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71. 发明专利

JPS56100491A THIN FILM FORMING PRINTING BLOCK 失效
公开(公告)号：JPS56100491A
公开(公告)日：1981-08-12
申请号：JP257280
申请日：1980-01-16
申请人： HITACHI LTD
发明人： MATSUYAMA HARUHIKO , NAKATANI MITSUO
IPC分类号： H05K3/12

72. 发明专利

JPS55126941A FORMATION PROCESS OF LIGHT ABSORPTION LAYER OF COLOR PICTURE TUBE 失效
公开(公告)号：JPS55126941A
公开(公告)日：1980-10-01
申请号：JP3435779
申请日：1979-03-26
申请人： HITACHI LTD
发明人： NAKATANI MITSUO , MATSUYAMA HARUHIKO , NAKAMURA KENJI
IPC分类号： H01J9/227
摘要： PURPOSE:To high precisely form a sensitive resin layer on the phosphor film formation area by coating the sensitive resin and exposing and developing it using shadow or photo masks. CONSTITUTION:After negative type sensitive resin is revolvingly coated on the inside of the face plate 1 and is dried, it is exposed through shadow masks using an exposure bench. Subsequently, it is developed and the resin layer 6 is formed on the phosphor film formation area. After that, the resin layer 6 is changed into the screening film 7 and the dam and light absorption material 9 is revolvingly coated and dried. Subsequently, it is cured and the uncured dam and light absorption material 8 which is located on the screening film 7 is removed. Tri-color phosphor paste is subsequently printed and dried between the dam and light absorption layers 9 which is formed like this and it is filming processed, metal back processed, and burn-out processed.

73. 发明专利

JPS5566974A ETCHING RESIST INK COMPOSITION 失效
公开(公告)号：JPS5566974A
公开(公告)日：1980-05-20
申请号：JP13991178
申请日：1978-11-15
申请人： HITACHI LTD
发明人： NAKATANI MITSUO , MATSUYAMA HARUHIKO , KUROKI TAKASHI
IPC分类号： C09D11/00 , C09D11/10 , C23F1/00
摘要： PURPOSE:To prepare an ink composition having excellent resistance to an etching liquid, and capable of being released and washed away after etching treatment, by mixing a mixture of a rosin-modified resin and rosin, with dibenzylidene-D-sorbitol and a solvent. CONSTITUTION:A composition composed of (A) 100 parts by weight of a resin mixture containing (a) 50-95wt% of a rosin-modified phenolic resin and/or a rosin-modified maleic acid resin and (b) 5-50wt% of rosin, (B) 1-30 parts of dibenzylidene-D-sorbitol and/or dibenzylidene-D-sorbitol derivative, and (C) 15-45 parts of a solvent. When the amount of the rosin exceeds 50wt%, the resulting etching resist ink has only poor resistance to the etching liquid, and the releasing time by an alkaline solution becomes very long, and when it is less than 5wt%, the resistance to the etching liquid rapidly decreases.

74. 发明专利

JPS54110781A FORMING METHOD FOR COLOR FLUORESCENT FILM WITH BLACK MATRIX 失效
公开(公告)号：JPS54110781A
公开(公告)日：1979-08-30
申请号：JP1767478
申请日：1978-02-20
申请人： HITACHI LTD
发明人： TAKAHASHI HIDEO , MATSUYAMA HARUHIKO , KUROKI TAKASHI , HONDA YOSHINORI
IPC分类号： H01J9/227
摘要： PURPOSE:To form the 3-color fluorescent film by the dam-print system by using the dam-shaped glass funnel with the fluorescent substance pattern formation area processed into the groove. CONSTITUTION:Resist pattern 2' is formed on glass panel 1; dam shape 3' of about 20mum deep is etched via the solution containing HF as the main component; and the resit is removed after washing by the water. The convexpart of the dam features about 60mum width, about 80mun bottom width and 74mm length, and 720 pieces of such dams are arranged in the x direction with 140mum pitch. And the area of the pattern measures 100X 74mm. Then the paste mixed with the graphite powder is coated only to the convex part of the dam to form black matrix pattern 4. Then the RGB color fluorescent substance paste of about 1000 poise is filled by printing and with positioning to each dam 3'. Owing to the controlling effect of the dam, the printing is given at the fixed area with no color mixture caused even if the positioning may be shifted by about 30mum. After this, the filming, the Al deposition and the burning are carried out in sequence. With this method, a high-accuracy is ensured for each color with no mixture to each other, the pattern accuracy is within 10mum, and both the luminance and the picture quality are excellent.

