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    • 61. 发明专利
    • Heat-resistant, electrically conductive paste composition
    • 耐热电导电材料组合物
    • JPS59179650A
    • 1984-10-12
    • JP5734483
    • 1983-03-31
    • Nitto Electric Ind Co Ltd
    • IGARASHI KAZUMASAINOUE NAOKI
    • C08L79/08C08K3/04C08K5/54C08K5/548H01B1/24
    • PURPOSE: To improve adhesion-retaining characteristics under high temperature and humidity conditions, by blending a silane coupling agent with an electrically conductive graphite paste contg. a polyimide resin and graphite powder in a specified weight ratio.
      CONSTITUTION: 40W95wt% (based on the combined quantity of graphite powder and resin) graphite powder which can pass through a 100mesh sieve is kneaded with a polyimide resin (e.g. polyimide or polyamide-imide resin) or an org. solvent soln. of said resin. 0.1W50pts.wt. (per 100pts.wt., on a solid basis, graphite paste) silane coupling agent is added to the resulting graphite paste compsn. The mixture is thoroughly kneaded to obtain the desired heat-resistant, electrically conductive paste compsn. Examples of the silane coupling agents are γ-mercaptopropyltrimethoxysilane and vinyltrichlorosilane.
      COPYRIGHT: (C)1984,JPO&Japio
    • 目的:通过将硅烷偶联剂与导电石墨浆料混合,改善在高温和高湿条件下的粘附保持性能。 聚酰亚胺树脂和特定重量比的石墨粉末。 构成:可以通过100目筛的40-95重量%(基于石墨粉末和树脂的总量)石墨粉末与聚酰亚胺树脂(例如聚酰亚胺或聚酰胺 - 酰亚胺树脂)或组织混合。 溶剂溶胶 的所述树脂。 0.1-50pts.wt。 (每100pts.重量,以固体为基础,石墨浆)硅烷偶联剂加入到所得的石墨糊剂组合物中。 将混合物充分捏合以获得所需的耐热导电糊料组合物。 硅烷偶联剂的实例是γ-巯基丙基三甲氧基硅烷和乙烯基三氯硅烷。
    • 62. 发明专利
    • Method for formation of protective film on semiconductor element
    • 在半导体元件上形成保护膜的方法
    • JPS59107523A
    • 1984-06-21
    • JP22929283
    • 1983-12-05
    • Nitto Electric Ind Co Ltd
    • IGARASHI KAZUMASAYAMAGUCHI KATSUHIKOIKOU KAZUOMIKI KAZUYUKI
    • H01L23/29C08G73/10C08G77/42C08G77/455H01L21/312H01L23/31
    • H01L21/312
    • PURPOSE:To enable to form a polyimide protective film of excellent close-contacting and dampproof characteristics by a method wherein a specific ratio of diaminosiloxane and non-silicon containing diamine are simultaneously polymerization-reacted with aromatic titracarboxylic acid dianhydride. CONSTITUTION:The diamino compound, consisting of the diaminosiloxane indicated in general formula I and the diamine containing no silicon atom in a molecule, is polymerization-reacted with aromatic tetracarboxylic acid dianhydride. In ths case, a solution of siloxane denatured polyimide precursor, having silicon content of 0.5wt% or below, is obtained by performing a polymerization reaction using the ratio wherein diaminosiloxane will be brought to 1-4mol% the total diamino compound. The intrinsic viscosity of the precursor is reduced by ripening with heat at 40-80 deg.C, and after application of said solution on the surface of a semiconductor element, a polyimide protection film is formed by performing a high temperature heat treatment. As a result, a polyimide protection film of excellent close-contacting and dampproof properties can be formed.
