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61. 发明专利

JPH05308192A 失效
公开(公告)号：JPH05308192A
公开(公告)日：1993-11-19
申请号：JP15403492
申请日：1992-04-28
申请人： RISHO KOGYO KK
发明人： KATAYAMA TSUNEO , HIRATA KOJI
IPC分类号： H05K3/38 , H05K3/46
摘要： PURPOSE:To provide a multilayer printed wiring board wherein it restrains a halo phenomenon around a through-hole plated part and it eliminates an interlayer exfoliation completely without lowering the bonding power of a printed wiring copper conductor to a prepreg resin. CONSTITUTION:In a board for multilayer printed wiring board one or more printed wiring boards for inner-layer are overlapped via prepregs while a board material for outer-layer is arranged at least on one surface and the whole assembly is heated, pressurized, laminated and united. The board for multilayer printed wiring board is constituted in the following manner: a copper oxide layer is formed on the surface of a printed wiring copper conductor for a printed wiring board for inner-layer the copper oxide layer is reduced; a reduced copper layer is formed; and the surface of the reduced copper layer is covered with a molybdenum compound.

62. 发明专利

JPH05308191A 失效
公开(公告)号：JPH05308191A
公开(公告)日：1993-11-19
申请号：JP34384691
申请日：1991-10-24
申请人： RISHO KOGYO KK
发明人： KATAYAMA TSUNEO , HIRATA KOJI
IPC分类号： H05K3/38 , H05K3/46
摘要： PURPOSE:To reduce a halo phenomenon which is caused at the interface between an inner-layer circuit copper-foil pattern and a prepreg by a method wherein an inner-layer circuit board for multilayer printed wiring board use is immersed and treated in an aqueous solution which contains components of an A alkali, an oxidizing agent and a zinc compound, and the surface of a printed wiring pattern is roughened. CONSTITUTION:The surface of a printed wiring pattern on an inner-layer circuit board for multilayer printed wiring board is immersed and treated in an aqueous solution which contains an alkali such as sodium hydroxide, potassium hydroxide or the like, an oxidizing agent such as potassium persulfate, sodium chlorite or the like and a zinc compound such as zinc oxide, zinc chloride or the like within the range of conditions at 90 deg.C or lower and for 1 to 10 minutes. Then, the copper-foil surface of the printed wiring pattern is roughened. Thereby, it is possible to reduce a halo phenomenon which is caused at the interface between an inner-layer circuit copper-foil pattern and a prepreg.

63. 发明专利

JPH05212843A REGENERATED PAPER BASE PHENOL RESIN LAMINATED SHEET 失效
公开(公告)号：JPH05212843A
公开(公告)日：1993-08-24
申请号：JP2132792
申请日：1992-02-06
申请人： RISHO KOGYO KK
发明人： MATSUDA YOSHIMUNE
IPC分类号： B32B5/28 , B32B27/04 , B32B27/42 , B32B29/00 , H05K1/03
摘要： PURPOSE:To reduce production cost and to keep the original quality of a regenerated paper base phenol resin laminated sheet by using a compsn. compounded with a large amount of the ground matter of a paper base phenol resin laminated sheet as a raw material and enabling the use of the ground matter with a relatively large particle size. CONSTITUTION:A phenol resin is added to and mixed with the ground matter with a particle size of 600mum or less of a paper base phenol resin laminated sheet to obtain a resin coated powder and pulp is further mixed with this powder to form a regenerated paper base material from the resulting mixture by a papermaking method. A required number of the regenerated paper base materials are stacked to be integrally laminated under heating and pressure to form a regenerated paper base phenol resin laminated sheet.

