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51. 发明专利

JP2005019752A Ceramic green sheet laminating equipment and process for manufacturing multilayer ceramic electronic component 有权
标题翻译：陶瓷绿板层压设备及制造多层陶瓷电子元器件的工艺
公开(公告)号：JP2005019752A
公开(公告)日：2005-01-20
申请号：JP2003183464
申请日：2003-06-26
申请人： Tdk Corp , Tdk株式会社
发明人： YAGI HIROSHI
IPC分类号： H01G4/12 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To provide laminating equipment and a process for manufacturing a high quality multilayer ceramic electronic component with high yield.
SOLUTION: The receiving table 11 of a first die 1 has a surface 131 for receiving a green sheet. A frame 23 provided in the support 21 of a second die 2 is facing a first movable body 12. Cutting blades 24 and 25 are arranged in parallel through an interval W1 corresponding to the width of the receiving surface 131 on the inside of the frame work 23 with the edge directing toward the receiving surface 131. A second movable body 22 is arranged within the interval W1 between the cutting blades 24 and 25 while facing the receiving surface 131 and supported by the support 21 in such a relation as movable relatively to the support 21.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供高成品率的层压设备和制造高品质多层陶瓷电子部件的方法。解决方案：第一模具1的接收台11具有用于接收生片的表面131。设置在第二模具2的支撑件21中的框架23面向第一可移动体12.切割刀片24和25平行地布置在与框架工件的内侧上的接收表面131的宽度相对应的间隔W1 23，其边缘指向接收表面131.第二可移动体22布置在切割刀片24和25之间的间隔W1内，同时面向接收表面131并且以支撑件21支撑的关系可以相对于支持21.版权所有（C）2005，JPO＆NCIPI

52. 发明专利

JP2005014198A Cutting device, cutting method and electronic part 审中-公开
标题翻译：切割装置，切割方法和电子部分
公开(公告)号：JP2005014198A
公开(公告)日：2005-01-20
申请号：JP2003186326
申请日：2003-06-30
申请人： Tdk Corp , Tdk株式会社
发明人： YAGI HIROSHI , HIROOKA RIICHI
IPC分类号： B26D1/14 , B24B27/06
摘要： PROBLEM TO BE SOLVED: To reduce a cutting margin, by stabilizing a cutting dimension of a chip type electronic part. SOLUTION: Spacers 18 and 22 are respectively arranged between a cutting blade 20 and respective flanges 14 and 24, and are formed into a structure for sandwiching the cutting blade 20 between a pair of flanges 14 and 24 via these spacers 18 and 22. That is, the cutting blade 20 is rotated in response to the high speed rotation of a spindle 12, and a cutting object material is cut by the cutting blade 20. In this case, blade appearing quantity H being a distance between the outer peripheral end of the respective spacers 18 and 22 and the outer peripheral end of the cutting blade 20, is set to a dimension of 1.5 to 4 times the thickness of a laminated body unit. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过稳定芯片型电子部件的切割尺寸，减少切割余量。解决方案：间隔件18和22分别设置在切割刀片20和相应的凸缘14和24之间，并且形成为通过这些间隔件18和22将切割刀片20夹在一对凸缘14和24之间的结构也就是说，切割刀片20响应于心轴12的高速旋转而旋转，并且切割对象材料被切割刀片20切割。在这种情况下，叶片出现量H是外周边相应的间隔件18和22的端部和切割刀片20的外周端被设定为层叠体单元的厚度的1.5至4倍的尺寸。版权所有（C）2005，JPO＆NCIPI

53. 发明专利

JP2004146684A Method for manufacturing ceramic electronic part 审中-公开
公开(公告)号：JP2004146684A
公开(公告)日：2004-05-20
申请号：JP2002311446
申请日：2002-10-25
申请人： Tdk Corp , Tdk株式会社
发明人： YAGI HIROSHI , ISHIGAKI TAKAYA
IPC分类号： H01G4/12 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method for easily manufacturing ceramic electronic parts.
SOLUTION: A plurality of ceramic green sheets 70 are prepared, and those ceramic respective sheets 70 are provided with an electrode group 60. The electrode group 60 is formed with the same pattern between the ceramic green sheets 70. The plurality of ceramic green sheets 70 are laminated on a laminate stand 81, and the mutually adjacent two ceramic green sheets 70 are made to face each other with a deviation of a predetermined volume when they are laminated. The laminate stand 81 absorbs air from a vent hole 811 in a state that the ceramic green sheets 70 are arranged on the laminate stand 81.
COPYRIGHT: (C)2004,JPO

