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51. 发明专利

JP2001131409A FLAME-RETARDANT AROMATIC POLYAMIDE RESIN COMPOSITION 失效
公开(公告)号：JP2001131409A
公开(公告)日：2001-05-15
申请号：JP31788099
申请日：1999-11-09
申请人： OTSUKA CHEMICAL CO LTD
发明人： YABUHARA TADAO , TADA YUJI , NAKANO SHINJI , KAMESHIMA TAKASHI , NISHIOKA YOICHI , TAKASE HIROYUKI
IPC分类号： C08K3/22 , C08K5/5399 , C08K7/02 , C08K7/04 , C08L77/00 , C08L77/10 , C08L85/02
摘要： PROBLEM TO BE SOLVED: To impart an excellent flame-retardance to an aromatic polyamide resin without using any halogen compound which generates gas which is harmful to the human body and without deteriorating the desirable properties (mechanical properties, molding processibility, etc.), inherent in aromatic polyamide resins. SOLUTION: A flame-retardant aromatic polyamide resin composition is prepared by compounding (b) from 0.1 to 100 pts.wt. crosslinked phosphazen compound, (c) from 1 to 60 pts.wt. inorganic fibrous material and (d) from 1 to 60 pts.wt. magnesium hydroxide with (a) 100 pts.wt. aromatic polyamide resin.

52. 发明专利

JPH10298188A PHOSPHAZENE-BASED COMPOUND, FLAMEPROOFING AGENT AND FLAMEPROOFING METHOD USING THE SAME 失效
公开(公告)号：JPH10298188A
公开(公告)日：1998-11-10
申请号：JP11129697
申请日：1997-04-28
申请人： NIKKA CHEMICAL IND CO LTD , OTSUKA CHEMICAL CO LTD
发明人： IKEHATA KAZUHIKO , MIDORI KOJI , UCHIDA SHIGEJI , NAKANAGA TAKEFUMI , TADA YUJI
IPC分类号： C09K21/12 , C07F9/24 , C07F9/6581 , C07F9/6593 , D06M13/02 , D06M13/322 , D06M13/44 , D06M13/453 , D06M15/673
摘要： PROBLEM TO BE SOLVED: To obtain the subject new compound comprising a specific cyclic or straight chain phosphazene-based compound, capable of readily providing synthetic fibers with sufficiently durable flameproofness without using a halogen- based compound, useful as a flameproofing agent. SOLUTION: This phosphazene-based compound is shown by formula I [(n) is an integer of >=1; X is a 1-4C alkoxy or a phenoxy of formula II (R is H, a 1-4C alkyl or a 1-3C alkoxy); with the proviso that the whole Xs are neither alkoxy groups nor phenoxy groups] or a phenoxy of formula III [(m) is an integer of 0 or >=1; Y is a 1-4C alkoxy or a group of formula IV (R is as shown for R ); with the proviso that the whole Ys are neither alkoxy groups nor phenoxy groups] and is useful as a flameproofing agent for synthetic fibers, etc. The compound is obtained by reacting a cyclic dichlorosphazene compound or a straight chain dichlorophosphazene compound with an alkali metal phenoxide or an alkali metal alkoxide in a solvent.

53. 发明专利

JPH06236770A ORGANIC SOLID ELECTROLYTE AND ITS USE 失效
公开(公告)号：JPH06236770A
公开(公告)日：1994-08-23
申请号：JP4600493
申请日：1993-02-10
申请人： OTSUKA CHEMICAL CO LTD
发明人： TADA YUJI , NAKANAGA TAKEFUMI , KAMESHIMA TAKASHI , INUBUSHI AKIYOSHI
IPC分类号： H01B1/06 , H01M10/05 , H01M10/0565 , H01M10/40
摘要： PURPOSE:To provide an organic solid electrolyte showing high ion conductivity by cross-linking and hardening an electrolytic salt and an oligoethyleneoxy polyphosphagen having an aryl group which contains a solvent, or a mixture thereof. CONSTITUTION:Forty parts of oligoethyleneoxy polyphosphagen with an average molecular weight of about 500,000 which has an aryl group, 60 parts of propylene carbonate, and 10 parts of lithium perchlorate are subjected to ultrasonic treatment at 40 deg.C or lower to provide an electrolyte. This electrolyte is nipped in a transparent ITO electrode, the light of a 400W high voltage mercury lamp is emitted, and a cross-linking reaction of the polyphosphagen is conducted to form an electrolytic film having a cross-linking structure. It shows the AC conductivity value by composite impedance method of 3.2X10 S/cm (25 deg.C), and has a high ion conductivity by one figure, compared with an electrolyte containing no propylene carbonate.