64. 发明专利

JPH04224873A FILLER FOR SEALING RESIN AND PREPARATION THEREOF 失效
公开(公告)号：JPH04224873A
公开(公告)日：1992-08-14
申请号：JP41859590
申请日：1990-12-26
申请人： RISHO KOGYO KK
发明人： MIYAKE MASAFUMI , SAEKI RYOSO
IPC分类号： C01F5/00 , C01F5/02 , C01F5/08 , C04B41/89 , C08K3/22 , C08K9/04 , C09C1/02 , C09C3/08 , H01L23/29 , H01L23/31
摘要： PURPOSE:To improve low water resistance, the biggest drawback, of magnesia, to a tolerable level as a filler for a resin for sealing an electronic part while utilizing the thermal conductivity of magnesia. CONSTITUTION:A method for preparing the title filler which comprises thermally treating magnesium oxide particles at 1300-1600 deg.C to form magnesium oxide precursor particles, mixing the precursor particles with a hydrolyzed metal oxide soln., thermally treating the mixture at 300-600 deg.C to form a metal alkoxide layer on the surfaces of the precursor particles, mixing the treated particles with a zirco-aluminate coupling agent, and drying the resulting mixture by heating; and the title filler which is prepd. by thermally treating magnesium oxide particles at 1300-1600 deg.C to form spherical magnesium oxide precursor particles, forming a metal alkoxide layer on the surfaces of the spherical particles, and forming a zirco-aluminate coupling agent layer on the surface of the alkoxide layer.

65. 发明专利

JPH0496292A MANUFACTURE OF BOARD FOR MULTILAYER PRINTED CIRCUIT 失效
公开(公告)号：JPH0496292A
公开(公告)日：1992-03-27
申请号：JP20704190
申请日：1990-08-03
申请人： RISHO KOGYO KK
发明人： KATAYAMA TSUNEO , HIRATA KOJI , WATANABE KENJI
IPC分类号： H05K3/46
摘要： PURPOSE:To improve antioxidation without loss of adhesion strength and heat resistance of the adhering surface of an inner layer copper of a board by processing the circuit copper surface of an inner layer circuit board with copper oxide or cuprous oxide, and then dipping it in chromium compound solution. CONSTITUTION:In manufacture of superposing copper foils, one side or both-side copper-plated laminated boards on one or more inner layer circuit boards formed on one or both side surfaces with circuit patterns through prepregs, heating, pressuring and integrating the layer, the circuit copper foil surfaces of the inner layer circuit board is processed with copper oxide or cuprous oxide, and then dipped in solution of 0.01-10% of chromium compound in concentration, in which ammonium chromate is dissolved with solvent such as water, alcohol. When it is surface treated with the chromium compound, a chromate film having antioxidation can be formed while maintaining roughed state by copper oxidation. Accordingly, excellent antioxidation, adhesive strength and solder heat resistance equivalent to those of copper oxidation are provided.

66. 发明专利

JPH0416928B2 失效
公开(公告)号：JPH0416928B2
公开(公告)日：1992-03-25
申请号：JP2342788
申请日：1988-02-02
申请人： RISHO KOGYO KK
发明人： TOSHIKURA KOICHI
IPC分类号： H01G4/224

67. 发明专利

JPH03210380A ADHESIVE COMPOSITION 失效
公开(公告)号：JPH03210380A
公开(公告)日：1991-09-13
申请号：JP468190
申请日：1990-01-12
申请人： RISHO KOGYO KK
发明人： MAEDA ITSURO
IPC分类号： C09J129/14 , C09J163/00 , H05K3/38
摘要： PURPOSE:To obtain an adhesive composition improved in adhesiveness, workability, resistance to soldering heat, chemical resistance, and reliability in electrical insulating properties by mixing a butyral resin, an epoxy resin, a specified OH-terminated linear polyurethane resin, a curing agent, and a cure accelerator. CONSTITUTION:100 pts.wt. butyral resin having an average degree of polymerization of 1,000 to 2,400 is mixed with 70-100 pts.wt. epoxy resin preferably comprising a bisphenol A epoxy resin and having at least two epoxy groups in the molecule, 25-70 pts.wt. OH-terminated linear polyurethane resin having an average molecular weight of 100,000 to 300,000 and an OH group content of 0.1-0.2wt.%, obtained by reacting an isocyanate with a diol, a curing agent (e.g. diaminodiphenylmethane), and a cure accelerator (e.g. 2-phenyl-4- methylimidazole).