75. 发明专利

JPS5483365A TRICOLOR PATTERN FLUORESCENT FILM MAKING PROCESS AND ITS PRINTING INK 失效
公开(公告)号：JPS5483365A
公开(公告)日：1979-07-03
申请号：JP15049277
申请日：1977-12-16
申请人： HITACHI LTD
发明人： TAKAHASHI HIDEO , NATE KAZUO , MATSUYAMA HARUHIKO , HONDA YOSHINORI
IPC分类号： H01J9/227
摘要： PURPOSE:To obtain fluorescent ink suitable for forming a tricolor fluorescent film for color CRT by the screen printing process, with hardening by repeating pattern printing and ultraviolet ray irradiation three times consecutively from the first color. CONSTITUTION:In making the flourescent film consisting of a tricolor pattern (R, G, and B) by the screen printing process, the vehicle used is a photopolymerized organic medium consisting of a substance, which is made by uniformly dissolving unpolymeric polymer powder into a photopolymeric and unpolymeric additionally polymerized monomer, and a photosensitizer. With the use of ultraviolet ray hardened type fluorescent ink, which is a blended and kneaded mixture of the above-mentioned vehicle and an adequate quantity of a fluorescent substance, hardening by pattern printing and ultraviolet ray irradiation is repeated three times consecutively starting from the first color.

76. 发明专利

JP2004247744A Wiring structure and its manufacturing method 审中-公开
公开(公告)号：JP2004247744A
公开(公告)日：2004-09-02
申请号：JP2004073014
申请日：2004-03-15
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TOGAWA HIDEO , OTANI YOSHIHARU , SHOJI FUSAJI , KATAOKA FUMIO , MATSUYAMA HARUHIKO , MATSUZAKI EIJI , SHIGI HIDETAKA , MATSUSHIMA NAOKI , YAMAZAKI TETSUYA , AKAMATSU SHIRO , IKEDA SEIJI
IPC分类号： C08G73/10 , H01B3/30 , H01L23/14 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a high-reliability wiring structure that excels in the mechanical property of a polyimide insulating layer and the property of interface adhesiveness by controlling the melting-out of copper from copper wiring to the insulating layer and by avoiding the crack of the insulating layer, and its low-cost manufacturing method. SOLUTION: For the purpose of obtaining polyimide insulating film by directly applying polyimide precursor formulation to the surface of copper wiring and heat curing, polyamide acid with low acidity of carboxyl group or polyimide precursor formulation comprising basic compound is used as precursor of polyimide. Furthermore, for the purpose of preventing polyamide acid with high acidity from directly contacting copper, the exposed part of copper wiring 14 and 14a is covered with a copper diffusion inhibition layer 16 made from polyimide that is obtained by heat curing of polyamide acid with low acidity. COPYRIGHT: (C)2004,JPO&NCIPI

77. 发明专利

JP2003027033A Heat-resistant adhesive 审中-公开
标题翻译：耐热粘合剂
公开(公告)号：JP2003027033A
公开(公告)日：2003-01-29
申请号：JP2001212601
申请日：2001-07-12
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： MATSUYAMA HARUHIKO , AKABOSHI HARUO , SUZUKI MASAHIRO , KAGEYAMA AKIRA
IPC分类号： C09J179/08 , C09J11/04 , C09J179/04
摘要： PROBLEM TO BE SOLVED: To obtain a heat-resistant adhesive which gives a high bond strength at a low bonding pressure and hence is suitable for die bonding.
SOLUTION: This heat-resistant adhesive comprises a bismaleimide compound, a polyquinoline compound and fine metallic particles of any of Al, Ag, Au, Cu and Ni, which are surface-treated with stearic acid, zinc stearate or aluminum stearate. The adhesive gives a high bond strength at a low bonding pressure and hence is suitable for die bonding.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：获得在低粘合压力下具有高粘合强度的耐热粘合剂，因此适合于芯片粘合。解决方案：该耐热粘合剂包括用硬脂酸，硬脂酸锌或硬脂酸铝进行表面处理的双马来酰亚胺化合物，聚喹啉化合物和Al，Ag，Au，Cu和Ni中任一种的金属微粒。粘合剂在低粘合压力下产生高粘合强度，因此适合于芯片粘接。

