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    • 53. 发明专利
    • ULTRASONIC CLEANING DEVICE
    • JPH10323635A
    • 1998-12-08
    • JP13467197
    • 1997-05-26
    • SONY CORP
    • SATO NOBUAKINISHIZAKI MITSUHIRO
    • B08B3/12B08B11/02H01L21/00H01L21/304
    • PROBLEM TO BE SOLVED: To provide an ultrasonic cleaning device for emitting ultrasonic waves effectively all over a face the be cleaned of a wafer to enhance the cleaning effect. SOLUTION: Supporting members 28a and 28b for holding a wafer 7 in a cleaning liquid 6 in the given posture are set on the positions of respectively different height, and ultrasonic protective plates 24a and 24b are provided respectively on the front faces of ultrasonic wave generators 23 and 24 set on both side walls of an ultrasonic wave tank 2. The ultrasonic wave protective plates are movable respectively to the front faces of the ultrasonic wave generators and to the standby positions retracted from the front faces, and when ultrasonic waves are emitted from the other side, the plates are positioned on the front faces. The ultrasonic wave generators 23a and 23b are actuated alternately, and ultrasonic waves are emitted all over a face 7a to be cleaned of the wafer 7 by emitting ultrasonic waves from the other side to ultrasonic wave unreceived areas 29a (29b) not having received ultrasonic waves when the ultrasonic waves are emitted from one side to the wafer 7.
    • 54. 发明专利
    • SUBSTRATE CLEANING UNIT AND SUBSTRATE CLEANING SYSTEM
    • JPH10321580A
    • 1998-12-04
    • JP13914897
    • 1997-05-15
    • TOKYO ELECTRON LTD
    • KITAHARA SHIGENORI
    • B08B11/02B08B3/02B08B3/04B08B13/00B65G49/07H01L21/304
    • PROBLEM TO BE SOLVED: To reduce the displacement volume in a cleaning solution atmosphere by minimizing the installed area of a substrate cleaning unit by arranging a cleaning chamber above a cleaning tank in which wafers are cleaned by immersing the wafers in a first cleaning solution and cleaning the surfaces of the wafers by discharging a second cleaning solution and elevating and lowering the cleaned wafers by means of an elevating/lowering mechanism provided between the cleaning tank and cleaning chamber. SOLUTION: After wafers W are cleaned by immersing the wafers W in a first cleaning solution contained in a cleaning tank 20, the wafers W are further cleaned by supplying a second cleaning solution obliquely downward to the surfaces of the wafers W from pluralities of spraying holes bored around a pair of nozzles 40 provided in a cleaning chamber 21 arranged above the cleaning tank 20. In this case, the holding member of an elevating/lowering device 22 provided between the cleaning tank 20 and cleaning chamber 21 is elevated and lowered so as to carry the wafers in and out of the tank 20 and chamber 21. Therefore, the installed area of a substrate cleaning unit can be effectively utilized and the displacement volume of the cleaning solution atmosphere can be reduced. In addition, the complexity of a cleaning system can be suppressed.
    • 55. 发明专利
    • CLEANING DEVICE
    • JPH10270409A
    • 1998-10-09
    • JP7503897
    • 1997-03-27
    • NEC CORP
    • YAMAZAKI SHINYA
    • B08B11/02B08B3/08H01L21/304
    • PROBLEM TO BE SOLVED: To provide a cleaning device which can effectively clean and rinse a semiconductor substrate, liquid crystal substrate, etc. SOLUTION: On the bottom of a water washing tank 1, a carrier holding tool 8 and height adjusting tools 9 having different heights in a step-like state are provided. When a carrier 5 containing wafers 4 is placed on the carrier holding tool 8, the height adjusting tools 9 vertically hold the wafers 4 in the carrier 5 at different heights in a step-like state. When the tools 9 hold the wafers 4, pure water is supplied through bottom water inlets 10 and side-face water inlets 11 and flows on the wafers 4 in an oblique direction. Since the wafers 4 are respectively held at different heights in the step-like state, the pure water easily flows in the spaces among the wafers 4 and, after washing the surfaces of the wafers 4, overflows the tank 1.
    • 58. 发明专利
    • COMPOSITE PALLET
    • JPH105713A
    • 1998-01-13
    • JP16143396
    • 1996-06-21
    • IBIDEN CO LTD
    • TAKAMI TORU
    • B08B11/02
    • PROBLEM TO BE SOLVED: To improve productivity by saving time and effort spent in transferring parts in each stage. SOLUTION: This composite pallet is constituted so that plural parts are treated en bloc and the parts are supplied to a working machine or recovered from the machine one by one. In this case, a positioning pallet 20 on which a pin 24 for supporting the inner periphery of the part 11 from below is provided at specified plural positions and a frame 36 corresponding to the pin 24 and supporting the outer periphery of the part 11 from below are provided, and a rack 30 placed detachably on the pallet 20 is furnished. The parts 11 are respectively supported on the frame 36 of the rack 30, the rack 30 is placed on the pallet 20, and the parts 11 are transferred on the pin 24 of the pallet 20 from the frame 36.