54. 发明专利

JP2004134662A Ceramic electronic parts manufacturing method and manufacturing equipment therefor 有权
公开(公告)号：JP2004134662A
公开(公告)日：2004-04-30
申请号：JP2002299311
申请日：2002-10-11
申请人： Tdk Corp , Tdk株式会社
发明人： YAGI HIROSHI , ISHIGAKI TAKAYA
IPC分类号： H01G4/30 , H01G4/12 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To provide a ceramic electronic parts manufacturing method capable of reducing a delamination occurring at the time of baking.
SOLUTION: At least two ceramic green sheets 70 are laminated on a laminating table 81. At least one of the ceramic green sheets 70 has electrodes 60 in a laminating interface. The laminating table 81 has a ventilation hole 811 in a receiving surface 810 for receiving the ceramic green sheets 70. The ventilation hole 811 is distributed over the receiving surface 810. Further, air is sucked in from the ventilation hole 811 with the ceramic sheets 70 mounted on the laminating table 81.
COPYRIGHT: (C)2004,JPO

55. 发明专利

JP2002184647A METHOD OF MANUFACTURING LAMINATED CERAMIC CAPACITOR AND PRINTING PLATE MAKING DEVICE 失效
公开(公告)号：JP2002184647A
公开(公告)日：2002-06-28
申请号：JP2000382882
申请日：2000-12-15
申请人： TDK CORP
发明人： YAGI HIROSHI , CHIBA KAZUNORI
IPC分类号： B41C1/14 , B41M1/12 , B41M1/34 , H01G4/30 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing laminated ceramic capacitor and a printing plate making device, by which the labor, cost, etc., required for the manufacture, storage preparation, etc., of a printing plate can be reduced markedly. SOLUTION: An electrode-printed sheet is taken out, by punching out an area surrounding an electrode matrix pattern, obtained by printing the pattern on the printing plate from an unbaked dielectric ceramic sheet. Then a laminate is obtained by successively laminating a plurality of electrode-printed sheets 61 and 62 upon another, by offsetting the electrode matrix pattern printed on a second laminated electrode-printed sheet Q12 from the electrode matrix pattern printed on a first laminated electrode-printed sheet Q11 by ▵X1 in the direction of columns, or ▵Y1, in the direction of rows between the two adjacent electrode-printed sheets Q11 and Q12.

56. 发明专利

JP2000021680A MANUFACTURE OF MULTILAYER CHIP COMPONENT AND DEVICE 失效
公开(公告)号：JP2000021680A
公开(公告)日：2000-01-21
申请号：JP20584698
申请日：1998-07-06
申请人： TDK CORP
发明人： YAGI HIROSHI , HIROOKA RIICHI , SHIRAI SHIGEHIKO
IPC分类号： G01B11/00 , G01N21/88 , G01N21/93 , G01N21/956 , G01N23/04 , G01N23/18 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To highly precisely determine a cutting position of a ceramic laminate so as to precisely cut out the ceramic laminated by determining a cutting position for each sheet, even if there is dispersion such as deformation between the ceramic laminates. SOLUTION: A transmissive ray B is emitted to a plane of a ceramic laminate 1 by a beam emitting device 12. From an image of an inner electrode that is obtained from the transmissive ray B, a cutting position in an XY direction for cutting the ceramic laminate 1 is measured by an image analysis processing device 13. Then, a cutting device 15 is operated according to the measured data to cut the ceramic laminate 1 into ceramic laminate chips for respective components.

57. 发明专利

JPH10261545A CHIP-LIKE ELECTRONIC COMPONENT 失效
公开(公告)号：JPH10261545A
公开(公告)日：1998-09-29
申请号：JP8332597
申请日：1997-03-17
申请人： TDK CORP
发明人： YAGI HIROSHI
IPC分类号： H01C7/00 , H01G4/228 , H01G4/252 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To prevent the contamination, poor soldering, cracking, dropping, and damage by coating outer electrodes with a thermally sublimative or meltable thin film. SOLUTION: This electronic component body has many inner electrodes laminated and connected to end electrodes 10 in a dielectric 11. The electrode 10 has a Ni plated lower layer and Sn or solder plated upper layer to avoid producing fine powder (oxides etc.) of Sn or solder because of the exposed end electrodes 20. An inorg. or org. thin film 30 is formed to cover at least the surface of the electrodes 20.