54. 发明专利

JPH0570783A LUBRICATING OIL FOR REFRIGERATOR 失效
公开(公告)号：JPH0570783A
公开(公告)日：1993-03-23
申请号：JP26289591
申请日：1991-09-13
申请人： OTSUKA CHEMICAL CO LTD
发明人： NAKANAGA TAKEFUMI , TADA YUJI
IPC分类号： C10M105/74 , C10N40/30
摘要： PURPOSE:To provide a lubricating oil which can be suitably used for, e.g. a refrigerator using a substitute refrigerant. CONSTITUTION:A lubricating oil for a refrigerator, comprising a fluoroalkoxyphosphazene, i.e., a single compound of the formula or a mixture thereof. In the formula, the segment represented by (CF2CF2)m is a single segment comprising an integral multiple of the unit (CF2CF2) or a mixture of segments comprising integral multiples of the units, different in chain length wherein m=2 in the case of the single segment and 1.3 =h>=0, 2n>=k>=0, and 2n>=l>=0, provided that h+k+l=2n.

55. 发明专利

JPH04132161A THIN ELECTROCHEMICAL BATTERY 失效
公开(公告)号：JPH04132161A
公开(公告)日：1992-05-06
申请号：JP25307290
申请日：1990-09-21
申请人： OTSUKA CHEMICAL CO LTD , SHIN KOBE ELECTRIC MACHINERY
发明人： NAKANAGA TAKEFUMI , INUBUSHI AKIYOSHI , TADA YUJI , KAMESHIMA TAKASHI , HAYAKAWA TAKUMI , KOMAKI AKIO
IPC分类号： H01M2/34 , H01M6/16 , H01M6/18 , H01M10/05 , H01M10/058
摘要： PURPOSE:To obtain a battery with very little possibility of mistaking a positive electrode for a negative electrode and resultant misuse by covering the outer face of a battery main body with an electric insulating film, and removing the film into different shapes so that their polarities can be identified at a positive electrode terminal section and a negative electrode terminal section. CONSTITUTION:A polymer electrolyte film 3 is formed on the member of a positive electrode terminal section A. A lithium foil 4 is pressed at the center portion of a stainless foil 5, and a seal material 6 is coated on the peripheral sections of both stainless foils 1, 5 to form a negative electrode terminal section B. These members are stuck for vacuum sealing, and a unit cell (battery main body) C is assembled. The whole battery main body is covered with an electric insulating film 7, a plus-shaped removal portion 71 is provided at the portion of the film 7 corresponding to the positive electrode terminal section A to expose the stainless foil 1, and a minus-shaped removal portion 72 is provided at the portion corresponding to the negative electrode terminal section B to expose the stainless foil 5.

