷层的光未固化部分溶解除去，由此制造由可光固化陶瓷层布线层3a构成的复合片。版权所有（C）2005，JPO＆NCIPI

80. 发明专利

JP2005093822A Wiring board made of ceramics, and manufacturing method therefor 审中-公开
标题翻译：陶瓷接线板及其制造方法
公开(公告)号：JP2005093822A
公开(公告)日：2005-04-07
申请号：JP2003326707
申请日：2003-09-18
申请人： Kyocera Corp , 京セラ株式会社
发明人： SHIGEOKA TOSHIAKI , KIMURA TETSUYA
IPC分类号： H05K3/38 , H05K3/20
摘要： PROBLEM TO BE SOLVED: To provide a ceramic-made insulating substrate and a ceramic-made wiring board which has high reliability of junction to a conductor layer formed on its surface.
SOLUTION: The ceramic-made wiring board comprising the ceramic-made insulating substrate and the wiring conductor layer which is joined with at least one surface of the insulating substrate is characterized in that the mathematical mean roughness of the interface of the conductor layer which is joined with the insulating substrate is ≤1.0 μm.
COPYRIGHT: (C)2005,JPO&NCIPI

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