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51. 发明专利

JP4747280B2 Bonding method of the substrate and the device using the Au-Sn alloy solder paste 有权
公开(公告)号：JP4747280B2
公开(公告)日：2011-08-17
申请号：JP2006090901
申请日：2006-03-29
申请人：三菱マテリアル株式会社
发明人：昭史三島 , 正好小日向 , 石川　　雅之
IPC分类号： H05K3/34 , B23K35/22 , B23K35/30 , C22C5/02
CPC分类号： H01L2224/13144 , H01L2224/32225 , H01L2224/83143 , H01L2924/0105

52. 发明专利

JP2010123780A Mounting substrate, method of manufacturing the same, and display device and method of manufacturing the same 有权
标题翻译：安装基板，其制造方法和显示装置及其制造方法
公开(公告)号：JP2010123780A
公开(公告)日：2010-06-03
申请号：JP2008296512
申请日：2008-11-20
申请人： Sony Corp , ソニー株式会社
发明人： OTORII SUGURU , AOYANAGI TETSUTOSHI , TOMOTA KATSUHIRO
IPC分类号： H01L23/12 , H01L21/52 , H01L33/48
CPC分类号： H01L23/49838 , H01L23/3121 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L33/62 , H01L2224/04026 , H01L2224/04105 , H01L2224/06181 , H01L2224/20 , H01L2224/29101 , H01L2224/29111 , H01L2224/83143 , H01L2224/83192 , H01L2224/83194 , H01L2224/83801 , H01L2224/97 , H01L2924/0001 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/15788 , H01L2924/3025 , H01L2224/83 , H01L2924/00 , H01L2224/29099 , H01L2224/29298 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： PROBLEM TO BE SOLVED: To provide a mounting substrate on which each chip is fixed on a predetermined position of the substrate at high positional accuracy. SOLUTION: Each solder wettable pattern 21a of a planar shape obtained by radially protruding protrusions from a center of the mounting substrate 1 is formed on the mounting substrate 1, a solder pattern 23a having substantially the same planar shape as the solder wettable pattern is selectively formed on the solder wettable pattern and the solder pattern is depressed to flatten the surface of the solder pattern. Then, a chip-like light-emitting device 10 is mounted on the surface-flattened solder pattern. Then, when the solder pattern is reflowed, the chip-like light-emitting device is moved and fixed to the center like self alignment by surface tension of a solder material. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种安装基板，其中每个芯片以高位置精度固定在基板的预定位置上。解决方案：通过从安装基板1的中心径向突出的凸起获得的平面形状的每个焊料可湿性图案21a形成在安装基板1上，具有与焊料可润湿图案基本相同的平面形状的焊料图案23a 被选择性地形成在焊料可润湿图案上，并且焊接图案被压下以使焊料图案的表面变平。然后，在表面平坦的焊料图案上安装芯片状发光器件10。然后，当焊料图案被回流时，芯片状发光器件通过焊料材料的表面张力移动并固定到中心像自对准。版权所有（C）2010，JPO＆INPIT

53. 发明专利

JP2010056399A Method of joining substrate and object to be mounted using solder paste having excellent registration 审中-公开
标题翻译：使用具有良好注册的焊膏进行加工的基板和对象的方法
公开(公告)号：JP2010056399A
公开(公告)日：2010-03-11
申请号：JP2008221633
申请日：2008-08-29
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： ISHIKAWA MASAYUKI , NAKAGAWA SUSUMU
IPC分类号： H05K3/34 , B23K1/00 , B23K31/02 , B23K35/22 , B23K35/26 , B23K35/30 , B23K101/40 , C22C5/02 , C22C11/06 , C22C13/00 , H01L21/52
CPC分类号： H01L24/83 , H01L24/05 , H01L2224/04026 , H01L2224/05 , H01L2224/29 , H01L2224/29298 , H01L2224/32225 , H01L2224/83143 , H01L2224/838 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/01322 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of joining by which an object is mounted on the same position and in the same direction with respect to a substrate using a solder paste. SOLUTION: A solder paste 3 is mounted or applied between a metalized layer formed on the substrate and a metalized layer formed on the square object 4 to be mounted, and then subjected to reflow processing. When the substrate and the square object 4 to be mounted are jointed using the solder paste, the metalized layer formed on the surface of the substrate has a planar shape that has a metalized layer body part 6, the area of which is smaller than the area of the metalized layer on the object 4 to be mounted, and at least two solder inducing parts of the metalized layer 7 protruding from around the metalized layer body part 6, so that during the reflow processing, diagonal lines of the square object 4 to be mounted and the protruding direction of the solder inducing parts of the metalized layer 7 is rotated so as to coincide with each other for soldering. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种使用焊膏将物体安装在相对于基板的相同位置和相同方向上的接合方法。解决方案：将焊膏3安装或施加在形成在基板上的金属化层和形成在要安装的方形物体4上的金属化层之间，然后进行回流处理。当使用焊膏将待安装的基板和方形物体4接合时，形成在基板表面上的金属化层具有平坦形状，该平面形状具有金属化层主体部分6，其面积小于区域并且金属化层7的至少两个焊料引导部分从金属化层本体部分6的周围突出，使得在回流处理期间，正方形物体4的对角线为并且金属化层7的焊料引导部分的突出方向被旋转以便彼此重合以进行焊接。版权所有（C）2010，JPO＆INPIT

54. 发明专利

JP2005317694A Aligning part, aligning apparatus, and aligning method 审中-公开
标题翻译：对齐部件，对准装置和对准方法
公开(公告)号：JP2005317694A
公开(公告)日：2005-11-10
申请号：JP2004132557
申请日：2004-04-28
申请人： Rikogaku Shinkokai , 財団法人理工学振興会
发明人： SATO KAIJI
IPC分类号： H05K13/04
CPC分类号： H01L2224/04026 , H01L2224/05552 , H01L2224/83143 , H01L2224/95145 , H01L2224/95146 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To improve the success rate of the simultaneous self-aligning of a single part or of a plurality of parts in the presence of a large initial displacement. SOLUTION: The part 1 has an adsorbing region 11 located near the middle of its bottom and high in wettability to a droplet, a blocking region 12 located near the periphery of its bottom and low in wettability to a droplet, and a guiding region 13 extending from the adsorbing region 11 to the sides of the part 1 and high in wettability to a droplet 3. Upon contact of a droplet 3 arranged on the surface of a substrate 2 with the guiding region 13 on a side of the part 1, the droplet 3 is guided to the adsorbing region 11 for the part 1 to be aligned with the droplet 3. The aligning apparatus and the aligning method uses the aligning part 1. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提高在大的初始位移的存在下单个部件或多个部件的同时自对准的成功率。解决方案：部件1具有位于其底部中部附近并且对液滴具有高润湿性的吸附区域11，位于其底部周围附近的阻挡区域12和对液滴的润湿性低，并且引导区域13从吸附区域11延伸到部分1的侧面并且对液滴3具有高的润湿性。当将布置在基板2的表面上的液滴3与部分1的一侧上的引导区域13接触时，液滴3被引导到吸附区域11以使部件1与液滴3对准。对准装置和对准方法使用对准部分1.版权所有（C）2006，JPO＆NCIPI

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