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51. 发明专利

JPH11255379A SHEET MATERIAL POSITIONING DEVICE 失效
公开(公告)号：JPH11255379A
公开(公告)日：1999-09-21
申请号：JP6183998
申请日：1998-03-13
申请人： NICHIDEN MACH LTD
发明人： HAYASHI RYUJI
IPC分类号： B65H9/10
摘要： PROBLEM TO BE SOLVED: To position a weak sheet material having a low stiffness using a simple and low-cost mechanism. SOLUTION: Air holes 24 are dispersively provided in the top surface of a stage 20 on which a sheet material is placed, and when positioning pushers 23x and 23y push the sheet material 14 and locate, air is sent off from the holes 24 so as to reduce the friction between the sheet material and stage. Thus the sheet material 14 can be moved without risk of deformation.

52. 发明专利

JPH11243106A MANUFACTURING JIG FOR SOLDER BALL AND MANUFACTURE THEREOF USING THE SAME, AND FORMATION OF SOLDER BUMP USING THE SOLDER BALL 失效
公开(公告)号：JPH11243106A
公开(公告)日：1999-09-07
申请号：JP4501898
申请日：1998-02-26
申请人： NICHIDEN MACH LTD
发明人： TAKASU SEIICHI
IPC分类号： H01L21/60 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To facilitate a transfer process by making large the projection size of solder balls from the solder ball manufacturing jig, when the solder balls are manufactured in an array arrangement corresponding to the arrangement of pads and transferred to form solder bumps on the pads. SOLUTION: This manufacturing jig 20 is constituted in such manner that a holding hole 30 formed in an arrangement corresponding to the arrangement of the pads is formed to the volume in matching with the size of a solder ball 8 by putting a main part 31 which is sufficiently large to hold the solder ball 8, and an expanded part 32 which is shallower than it and has a larger diameter. This manufacturing jig enable making large the projection size from the jig surface in the array state and performs transfer to the pads in this state to facilitate the formation of the solder bumps.

53. 发明专利

JPH11135936A COMPONENT ASSEMBLING DEVICE AND CHIP BONDER APPLYING THE SAME 失效
公开(公告)号：JPH11135936A
公开(公告)日：1999-05-21
申请号：JP29507797
申请日：1997-10-28
申请人： NICHIDEN MACH LTD
发明人： KOBAYASHI SHIGEKI
IPC分类号： H05K3/34 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To heat a part at a stable temperature without oxidation even if it is formed of a material easy-to-oxidized and enable rapid assembly, by feeding a carrier whereon a base and a part are mounted and transferring a part onto a base at a specified position, and assembling it. SOLUTION: A base and a part are mounted on carriers 10a, 10b at a regular interval respectively and are subjected to step feed inside a tunnel furnace 100 to be heated. The carriers are provided with an installation place for positioning a base and a part. Relative position relation between an installation place 11 of a base and an installation place of a part is made unified. Rails 111, 112 are provided inside the tunnel furnace 100 and the carriers 10a, 10b arranged on the rails 111, 112 are subjected to step feed at an arrangement interval of a base. A suction nozzle is arranged in a position wherein a part is mounted and assembled on a base and a part is sucked and assembled on a base. Atmosphere inside the tunnel furnace 100 is non-oxidizing atmosphere such as reducing atmosphere.

