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51. 发明专利

JP2007103901A Light emitting device 有权
标题翻译：发光装置
公开(公告)号：JP2007103901A
公开(公告)日：2007-04-19
申请号：JP2006121326
申请日：2006-04-25
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： TANAKA KENICHIRO , HAYASHI TAKAO , YAMAZAKI KEIICHI , URANO YOJI
IPC分类号： H01L33/22 , H01L33/32 , H01L33/42 , H01L33/50 , H01L33/54 , H01L33/56 , H01L33/62
CPC分类号： H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To reduce a color irregularity by disposing, in piles on a light extraction side of an LED element, a sheet-like color conversion member which is excited by a light emitted from the LED element, and emits a light different from the luminescent color of the LED element.
SOLUTION: A light emitting device has the LED element 1 in which a light emitting unit 3 having a laminate structure of an n-type semiconductor layer 31, a light emitting layer 32, and a p-type semiconductor layer 33 is prepared in a conductive substrate 2 as a support substrate, and in which the conductive substrate 2 is opaque to the light emitted from the light emitting layer 32; a sheet-like wavelength conversion member (color conversion member) 5 which is disposed in piles on the light extraction side 1a of the LED element 1, excited by the light emitted from the LED element 1, and emits a light different from the emission peak wavelength of the LED element; and a packaging substrate 10 in which an LED unit A configured by the LED element 1 and the wavelength conversion member 5 are mounted in one front surface side. The wavelength conversion member 5 is formed in the substantially the same flat surface size as the LED element 1, and is adhered to the light extraction side 1a of the LED element 1 by using light-transmissive materials, such as a silicone resin, etc.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了通过在LED元件的光提取侧的堆中设置由从LED元件发射的光而被激发的片状颜色转换构件来减少颜色不均匀，并且发射与LED元件的发光颜色不同的光。解决方案：一种发光器件具有LED元件1，其中制备具有n型半导体层31，发光层32和p型半导体层33的叠层结构的发光单元3 在作为支撑基板的导电基板2中，导电基板2对从发光层32发射的光不透明; 设置在LED元件1的光提取侧1a的堆叠中的片状波长转换构件（颜色转换构件）5，被从LED元件1发射的光激发，并且发射与发光峰不同的光 LED元件的波长; 以及其中由LED元件1和波长转换构件5构成的LED单元A安装在一个前表面侧的封装基板10。波长转换构件5形成为与LED元件1大致相同的平坦表面尺寸，并且通过使用诸如硅树脂等的透光材料粘附到LED元件1的光提取侧1a。版权所有（C）2007，JPO＆INPIT

52. 发明专利

JP2007088094A Light-emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2007088094A
公开(公告)日：2007-04-05
申请号：JP2005272871
申请日：2005-09-20
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： KAMATA SAKUO , NISHIOKA YASUSHI , URANO YOJI
IPC分类号： H01L33/50 , H01L33/62
CPC分类号： H01L2224/73265 , H01L2924/19107
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device that can improve reliability and reduce color irregularities.
SOLUTION: The light-emitting device includes a reflector 40 for surrounding an LED chip at the packaging surface side of the LED chip 10 in a packaging substrate 20; a sealing section 50 for sealing the LED chip 10 and bonding wires 14, 14 connected to the LED chip inside the reflector; and a dome-like color conversion member 70 that is a molding in which a yellow phosphor excited by blue light radiated from the LED chip 10 is formed with a transparent material and forms an air layer 80 at an area to the sealing section 50 stuck to the reflector 40.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供可以提高可靠性并减少颜色不规则性的发光装置。解决方案：发光器件包括用于在封装衬底20中的LED芯片10的封装表面侧处围绕LED芯片的反射器40; 用于密封LED芯片10和连接到反射器内部的LED芯片的接合线14,14的密封部分50; 以及圆顶状的颜色转换部件70，其是由LED芯片10辐射的由蓝色光激发的黄色荧光体由透明材料形成的模制品，并且在密封部分50的区域形成空气层80 反光镜40.版权所有（C）2007，JPO＆INPIT