56. 发明专利

JPH048735A NON-FLOWABLE POLYMERIC ELECTROLYTE 失效
公开(公告)号：JPH048735A
公开(公告)日：1992-01-13
申请号：JP11246790
申请日：1990-04-26
申请人： OTSUKA CHEMICAL CO LTD , SHIN KOBE ELECTRIC MACHINERY
发明人： NAKANAGA TAKEFUMI , INUBUSHI AKIYOSHI , TADA YUJI , KAMESHIMA TAKASHI , TANIGUCHI MASATOSHI , HAYAKAWA TAKUMI , KOMAKI AKIO
IPC分类号： C08L85/02 , C08G79/02 , C08G79/025 , C08G79/04 , G09G3/16 , G09G3/19 , H01B1/06 , H01B1/12 , H01G9/022 , H01G9/025 , H01G9/028 , H01G9/15 , H01G11/54 , H01G11/56 , H01M6/18 , H01M8/10 , H01M10/05 , H01M10/0565
摘要： PURPOSE:To provide the subject electrolyte useful for all solid cells, etc., and capable of depressing the crystallization of the electrolyte at low temperature and holding the non-flowability thereof at high temperature by employing a medium comprising a specific phosphazene polymer containing a specific compound. CONSTITUTION:The objective electrolyte is made of a medium comprising a phosphazene polymer having segments of formulas I-VI (M is monovalent element selected from Li, Na, K, copper, silver and H; (h), (k) are the average repeat number (practical number value) of ethyleneoxide units under conditions of 0

57. 发明专利

JPS61252292A LWEIS ACID-RESISTANT LUBRICATING OIL 失效
公开(公告)号：JPS61252292A
公开(公告)日：1986-11-10
申请号：JP9429785
申请日：1985-04-30
申请人： AGENCY IND SCIENCE TECHN , OTSUKA CHEMICAL CO LTD
发明人： MURAMATSU HIROSHIGE , BABA HAJIME , NAKANAGA TAKEFUMI , TADA YUJI
IPC分类号： C10M105/74 , C10N30/12 , C10N40/00 , C10N40/30
摘要： PURPOSE:To prevent decomposition, denaturation, occurrence of toxic substance, etc., accompanying contact with a Lewis acid, by using a specific fluoroalkoxy cyclic phosphonitrile ester lubricating oil as a lubricating oil used for apparatus which are brought into contact with a Lewis acid. CONSTITUTION:Aapparatus such as a dry etching apparatus which are brought into contact with a Lewis acid can be stably operated for a long period of time by using a specific fluoroalkoxy cyclic phosphonitrile ester lubricating oil of the formula (wherein 1.3 =l>=0, 3

58. 发明专利

JP2005047995A Heat-resistant resin composition having improved flame retardancy and its utilization 审中-公开
标题翻译：具有改进的阻燃性的耐热树脂组合物及其应用
公开(公告)号：JP2005047995A
公开(公告)日：2005-02-24
申请号：JP2003204064
申请日：2003-07-30
申请人： Kaneka Corp , Otsuka Chemical Co Ltd , 大塚化学株式会社 , 株式会社カネカ
发明人： OKADA YOSHIFUMI , YAMANAKA TOSHIO , TANAKA SHIGERU , TADA YUJI
IPC分类号： B32B27/18 , B32B27/34 , C08K5/092 , C08K5/29 , C08K5/5399 , C08L63/00 , C08L79/08 , C08L85/02 , C09D5/25 , C09D179/08 , C09D183/10 , C09D185/02 , C09J179/08 , C09J183/10 , C09J185/02
摘要： PROBLEM TO BE SOLVED: To provide a heat-resistant resin composition which can sufficiently have both flame retardancy and various physical properties such as heat resistance, processability (including solubility in solvents) and dielectric characteristics, and can especially suitably be used for producing circuit boards capable of sufficiently corresponding to the improvement of information-treating ability in electronic equipment. SOLUTION: This heat-resistant resin composition comprises at least (A-1) a soluble polyimide resin exhibiting solubility in organic solvents and (B-1) a phenoxyphosphazene compound having a phenolic hydroxy group, and/or (B-2) a cross-linked phenoxyphosphazene compound prepared by cross-linking (B-1) the phenoxyphosphazene compound. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够充分地具有阻燃性和各种物理性能如耐热性，加工性（包括溶剂中的溶解性）和介电特性两者的耐热性树脂组合物，并且特别适合用于生产电路板，能够充分对应于电子设备信息处理能力的提高。解决方案：该耐热树脂组合物至少包含（A-1）在有机溶剂中具有溶解性的可溶性聚酰亚胺树脂和（B-1）具有酚羟基的苯氧基磷腈化合物和/或（B-2））通过交联（B-1）苯氧基磷腈化合物制备的交联的苯氧基磷腈化合物。版权所有（C）2005，JPO＆NCIPI