58. 发明专利

JPH1056050A CLEAN TRANSFER METHOD, CLEAN BOX, AND CLEAN TRANSFER DEVICE 失效
公开(公告)号：JPH1056050A
公开(公告)日：1998-02-24
申请号：JP22328896
申请日：1996-08-07
申请人： TDK CORP
发明人： MASUJIMA MASARU , YAGI HIROSHI , MIYAUCHI EISAKU , MIYAJIMA TOSHIHIKO
IPC分类号： B65G49/00 , B65D81/20 , B65D85/86 , B65G49/07 , H01L21/02 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To realize a clean transfer method capable of transferring a work not only in a vacuum sealed state but also in the sealed state of the work in a clean gas such as nitrogen without using a mechanical seal where a spring or the like is used. SOLUTION: A clean box 11 which is equipped with a box main body 12 with an closable opening, a shutter/lid 13 that closes the opening of the box main body 12, and a lid chuck 14 that is sucked to both the box main body 12 and the lid 13 by vacuum suction to keep the shutter/lid 13 closed and a clean device 30 equipped with an opening which can be freely opened or closed by a shutter 45 are hermetically joined together keeping the lid 13 and the shutter 45 closed, wherein a hermetic space where both the shutter 45 and the lid 13 front and the lid chuck 14 is contained inside is formed, the hermetic space is exhausted, then the lid chuck 14 is unlocked, and the lid 13 is opened.

59. 发明专利

JPH08276414A CERAMIC PRINT COATING APPARATUS 失效
公开(公告)号：JPH08276414A
公开(公告)日：1996-10-22
申请号：JP8297195
申请日：1995-04-07
申请人： TDK CORP
发明人： KOBAYASHI AKIRA , ISHIGAKI TAKAYA , YAGI HIROSHI , SHIRAI SHIGEHIKO , TSUNODA EIZO , KANZAKI MINORU , ITO MASATOSHI , ABE TAKASHI
IPC分类号： B28B5/00 , H01G4/12 , H01G13/00
摘要： PURPOSE: To form a uniform green sheet which has small thickness irregularity by extruding ceramic paint containing specific concentration of ceramic power from a coating head to the one surface side of a running flexible support. CONSTITUTION: A coating head 10 coats the one surface side (a) of a flexible support 19 which runs in one direction F1 with ceramic paint 17a by extruding. Since the paint 17a contains 1 to 20vol.% of ceramic powder, its viscosity is extremely lower than that of the conventional ceramic paint, its drying shrinkage factor is large, and to obtain the same thickness after drying, the supplying amount can be increased. Thus, the gap between the end of the head 10 and the support 19 can be increased, and the streak due to the head 10 can be avoided. Since the coating thickness of the paint 17a can be increased, the peeling of a ceramic paint layer scarcely occurs, and a pinhole scarcely occurs.

60. 发明专利

JPH08139494A CHIP COMPONENT FEEDING DEVICE AND HOPPER USED FOR THE DEVICE 失效
公开(公告)号：JPH08139494A
公开(公告)日：1996-05-31
申请号：JP30441194
申请日：1994-11-14
申请人： TDK CORP
发明人： YAGI HIROSHI , ITO TSUYOSHI , ITO TETSURO
IPC分类号： B23P19/00 , B65B37/02 , B65G51/02 , B65G65/40 , H05K13/02
摘要： PURPOSE: To make it possible to use a feeding case intact for circulation of chip components as a container for housing and storing the chip components by a method wherein a hopper is constituted of the feeding case for housing the bulk-shaped chip components and a hopper base part and a feeding case part of a simple structure is formed in such a way as to be able to freely exchange. CONSTITUTION: A chip component feeding device is provided with a hopper 13, which consists of a feeding case 14 for housing chip components 20 and a hopper base part 15 which is mounted with the case 14 to vertically move, a separation alignment pipe 55 having a through hole of the form of a section, through which one piece of the chip components 20 in the base part 15 can pass, a circular arc-shaped component feeding path 52 with its one end, which is connected with the through hole formed in the pipe 55, and the other end, which reaches a component pickup position, and an alignment chute having a linear component feeding path 62.

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