53. 发明专利

JP2007088093A Light-emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2007088093A
公开(公告)日：2007-04-05
申请号：JP2005272870
申请日：2005-09-20
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： KAMATA SAKUO , NISHIOKA YASUSHI , URANO YOJI
IPC分类号： H01L33/50 , H01L33/58 , H01L33/62
CPC分类号： H01L2224/73265 , H01L2924/19107
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device that can improve reliability and directivity and reduces its height by restraining height dimensions.
SOLUTION: The light-emitting device includes a reflector 40 for surrounding an LED chip at the packaging surface side of the LED chip 10 in a packaging substrate 20; a sealing section 50 for sealing the LED chip 10 and bonding wires 14, 14 connected to the LED chip inside the reflector; a Fresnel lens 60 arranged while being overlapped to the sealing section 50 and the reflector 40; and a cylindrical color conversion member 70 that is a molding in which a yellow phosphor excited by blue light radiated from the LED chip 10 is formed with a transparent material, covers the Fresnel lens 60 at the packaging surface side of the packaging substrate 20, and is arranged so that an air layer 80 is formed at an area to a light emission surface 60b of the Fresnel lens. The sealing section 50 is formed by filling a silicone resin inside the reflector 40.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以通过限制高度尺寸来提高可靠性和方向性并降低其高度的发光装置。解决方案：发光器件包括用于在封装衬底20中的LED芯片10的封装表面侧处围绕LED芯片的反射器40; 用于密封LED芯片10和连接到反射器内部的LED芯片的接合线14,14的密封部分50; 布置在与密封部分50和反射器40重叠的菲涅尔透镜60; 以及由透明材料形成由LED芯片10照射的被蓝色光激发的黄色荧光体的成型体的筒状色彩转换部件70覆盖在封装基板20的封装面侧的菲涅尔透镜60，被布置成使得空气层80形成在菲涅耳透镜的发光表面60b的区域处。密封部分50通过在反射器40内部填充硅树脂形成。版权所有：（C）2007，JPO＆INPIT

54. 发明专利

JP2007088087A Light-emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2007088087A
公开(公告)日：2007-04-05
申请号：JP2005272863
申请日：2005-09-20
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： KAMATA SAKUO , NISHIOKA YASUSHI , URANO YOJI
IPC分类号： H01L33/50 , H01L33/56 , H01L33/58 , H01L33/62
CPC分类号： H01L2224/73265 , H01L2924/19107
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device having a small restriction by wiring and a high flexibility in layout.
SOLUTION: The light-emitting device includes an LED chip 10; a packaging substrate 20 where the LED chip 10 is packaged; a frame 40 made of a transparent resin material for surrounding the LED chip 10 at the packaging surface side of the LED chip 10 in the packaging substrate 20; and a sealing section 50 that is formed by filling a transparent resin material to the inside of the frame, and seals the LED chip and a bonding wire 14 connected to the LED chip. A lead pattern 23 that is electrically connected to the electrode of the LED chip 10 via the bonding wire 14 and is extended to the edge is formed on the surface of an insulating member 22 for composing the packaging substrate 20, and a connection section 23c where a connector 120 is electrically connected to the extended edge of the lead pattern 23 is provided.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种布线限制小且布局灵活性高的发光装置。解决方案：发光装置包括LED芯片10; 包装基板20，其中封装有LED芯片10; 由透明树脂材料制成的框架40，用于在封装基板20中的LED芯片10的封装表面侧包围LED芯片10; 以及密封部50，其通过将透明树脂材料填充到框架的内部而形成，并且密封LED芯片和连接到LED芯片的接合线14。在用于构成封装基板20的绝缘构件22的表面上形成有通过接合线14电连接到LED芯片10的电极并延伸到边缘的引线图案23和连接部23c，连接器120电连接到引线图案23的延伸边缘。版权所有（C）2007，JPO＆INPIT

