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61. 发明专利

JPS6247977A CONNECTION OF ELECTRONIC CIRCUIT MEMBER 失效
公开(公告)号：JPS6247977A
公开(公告)日：1987-03-02
申请号：JP18672485
申请日：1985-08-27
申请人： FURUKAWA ELECTRIC CO LTD
发明人： FUKUNAGA TAKAO , FUSE KENICHI , KOBAYASHI KENZO
IPC分类号： H01B5/16 , H01R11/01 , H05K3/32 , H05K3/36

62. 发明专利

JPS61217011A REINFORCED OPTICAL FIBER 失效
公开(公告)号：JPS61217011A
公开(公告)日：1986-09-26
申请号：JP5759385
申请日：1985-03-22
申请人： FURUKAWA ELECTRIC CO LTD
发明人： FUKUNAGA TAKAO , SHIRASAKA ARIO , FUSE KENICHI
IPC分类号： C03C25/10 , G02B6/44
摘要： PURPOSE:To stabilize a transmission characteristic by incorporating inorg. pulverous particles having prescribed characteristics into a reinforced coating layer provided on the outside circumference of an optical fiber strand. CONSTITUTION:The reinforced coating layer 2 on the outside circumference of the optical fiber strand 2 is constituted of plural reinforcing fiber materials 5 and a thermosetting resin 6 impregnated therein and cured. Two kinds of the inorg. pulverous particles 7, 8 of which the respective average grain sizes are

63. 发明专利

JP2002303380A UNDERGROUND BURIED CONDUIT 审中-公开
公开(公告)号：JP2002303380A
公开(公告)日：2002-10-18
申请号：JP2002002172
申请日：2002-01-09
申请人： FURUKAWA ELECTRIC CO LTD
发明人： FUKUNAGA TAKAO , SADAMITSU KAZUO , KISHI NORIO , ONO KISABURO , UENO TAKAHIRO
IPC分类号： E02D27/46 , F16L1/024 , F16L3/10 , F16L3/22 , F16L3/223 , H02G1/06 , H02G9/06
摘要： PROBLEM TO BE SOLVED: To provide an underground buried conduit, in which work for burying a conduit under the ground is easily performed, the conduit is not susceptible to damage, and the service of electrical wire is not susceptible to trouble. SOLUTION: A groove 21 is formed in an upper face of a lower side block 11. End faces of a lot of the lower side blocks 11 are brought into abutment with each other so that the grooves are continuously disposed to form a line of the grooves. The long conduit 15 stretches over a lot of lower side blocks 11, and the lower semicircular portion of the conduit is laid in the line of the grooves 21. On the lower side blocks 11, a lot of upper side blocks 13, of which lower faces have grooves 25, are brought into abutment with each other so that the grooves 25 cover an upper semicircle portion of the conduit 15. Even if the blocks 11, 13 are different in level from each other or are dislocated, an inner face of the conduit 15 is kept smooth to prevent trouble of the service of the electric wire.

64. 发明专利

JP2002233017A UNDERGROUND PIPE LINE 审中-公开
公开(公告)号：JP2002233017A
公开(公告)日：2002-08-16
申请号：JP2002002185
申请日：2002-01-09
申请人： FURUKAWA ELECTRIC CO LTD
发明人： FUKUNAGA TAKAO , SADAMITSU KAZUO , KISHI NORIO , ONO KISABURO , UENO TAKAHIRO
IPC分类号： F16L1/024 , H02G1/06
摘要： PROBLEM TO BE SOLVED: To provide an underground pipe line which the work to bury pipe underground can be easily made and generation of damage on the pipe is scarce. SOLUTION: Many underside blocks 11 each having ditches 21 on the upper surface and holes 23 on the both sides are disposed butting each end surface to the others so as to make the ditches continuous. Long pipes 15 which stretch over the many underside blocks 11 are laid so that the under semicircle part of each pipe is accommodated in the ditches 21. On them, many upper side blocks 13 each having ditches 25 on the under surface and holes 27 on the both sides are disposed butting each end surface to the others so as to make the ditches 25 cover the upper semicircle part of the pipes 15 and connect the bolt holes 23 and 27. Collapse of the laminated blocks 11, 13 is prevented by threading a bolt into each hole 23, 27.

65. 发明专利

JPH09322373A STRUCTURE FOR ATTACHING MULTI-PIPE DUCT LINE TO DUCT LINE RELAY CONTAINER 失效
公开(公告)号：JPH09322373A
公开(公告)日：1997-12-12
申请号：JP13559996
申请日：1996-05-29
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KAJIKAWA TOSHIICHI , NISHIYAMA HIDEMI , FUKUNAGA TAKAO , UENO TAKAHIRO
IPC分类号： H02G9/10
摘要： PROBLEM TO BE SOLVED: To attach simply a multi-pipe duct line to the wall of a duct line relay container and eliminate any lowered strength of its wall, by inserting the end portions of the respective pipes of the multi-pipe line into an opening of its wall for them to reach predetermined positions in the opening, and by connecting them with pipe-end connecting portions. SOLUTION: In a wall 21 of a handhole or manhole, there is formed an opening 43 with the size capable of inserting collectively the end portions of respective pipes 13 of a multi-pipe duct line 11 thereinto. To the inside of the wall 21, a connection board 45 for the multi-pipe duct line 11 is attached to choke the opening 43. Also, to the connection board 45, cylindrical female joints 51 are attached in the opposite positions to the respective pipes 13 of the multi- pipe duct line 11. These female joints 51 constitute the pipe-end connecting portions of the corrugated pipes 13. Thereby, since a plurality of constituent pipes 13 of the multi-pipe duct line 11 can be attached to the wall 21 of a duct line relay container in the only one opening 43, their attaching works are made simple and any problem of the lowered strength of the wall 21 is also eliminated because the attaching works can be managed with the only one opening 43.

