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    • 52. 发明专利
    • GATE TURN-OFF THYRISTOR AND ITS MANUFACTURE
    • JPH02291171A
    • 1990-11-30
    • JP5682090
    • 1990-03-09
    • SIEMENS AG
    • KURAUSUGIYUNTAA OTSUPERUMAN
    • H01L29/74H01L21/18H01L21/332H01L29/10H03K17/732
    • PURPOSE: To reduce loss of electric power, caused by carrier carrying-out by performing taking out of an excessive carrier accumulating in the first base layer under conduction state of thyristor chiefly through a part layer of the first base layer which is very strongly doped. CONSTITUTION: A semiconductor block comprises an n -doped n-emitter 1, a p -doped p-base 2, an n -doped n-base 3, a p -doped p-emitter 4, and a positive pole side electrode 5 comprising a terminal A, formed of such conductive material as aluminum. The n-base 3 extends as far as a first main surface 12 of a thyristor, surrounding the side surface of the p-base layer 2 extending as far as the main surface 12. A thin part layer 21, present at the n-base 3, which is strongly n -doped extends as far as a side edge 22 of the semiconductor block, to contact to a conductive coat 23 there. The conductive coat 23 extends to a main surface 12 from the side edge 22 to the main surface 22, comprising a terminal 24 within a range of the main surface 12. This is connected, through a switch 25, to a negative pole of a DC voltage source 26, with a positive pole connected to a terminal A. The switch 25 is a field effect transistor, and its gate is provided with a terminal 27.
    • 53. 发明专利
    • GATE TURN OFF THYRISTOR AND MANUFACTURE THEREOF
    • JPH02197169A
    • 1990-08-03
    • JP1683089
    • 1989-01-26
    • NIPPON INTER ELECTRONICS CORP
    • SAKAMOTO HIROAKI
    • H01L29/74H01L21/332H01L29/744
    • PURPOSE:To shorten a gate turn off thyristor of this design in turn-off time by a method wherein the PE layer of a GTO is made low in impurity concentration so as to restrain holes from injecting from the PE layer. CONSTITUTION:An N-type substrate 1 is subjected to a wet oxidation, and a P thin layer 11 is formed using H2+Ga2O3. One side of the substrate 1 is etched and B is diffused to form a P layer 11b. Next, the same as a conventional one, P is diffused from the upside of the P layer 11b to selectively form an anode shortcircuiting N layer 12. Then, P is driven in to form a P layer 11c and an N layer 12a of specified thicknesses. An N layer serving as an electrode is diffused into another primary face cf a P layer 11c, and a four- layered structure composed of an NE layer 13, a PB layer 14, an NB layer 15, a PE layer 16a, and an NS layer 17 can be obtained. Next. the NE layer 13 is selectively etched to be formed into an island-like NE layer, and an electrode is provided to these layers respectively to complete the formation of a GTO. As a PE layer is small in impurity concentration, holes are restrained from injecting from the PE layer at turn-off and a GTO of this design can be made especially short in turn-off time.
    • 56. 发明专利
    • SEMICONDUCTOR DEVICE
    • JPS61158179A
    • 1986-07-17
    • JP27872684
    • 1984-12-28
    • TOSHIBA CORPTOSHIBA COMPONENT KK
    • YAKUSHIJI SHIGENORIMATSUMOTO SHINICHI
    • H01L29/74H01L21/332H01L29/747
    • PURPOSE:To equip a device with high sensitivity in its gate trigger feature under the III(+) mode by a method wherein a third surface layer is formed on the ground surface to partially overlap the portion just under a first surface layer and a second intermediate layer adjoining the third surface layer at the side of the first surface layer is made to be lower in impurity concentration than a second intermediate layer exposed portion adjoining the third surface layer. CONSTITUTION:A first intermediate layer adjoining a TRIAC first surface layer NE1 at the side of a third surface layer NE2 is lower in impurity concentration and shallower in depth of diffusion than a first intermediate layer exposed portion P1 adjoining the first, second surface layers NE1, NE2. A second intermediate layer adjoining a thirs surface layer NE2 at the side of the first surface layer NE1 is lower in impurity concentration and shallower in depth of diffusion that a second intermediate layer exposed portion P2. On the surface of the substrate, a first main electrode T1 and gate electrode G are provided, respectively bridging the first surface layer NE1 or second surface layer NEG and the first intermedaite layer exposed portion P1 and, on the other surface of the substrate, a second main electrode T2 is provided, bridging the thirs surface layer NE2 and second intermediate layer exposed portion P2.
    • 57. 发明专利
    • Manufacture of hetero junction thyristor
    • 异相接头制造商的制造
    • JPS59151461A
    • 1984-08-29
    • JP2380083
    • 1983-02-17
    • Oki Electric Ind Co Ltd
    • ARAI MICHIHIKOFURUKAWA RIYOUZOU
    • H01L21/20H01L21/332H01L29/74
    • H01L29/74
    • PURPOSE:To obtain a hetero junction thyristor of high performance through simple manufacture by diffusing only one of p type or n type impurities to a hetero junction epitaxial layer. CONSTITUTION:There is an n type high-concentration substrate material n layer in depth deeper than D3 in a substrate. On the other hand, a low-concentration n type epitaxial layer n1 layer is crystal-grown between D2 and D3 on said layer, a high-concentration n type epitaxial layer n layer between D1 and D2 on the n1 layer and a low-concentration n type epitaxial layer n2 layer between D0 and D1 on the n layer. Such epitaxial growth is executed, and a p type impurity is diffused in N4 surface concentration from the surface D0. p Type concentration is made larger than others in the n2 layer between D0 and D1 and the n1 layer between D2 and D3 and p type concentration is made smaller than others in the n layer between D1 and D2 as necessary conditions for p type impurity concentration at that time. According to such diffusion, a p-n- p-n type junction is obtained through one-time diffusion process. Consequently, there is no pollution of impurities among each layer because the same type epitaxial growth is used, and each layer can be acquired by one-time growth, thus obtaining excellent characteristics.
    • 目的:通过将p型或n型杂质中的一种仅扩散到异质结外延层,通过简单的制造获得高性能的异质结晶闸管。 构成:在衬底中存在深度比D3深的n型高浓度衬底材料n +层。 另一方面,低浓度n型外延层n1层在所述层上的D2和D3之间晶体生长,n1上的D1和D2之间的高浓度n型外延层n + 层和n +层之间的D0和D1之间的低浓度n型外延层n2 - 层。 执行这种外延生长,并且p型杂质从表面D0扩散到N4表面浓度。 在D1和D2之间的n +层中,在D2和D3之间的n2层和D2和D3之间的n2层中,p型浓度大于其他n2层,并且在D1和D2之间的n +层中p型浓度小于其他浓度 作为此时p型杂质浓度的必要条件。 根据这种扩散,通过一次性扩散过程获得p-n-p-n型结。 因此,由于使用相同型的外延生长,因此在各层中不会有杂质污染,可以通过一次生长获得各层,从而获得优异的特性。