78. 发明专利

JP2002185148A MULTILAYER WIRING BOARD, INTERLAYER SHORT CIRCUIT PREVENTING METHOD THEREOF MULTILAYER WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS USING THE SAME 失效
公开(公告)号：JP2002185148A
公开(公告)日：2002-06-28
申请号：JP2000376082
申请日：2000-12-11
申请人： HITACHI LTD
发明人： NARIZUKA YASUNORI , YABUSHITA AKIRA , MATSUYAMA HARUHIKO , KATSUKI MARIA , TSURUKO MASANOBU
IPC分类号： C25D13/02 , C25D13/06 , C25D13/12 , H05K3/22 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To enable defects that may lead to interlayer short circuits to be repaired at a low cost without checking defects themselves in an insulating layer or a dielectric layer. SOLUTION: A lower conductive pattern is made to serve as one of electrodes, and insulating material is attached to defective parts through an electrodeposition method.

79. 发明专利

JPH11340637A MULTILAYER WIRING BOARD AND ITS MANUFACTURE 失效
公开(公告)号：JPH11340637A
公开(公告)日：1999-12-10
申请号：JP6435299
申请日：1999-03-11
申请人： HITACHI LTD
发明人： SUZUKI MASAHIRO , AKABOSHI HARUO , TAKAHASHI AKIO , TANAKA MINORU , MATSUYAMA HARUHIKO
IPC分类号： H05K1/03 , C09J7/00 , C09J165/00 , C09J187/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To realize high density wiring and high reliability by constituting a multilayer wiring board by laminating resin layers having conductor wiring and insulating resin layers, and containing bismaleimide compound and polyquinoline compound in the insulating resin layers. SOLUTION: A plurality of wiring films 6 and a plurality of wiring film 7 are alternately laminated on a glass ceramics board 2. For the wiring film 6, a copper wiring is formed on both surfaces of a polyimide film 9, and a resin layer provided with wiring is constitute by heat treatment. By using a parallel plane press 20, the wiring films 6, adhering films 7 and the glass ceramics board 2 are heated and pressed. Insulating resin layers 10 are constituted by containing bismaleimide compound and polyquinoline compound in the adhering films 7. As a result, characteristics of a multilayer wiring board can be maintained, even if heating is performed a plurality of times, and making high density wiring and high reliability can be realized.

80. 发明专利

JPH0799265A MULTILAYERED INTERCONNECTION SUBSTRATE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0799265A
公开(公告)日：1995-04-11
申请号：JP30551593
申请日：1993-12-06
申请人： HITACHI LTD
发明人： NARIZUKA YASUNORI , MATSUSHIMA NAOKI , SHIGI HIDETAKA , MATSUYAMA HARUHIKO
IPC分类号： H05K3/46 , H01L23/02 , H01L23/12 , H01L23/498
摘要： PURPOSE:To prevent defective fixing caused by the residue of organic material and to reduce the area required for bonding a cap by constituting a cut-off structure by continuance with a frame pattern, and bonding the cap to the uppermost layer of the cut-off structure. CONSTITUTION:Wiring layers having insulating layers 11 comprising resin such as polyimide, wirings 10 formed of metal and frame patterns 9 surrounding the wirings are alternately laminated on a ceramic substrate 10 containing conductors 6. A semiconductor chip 7 is connected to the wiring layer of the uppermost part through brazing filler metal 4. The wiring layers are connected with through holes between the upper and lower layers. A cap 5 for sealing the multilayered interconnection layer and the semiconductor chip 7 is attached to the upper part of the frame pattern 9 through the brazing filler metal 4. Thus, the area of the region required for forming the cut-off wall is reduced, and the mounting density can be improved.

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