    • 目的:通过其中二氨基硅氧烷和不含硅二胺的比例同时与芳族二羧酸二酐进行聚合反应的方法,形成具有优异接触和防潮特性的聚酰亚胺保护膜。 构成:由通式I表示的二氨基硅氧烷和分子中不含硅原子的二胺组成的二氨基化合物与芳香族四羧酸二酐进行聚合反应。 在这种情况下,通过使用二氨基硅氧烷占总二氨基化合物的1-4摩尔%的比例进行聚合反应,得到硅含量为0.5重量%以下的硅氧烷变性聚酰亚胺前体的溶液。 通过在40-80℃的加热熟化来减少前体的特性粘度,并且在将半导体元件的表面上施加所述溶液之后,通过进行高温热处理形成聚酰亚胺保护膜。 结果,可以形成具有优异的接触和防潮性能的聚酰亚胺保护膜。
    • 63. 发明专利
    • Production of polyimide precursor
    • 生产聚酰亚胺前体
    • JPS5943025A
    • 1984-03-09
    • JP15360882
    • 1982-09-02
    • Nitto Electric Ind Co Ltd
    • IGARASHI KAZUMASATANAKA MUNEKAZUYAMAGUCHI KATSUHIKO
    • C08G73/00C08G73/10
    • PURPOSE: To obtain the titled precursor having good adhesion to ceramics, etc., and improved heat resistance, by polymerizing an organic tetracarboxylic acid component, part of which is occupied by a specified silane-modified polycarboxylic acid, with a diamine.
      CONSTITUTION: In producing a polyimide precursor by polymerizing an organic tetracarboxylic acid component with a diamine; part of said carboxylic acid component is replaced with a silane-modified polycarboxylic acid of formula III, prepared by modifying an organic tetracarboxylic acid with both an aminosilane compound of formula I and an organic diisocyate compound (DI) of formula II so as to effect both a reaction between one of the two paired acid groups and the secondary amino group of the aminosilane compound and a reaction between the other acid group and the isocyanato group of the DI, and further reacting the remaining isocyanato groups of the DI taking part in this reaction with the organic tetracarboxylic acid component and this carboxylic acid component together with the remaining organic tetracarboxylic acid component is polymerized with the diamine.
      COPYRIGHT: (C)1984,JPO&Japio
    • 目的:为了获得与陶瓷等具有良好粘附性的标题母体,并且通过将一部分由特定的硅烷改性的多元羧酸占据的有机四羧酸组分与二胺聚合,从而提高耐热性。 构成:通过使有机四羧酸组分与二胺聚合制备聚酰亚胺前体; 通过用式I的氨基硅烷化合物和式II的有机二异氰酸酯化合物(DI)二者改性有机四羧酸制备的硅烷改性的式III的多元羧酸来代替所述羧酸组分的一部分,以同时实现两者 两个配对酸基中的一个和氨基硅烷化合物的仲氨基之间的反应以及另一个酸基与DI的异氰酸酯基之间的反应,并进一步使DI的剩余异氰酸酯基团反应在该反应中 与该有机四羧酸成分一起,该羧酸成分和剩余的有机四羧酸成分与二胺聚合。
    • 65. 发明专利
    • PREPARATION OF POLYIMIDE PRECURSOR
    • JPS56157428A
    • 1981-12-04
    • JP6185880
    • 1980-05-10
    • NITTO ELECTRIC IND CO
    • IGARASHI KAZUMASAYAMAGUCHI KATSUHIKOMIKI KAZUYUKIIKOO KAZUO
    • C08G73/00C08G73/10C09D179/08
    • PURPOSE:To prepare a polyimide precursor having excellent adhesive properties to glass etc., by reacting a diamine with a carboxylic acid component comprising an organic tetracarboxylic acid and a specific polyvalent carboxylic acid modified by a silane. CONSTITUTION:When reacting an organic tetracarboxlylic acid (A), an aminosilane compound (B) of formula I, where R1 is a divalent organic group containing a carbon atom directly bonded to Si; X is a hydrolyzable group such as alkoxy etc.; Y is alkyl, siloxy, etc., and an organic diisocyanate compound (C) of formula II, where R2 is a divalent organic group, a polyvalent carboxylic acid modified by a silane of formula III, where Tc4 is a tetravalent residual group of component A; Tc1 is a monovalent residual group of component A, is obtained by reacting one of two acid groups bonded to two adjacent carbon atoms of component A with an amino group of component B, the other of the two acid groups with an isocyanate group of component C, and further the residual isocyanate group of component C with component A. The titled precursor is obtained by the polymerization reaction of a carboxylic acid component comprising said polyvalent carboxylic acid modified by a silane and an organic tetracarboxylic acid with a diamine.