66. 发明专利

JPH07155985A SOLDER COMPOSITION 失效
公开(公告)号：JPH07155985A
公开(公告)日：1995-06-20
申请号：JP34002593
申请日：1993-12-06
申请人： HARIMA CHEMICALS INC , FURUKAWA ELECTRIC CO LTD
发明人： KATAYAMA NORIKO , KUMAMOTO SATOSHI , FUJIWARA TAKAHIRO , SHIROISHI HIROKAZU , FUKUNAGA TAKAO , HIKASA KAZUTO
IPC分类号： B23K35/22 , B23K35/34 , B23K35/363 , H05K3/34
摘要： PURPOSE:To form thin and uniform solder films on the pads of a circuit board by adding an org. acid copper salt to solder paste formed by mixing solder powder and flux. CONSTITUTION:The org. acid copper salt is added to the solder paste formed by mixing the solder powder and the flux or a reactive solder compsn. contg. the powder of tin or solder and an org. acid lead salt. The copper in the org. acid copper salt to be added is preferably about 0.02 to 2.0wt.% of the solder compsn. Rosin, naphthenic acid or their derivatives are adequate as the org. acid to constitute the org. acid copper salt. An ion exchange reaction arises between the org. acid copper salt and the solder ally or the powder of the tin or solder and the fine powder of metal copper is precipitated when the solder compsn. is applied on the pads of the circuit board and is heated.

67. 发明专利

JPH06182587A SOLDER PASTE 失效
公开(公告)号：JPH06182587A
公开(公告)日：1994-07-05
申请号：JP35669092
申请日：1992-12-21
申请人： HARIMA CHEMICALS INC , FURUKAWA ELECTRIC CO LTD
发明人： KUMAMOTO SATOSHI , FUJIWARA TAKAHIRO , KATAYAMA NORIKO , FUKUNAGA TAKAO , HIKASA KAZUTO , SHIROISHI HIROKAZU
IPC分类号： B23K35/22 , B23K35/363 , H05K3/34
摘要： PURPOSE:To obtain a solder paste not generating bridge by essentially consisting of a solder powder, the filler specified with the specific weight and grain size, an adhesive and viscosity modifier. CONSTITUTION:By using the flux essentially consisting of by weight, 10-50% solder powder, 5-30% inorganic or organic filler with a specific weight of

68. 发明专利

JPH0637439A FORMATION OF SOLDER LAYER ON PAD OF PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH0637439A
公开(公告)日：1994-02-10
申请号：JP21323892
申请日：1992-07-20
申请人： FURUKAWA ELECTRIC CO LTD , HARIMA CHEMICALS INC
发明人： HIKASA KAZUTO , FUKUNAGA TAKAO , SHIROISHI HIROKAZU , KUMAMOTO SATOSHI , FUJIWARA TAKAHIRO , KONO MASANAO
IPC分类号： H05K3/24 , H05K3/34
摘要： PURPOSE:To obtain a semicylindrical solder layer having uniform thickness on a pad by applying thin coat of a lead-rich solder alloy on the surface of a pad, prior to coating the paste soldered.deposit. CONSTITUTION:After forming a lead-rich solder alloy 3 having the ratio of 3 to 7 of Sn to Pb in the thickness of 3-5um on the surface of a pad 1, a solder layer is formed by coating the paste soldered deposit of primary content of organic acid base and tin powder and by heating. As a result, a semicylindrical solder layer having an almost uniform thickness can be formed in the long direction on the pad 1, and there is no generation of solder bank or solder approach to the sides of the pad. Therefore, the solder layer, which enables to solder parts lead stably on the pad, can be formed, although formation of such solder layer has been considered impossible conventionally. Consequently, mounting of electronic parts on various shape minute pitch pads can be realized.

69. 发明专利

JPH0361314B2 失效
公开(公告)号：JPH0361314B2
公开(公告)日：1991-09-19
申请号：JP19126085
申请日：1985-08-30
申请人： FURUKAWA ELECTRIC CO LTD
发明人： FUKUNAGA TAKAO , FUSE KENICHI
IPC分类号： H01B5/16 , H01B13/00 , H01R11/01 , H01R43/00 , H05K3/18 , H05K3/36

70. 发明专利

JPS6461988A METHOD OF SOLDERING ELECTRONIC COMPONENT 失效
公开(公告)号：JPS6461988A
公开(公告)日：1989-03-08
申请号：JP21966187
申请日：1987-09-02
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KOBAYASHI KENZO , FUKUNAGA TAKAO , NAKAJIMA HISAO
IPC分类号： H05K3/32 , H05K3/34
摘要： PURPOSE:To enable a tin-lead alloy of a specified composition to be deposited by a method wherein the composition of tin-lead alloy to be separated is controlled according to immersion time thereof during the soldering process for deposited solder on a part to be soldered by immersing the electronic component to be soldered in a solution containing lead rhodinic acid or tin-lead rhodinic acid. CONSTITUTION:A sample equivalent to a part 3 to be soldered is immersed in a bath 8 of solution 4 containing lead rhodinic acid or tin-lead rhodinic acid in specified concentration and temperature. Then, tin-lead alloys separated from the sample at every changeable immersion times are picked up to check the composition ratios of tin-lead using e.g., a differential thermal analyzer. Next, the part to be actually soldered is immersed in the solution 4 containing lead rhodinic acid in the specified concentration and temperature. Finally, the immersion times are controlled by reading out the separation times of solder in specified tin-lead alloy composition of the part to be soldered making reference to the results previously checked.

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