54. 发明专利

JPH10129836A CHUCK DEVICE AND DEVICE PROVIDED THEREWITH FOR CHANGING POSITION OF PLATE-SHAPED MEMBER 失效
公开(公告)号：JPH10129836A
公开(公告)日：1998-05-19
申请号：JP28772096
申请日：1996-10-30
申请人： NICHIDEN MACH LTD
发明人： KUROKAWA MUTSUO
IPC分类号： B65G49/06
摘要： PROBLEM TO BE SOLVED: To prevent a glass plate from being broken into fine dust and the dust from sticking to the surface of the glass plate when the glass plate contacts a chuck for holding the glass plate when the position of the glass plate is changed. SOLUTION: In a chuck device 15 for handling a glass plate 1 by sucking the glass plate 1 by suction with a sucking block 6, the sucking block 6 has a contact part 61a which contacts the glass plate 1 only on the outer periphery of the surface thereof, a sucking groove 61b which is opposite partially to the outer peripheral surface of the glass plate 1 in the outside of the contact part 61a with respect to the glass plate 1 and protrudes from the outer periphery of the glass plate 1, and a stopper 6 for regulating the position of the glass plate 1 from the outside thereof with a small gap.

55. 发明专利

JPH09330973A CLASSIFICATION-ARRANGEMENT DEVICE 失效
公开(公告)号：JPH09330973A
公开(公告)日：1997-12-22
申请号：JP14877396
申请日：1996-06-11
申请人： NICHIDEN MACH LTD
发明人： NOGUCHI SHUNJI
IPC分类号： H01L21/67 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To facilitate an exchange of trays by a method wherein when pellets are packed in the trays, a stage is moved in a direction X and at the same time, at the time of the exchange of the trays, the stage is rotated. SOLUTION: Pellets are picked up at a pickup position P, are freely carried at the distance in a direction Y and are packed in trays 5 by a pickup part. At this time, when the pellets are packed in the trays 5, a tray stage 24, which is freely rotatable with roughly the center of the upper surface of the tray stage as its axis C, is moved in a direction X to move the position for packing the pellets to the carrying line of the pellets, which are carried by the pickup part, and at the time of an exchange of the tray 5, the stage 24 is rotated to move the tray 5 to the exchange position. Thereby, an exchange of the trays 5 can be easily made.

56. 发明专利

JPH09283541A DIE BONDER 失效
公开(公告)号：JPH09283541A
公开(公告)日：1997-10-31
申请号：JP8848596
申请日：1996-04-10
申请人： NICHIDEN MACH LTD
发明人： HONDA MOTOHARU
IPC分类号： H01L21/66 , H01L21/52
摘要： PROBLEM TO BE SOLVED: To enable the use change between a non-mapping system and mapping system with a low-cost modification. SOLUTION: A movable table 2, a mounting head 4 and a camera 3 are combined with an image recognizing system 13 which processes signals from the camera 3 for image recognition to judge if a chip 1 is good, and certify its position and controls the table 2 and head 4 to process many chips and position only the good chips and picks them up. Besides the above functions the system 13 has functions of requesting the outside for the position coordinates of a chip 1 to be next picked up on mapping data of a previously formed chip 1 through a communication interface 12, controlling the table according to the obtained data to move the chip 1 to a picking up position, processing signals from the camera 3 for image recognition to certify the position of the chip 1, controlling the table 2 and head 4 to position it and picking up it.

57. 发明专利

JPH09148345A DIE BONDER 失效
公开(公告)号：JPH09148345A
公开(公告)日：1997-06-06
申请号：JP30004295
申请日：1995-11-17
申请人： NICHIDEN MACH LTD
发明人： HASE MINORU
IPC分类号： H01L21/52
摘要： PROBLEM TO BE SOLVED: To provide a die bonder that realizes high-speed operation by using a simple cooling mechanism comprising a plate in which a heat pipe is formed of fine piping filled with a liquid. SOLUTION: A die bonder comprises a horizontal moving mechanism 1 that carries a holder 7 for holding pellets 5 attached to an adhesive sheet 6; a heater block 2 placed above the mechanism 1 to heat a lead frame 10 placed on it; a bonding head 3 that picks up a pellet 5 from the adhesive sheet 6, carries it horizontally and mount it on the lead frame 10; and a cooling mechanism 15 disposed immediately under the heater block 2 to block the downward radiation from the heater block. The cooling mechanism 15 includes a plate in which a heat pipe is formed of fine piping filled with a liquid.