68. 发明专利

JPH03191595A MANUFACTURE OF ONE-SIDED METAL-CLAD LAMINATED BOARD FOR MULTILAYER CIRCUIT BOARD USE 失效
公开(公告)号：JPH03191595A
公开(公告)日：1991-08-21
申请号：JP33211289
申请日：1989-12-20
申请人： RISHO KOGYO KK
发明人： TAKEGUCHI KAZUNORI
IPC分类号： B32B15/08 , B32B43/00 , H05K3/38 , H05K3/46
摘要： PURPOSE:To obtain a one-sided metal-clad laminated board whose interlayer exfoliation defect is small when an outer layer is formed by a method wherein a prepreg face of a one-sided metal-clad laminated-sheet constitution body composed of a specific prepreg sheet and of a metal foil placed on its one side is arranged so as to be faced, via a sheet of mold- releasing paper whose surface has been roughened, with a prepreg face of another similar one-sided metal clad laminated-sheet constitution body and both sides are heated and pressurized. CONSTITUTION:A thermoset resin whose glass transition temperature is at 60 to 90% of a glass transition temperature at perfect hardening is arranged so as to be faced with the side of a prepreg sheet face of a one-sided metal-clad laminated-sheet constitution body which is composed of one to several prepreg sheets impregnated with a base material and of a metal foil placed on its one side in such a way that they sandwich a sheet of mold releasing paper whose surface has been roughened; the whole is heated and pressurized via a mirror-finished plate; a hardening reaction is stopped at the intermediate stage in a process in which the reaction progresses; and the mold releasing paper or a mold releasing film for roughened surface formation use is held on the side of a one-sided copper-clad laminated sheet until the sheet is used as a multilayer circuit board. As a result, it is possible to prevent the resin from absorbing moisture and to form the one-sided copper-clad laminated sheet in which a deterioration of the resin is small and whose curl is small. Thereby, it is possible to reduce that an interlayer exfoliation is caused.

69. 发明专利

JPH0344907B2 失效
公开(公告)号：JPH0344907B2
公开(公告)日：1991-07-09
申请号：JP11778383
申请日：1983-06-28
申请人： RISHO KOGYO KK
发明人： TANAKA KAZUAKI , OOHASHI YOSHITAKA
IPC分类号： B32B15/12 , B32B15/08 , B32B27/04 , H01B17/60

70. 发明专利

JPH0260944A MOLDING RESIN COMPOSITION 失效
公开(公告)号：JPH0260944A
公开(公告)日：1990-03-01
申请号：JP21340788
申请日：1988-08-27
申请人： RISHO KOGYO KK
发明人： MIYAKE MASAFUMI
IPC分类号： C08K3/10 , C08K9/02
摘要： PURPOSE:To obtain a molding resin composition having high thermal conductivity and lowly abrading a mold by mixing a resin with a particulate material, as a filler, prepared by converting the surface layers of alumina particles into aluminum nitride. CONSTITUTION:The title resin composition contains a particulate material prepared by converting the surface layers of alumina particles into aluminum nitride as a filler. Said composition comprises a resin and filler as essential components and optionally contains a curing agent, a cure accelerator, a colorant, a mold release, etc. As the filler, alumina particles prepared by instantaneously melting alumina particles by flame melting and converting the surfaces of roundish alumina particles into aluminum nitride are used. The resin composition has high increased thermal conductivity because alumina of high thermal conductivity is used, and it is lowly abrasive to a mold because the surface layers of roundish alumina particles are converted into aluminum nitride of a hardness lower than that of alumina and a thermal conductivity better than that of alumina.

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