59. 发明专利

JP2005008835A Resin composition for encapsulation and encapsulated semiconductor device 审中-公开
标题翻译：用于封装和封装的半导体器件的树脂组合物
公开(公告)号：JP2005008835A
公开(公告)日：2005-01-13
申请号：JP2003177520
申请日：2003-06-23
申请人： Kyocera Chemical Corp , Otsuka Chemical Co Ltd , 京セラケミカル株式会社 , 大塚化学株式会社
发明人： DOI MASARU , TADA YUJI
IPC分类号： C08K3/00 , C08G59/62 , C08K5/5399 , C08L61/06 , C08L63/00 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To obtain a resin composition for encapsulation that does not contain in particular a halogen compound, a metal hydrate and a metallic compound such an antimony compound, a bismuth compound, hydrotalcites and has good flame retardancy, good moldability and good reliability, and to provide an encapsulated semiconductor device.
SOLUTION: The resin composition for encapsulation comprises (A) an epoxy resin, (B) a phenolic resin, (C) a crosslinking type phosphazene compound, (D) a cyclic compound represented by the formula (wherein R'' and R''' denote each independently an alkyl group, phenyl group, an arene group or hydrogen atom; and (α) denotes S, O or CH
2 ) and (E) an inorganic filler as essential components wherein the resin composition contains the crosslinking type phosphazene compound (C) in an amount of 0.5-30 wt%, the cyclic compound (D) in an amount of 0.05-10 wt% and the inorganic filler (E) in an amount of 40-95 wt%, based on the total of the composition. The encapsulated semiconductor device uses the resin composition for encapsulation.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：待解决的问题为了获得不特别包含卤素化合物，金属水合物和诸如锑化合物，铋化合物，水滑石的金属化合物并具有良好的阻燃性，良好的成型性的封装用树脂组合物并具有良好的可靠性，并提供封装的半导体器件。解决方案：用于封装的树脂组合物包括（A）环氧树脂，（B）酚醛树脂，（C）交联型磷腈化合物，（D）由下式表示的环状化合物（其中R“和 R“”各自独立地表示烷基，苯基，芳烃基或氢原子;（α）表示S，O或CH 2）和（E）无机填料作为必要成分其中所述树脂组合物含有量为0.5-30重量％的交联型磷腈化合物（C），所述环状化合物（D）的量为0.05-10重量％，无机填料（E）的量为40 -95重量％，基于组合物的总量。封装的半导体器件使用树脂组合物进行封装。版权所有（C）2005，JPO＆NCIPI

60. 发明专利

JP2004331787A Flame-retardant adhesive composition, flexible copper-clad laminated board, coverlay and adhesive film 审中-公开
公开(公告)号：JP2004331787A
公开(公告)日：2004-11-25
申请号：JP2003128761
申请日：2003-05-07
申请人： Kyocera Chemical Corp , Otsuka Chemical Co Ltd , 京セラケミカル株式会社 , 大塚化学株式会社
发明人： NAKAMI HIROAKI , TADA YUJI
IPC分类号： B32B15/088 , B32B15/08 , C09J11/06 , C09J163/00 , H05K1/02 , H05K3/00 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition having high flame retardancy without using a halogen, and excellent in heat resistance, break resistance, electrical insulation, etc., to provide a flexible copper-clad laminated board, coverlay and an adhesive film each using the composition, and to provide a flexible printed wiring board produced using them.
SOLUTION: The halogen-free flame-retardant adhesive composition essentially comprises (A) a methoxy group-containing silane-modified epoxy resin obtained by dealcoholization reaction between a bisphenol-type epoxy resin and a methoxysilane partial condensate, (B) a curing agent for epoxy resin, (C) a curing promoter, (D) an elastomer, (E) at least one phosphazene compound and (F) an inorganic filler, wherein the component D accounts for 5-80 wt.% of the whole adhesive composition.
COPYRIGHT: (C)2005,JPO&NCIPI

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