58. 发明专利

JPH0917841A PICKUP DEVICE, AND CHIP POSITIONING METHOD 失效
公开(公告)号：JPH0917841A
公开(公告)日：1997-01-17
申请号：JP16078095
申请日：1995-06-27
申请人： NICHIDEN MACH LTD
发明人： HORI NOBUHIRO
IPC分类号： G01B11/00 , G01B11/14 , G06T7/60 , H01L21/301 , H01L21/52 , H01L21/67 , H01L21/68
摘要： PURPOSE: To position all chips accurately and quickly by an optimum quantity of pitch shifting even if the interval between chips are different partially. CONSTITUTION: When arranging a chip in the specified position while shifting a mobile table, based on the recognition data being obtained by photographing many chips which are arranged at specified pitches in lattice shape, being mounted on a mobile table, by means of a camera, and processing the image signal by the camera with an image processor, the intervals Pn, Pn-1, and Pn-2 between chips and the direction of arrangement are computed from the recognition data of a plurality of chips Tn-1 , Tn-2 , and Tn-3 positioned right before it, and based on the computation result, the interval Pn+1 between chips to the chip Tn+1 to be the next object of recognition and the direction of arrangement are forecast, and based on the forecast data, the mobile table is shifted by pitches.

59. 发明专利

JPH08330390A PICKING-UP DEVICE AND METHOD 失效
公开(公告)号：JPH08330390A
公开(公告)日：1996-12-13
申请号：JP13359695
申请日：1995-05-31
申请人： NICHIDEN MACH LTD
发明人： HORI NOBUHIRO
IPC分类号： H01L21/66 , H01L21/52 , H01L21/67 , H01L21/68
摘要： PURPOSE: To improve the index of chips, by recognizing in advance the next selected chip based on its picture data during the picking-up operations of selected chips, and by disposing the recognized chip in the center of a camera visual field based on its precedent recognized data, and further, by increasing the speeds of the picking-up operations of the chips. CONSTITUTION: A camera visual field m wherein chips t arranged in X and Y directions in an array state have been photographed is set for the pictures of the plurality of chips t to be processed, and one chip t of the plural chips t is selected for the selected chip t to be disposed in a center c of the camera visual field m and be picked up in succession. In that case, during the picking-up operations of the selected chips t, the next selected chip t is recognized in advance, using as the objects, a chip group T comprising a predetermined number of chips t, based on their picture data, and the recognized chip t is disposed in the center c of the camera visual field m, based on the recognized data in advance. For example, the chip t present in the shortest distance from the center c of the camera visual field m is recognized in advance prior to others.

60. 发明专利

JPH08330336A PICKUP DEVICE AND CHIP POSITIONING METHOD 失效
公开(公告)号：JPH08330336A
公开(公告)日：1996-12-13
申请号：JP13357495
申请日：1995-05-31
申请人： NICHIDEN MACH LTD
发明人： HORI NOBUHIRO
IPC分类号： H01L21/52
摘要： PURPOSE: To accurately position all chips in the center of the visual field of camera by a method wherein the chips are arranged in the center of visual field of camera by giving the correction amount obtained by the preceding recognition to the preceding recognition data. CONSTITUTION: An image processing part 3 pre-recognizes a plurality of chips T within the visual field (m) of camera while the chips T are in operation, the image processing part 3 recognizes the amount of deviation of the center (c) when the chips T are arranged on the center (c) within the camera's visual field (m) based on the above-mentioned pre-recognition, an automatic teaching, in which the amount of deviation-recognized is used as the correction amount of chip position of pre-recognition, is conducted, and when the chip of the same position is pre-recognized while the correction amount by the automatic teaching is being renewed, the correction amount obtained by the last pre-recognition is given to pre-recognition. On the control part 7, a movable table 2 is operated by a movable table driving part 6 based on the output of the image processing part 3, and the chip T is a arranged on the center C. As a result, highly reliable high-speed pickup can be accomplished.

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