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    • 62. 发明专利
    • TOOL FOR ROBOT
    • JPS63180430A
    • 1988-07-25
    • JP901587
    • 1987-01-20
    • TOSHIBA CORP
    • SATO KATSUHIKO
    • B23P19/06B25J19/00
    • PURPOSE:To permit the smooth fastening work for bolts and nuts by installing a grip which can be turned in the horizontal direction onto one of the shafts which can freely move in the longitudinal direction and extended and contract and installing a ratchet wrench onto the other. CONSTITUTION:A grip 6 is held by the hand part 18 of a manipulator, and a ratchet wrench 2 is inserted into a bolt or nut. When the hand part 18 is moved on a straight line, the distance between the ratchet wrench 2 and the hand part varies, and a compression spring is deformed, and the rear part shaft 5 extends and contracts in the axial direction, and the locus of the grip 6 which necessitates a circular movement can be replaced by the rectilinear movement corresponding to the chord 22. Further, the direction of the grip 6 can be set arbitrarily according to the degree of freedom in the revolution around a grip axis 13, and the need of the coincidence with the axis direction of the front part shaft 3 and rear part shaft 5 is avoided. Therefore, the direction of the hand part 18 is not restrained during work, and the tightening work for bolts and nuts can be carried out speedily and easily.
    • 65. 发明专利
    • SEMICONDUCTOR DEVICE
    • JPS6231148A
    • 1987-02-10
    • JP17076185
    • 1985-08-02
    • TOSHIBA CORP
    • SATO KATSUHIKO
    • H01L21/66H01L23/48
    • PURPOSE:To attain the sure measurement of semiconductor chips by providing the inspection pads which the probes for a sensor of a probe card are brought in contact with and the conductors which said pads are connected to, in the peripheral part of the semiconductor chip. CONSTITUTION:On the dicing run 12 extending longitudinally on a substrate 11, the inspection pads 14a, 14b, 14c, and 14d are arranged, which the probes for a sensor of a probe card are brought in contact with. Conductors 15 and 16 are arranged between the pads 14a and 14b, and between the pads 14c and 14d, respectively. A voltage is applied between the probes 17 and 18 for a sensor of the probe card in advance and when the probes 17 and 18 are brought in contact with the pads 14a and 14b respectively, a current flows. Even if one probe is not in contact with the pad, a current does not flow and the function of the sensor can be effected. Accordingly, the measurement of semiconductor chips can be made surely.
    • 66. 发明专利
    • MEMORY APPRECIATING DEVICE
    • JPS626498A
    • 1987-01-13
    • JP14375985
    • 1985-06-29
    • TOSHIBA CORP
    • SATO KATSUHIKO
    • G01R31/26G01R31/28G11C29/00G11C29/10G11C29/44
    • PURPOSE:To write/read a fail pattern signal in a defect analysis memory rapidly and easily independently of the kind of a test memory by setting the memory of the defect analysis memory on the basis of a test pattern signal and a control signal inputted from the outside. CONSTITUTION:When a prescribed test pattern signal TP is generated from a pattern generator 11 on the basis of control by a test processor 16, the signal TP is written on a test memory 13 through a driver 12. Then, the test pattern data TD read out from the test memory 13 are compared with an expected value pattern signal KP by a comparator 14 and the compared output is supplied to a defect analysis memory 15 as a fail pattern signal FP. An arithmetic pattern signal CP outputted from a scrambler 18 is supplied to the memory 15. The scrambler 18 determines the address of the defect analysis memory or the position of data on the basis of the signal TP and a control signal CS so that the addresses of the memories 13, 15 correspond to the array of data.