55. 发明专利

JP2007088085A Light-emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2007088085A
公开(公告)日：2007-04-05
申请号：JP2005272861
申请日：2005-09-20
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： KAMATA SAKUO , NISHIOKA YASUSHI , URANO YOJI
IPC分类号： H01L33/32 , H01L33/50 , H01L33/56 , H01L33/58 , H01L33/62
CPC分类号： H01L2224/73265 , H01L2924/19107
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device capable of radiating white light by using a single LED chip.
SOLUTION: The light-emitting device includes an LED chip 10 for radiating blue light; a packaging substrate 20 where the LED chip 10 is packaged; a frame 40 for surrounding the LED chip 10 at the packaging surface side of the LED chip 10 in the packaging substrate 20; a sealing section 50 that is formed by filling a transparent resin material to the inside of the frame, seals the LED chip 10 and bonding wires 14, 14 connected to the LED chip, and is elastic; and a dome-like color conversion member 70 that is a molding in which a yellow phosphor (YAG) excited by light radiated from the LED chip 10 and radiating yellow broad light is formed with a transparent material.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够通过使用单个LED芯片来发出白光的发光装置。解决方案：发光装置包括用于发射蓝光的LED芯片10; 包装基板20，其中封装有LED芯片10; 用于在封装基板20中的LED芯片10的封装表面侧包围LED芯片10的框架40; 通过将透明树脂材料填充到框架的内部而形成的密封部50密封LED芯片10和连接到LED芯片的接合线14,14，并且是弹性的; 以及作为模制品的圆顶状颜色转换部件70，其中由透光材料形成由LED芯片10辐射的光激发的黄色荧光体（YAG）并且发射黄色宽光。版权所有（C）2007，JPO＆INPIT

56. 发明专利

JP2007088083A Light-emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2007088083A
公开(公告)日：2007-04-05
申请号：JP2005272859
申请日：2005-09-20
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： KAMATA SAKUO , NISHIOKA YASUSHI , URANO YOJI
IPC分类号： H01L33/32 , H01L33/50 , H01L33/54 , H01L33/56 , H01L33/62
CPC分类号： H01L2224/73265 , H01L2924/19107
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device capable of radiating white light by using a single LED chip.
SOLUTION: The light-emitting device includes an LED chip 10 for radiating blue light; a packaging substrate 20 where the LED chip 10 is packaged; a frame 40 for surrounding an LED chip 10 at the packaging surface side of the LED chip 10 in the packaging substrate 20; a sealing section 50 that is formed by filling a transparent resin material to the inside of the frame, seals the LED chip and bonding wires 14, 14 connected to the LED chip, and is elastic; and a dome-like color conversion member 70 that is a molding in which a yellow phosphor that excited by light radiated from the LED chip 10 and radiates yellow broad light is formed with a transparent material.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够通过使用单个LED芯片来发出白光的发光装置。解决方案：发光装置包括用于发射蓝光的LED芯片10; 包装基板20，其中封装有LED芯片10; 用于在封装基板20中的LED芯片10的封装表面侧周围包围LED芯片10的框架40; 通过将透明树脂材料填充到框架的内部而形成的密封部50密封连接到LED芯片的LED芯片和接合线14,14，并且是弹性的; 以及作为模制品的圆顶状颜色转换构件70，其中由透明材料形成由从LED芯片10辐射的光激发并发出黄色宽光的黄色荧光体。版权所有（C）2007，JPO＆INPIT

57. 发明专利

JP2007088079A Light emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2007088079A
公开(公告)日：2007-04-05
申请号：JP2005272848
申请日：2005-09-20
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： URANO YOJI
IPC分类号： H01L33/32 , H01L33/34 , H01L33/56 , H01L33/58
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device in which a wiring path for power supply can be connected efficiently. SOLUTION: A lead pattern 23 has a portion not covered with a color converting member 70 serving as an outer lead portion 23b, and joints 23c and 23c having a substantially circular plan view are formed at the distal ends of the outer lead portion 23b extended up to the end portion (corner portion) of an insulating member 22. A lead wire 110 for wiring is solder bonded to these joints 23c and 23c. Since the joints 23c and 23c of the lead pattern 23 are provided at the end portion of the insulating member 22 projecting to the outside of a metal plate 21, heat applied during solder bonding is prevented from being discharged through the metal plate 21 and thereby the lead wire 110 can be connected efficiently. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供可以有效地连接电源用布线路径的发光装置。解决方案：引线图案23具有未被作为外部引线部分23b的颜色转换部件70覆盖的部分，并且具有大致圆形平面图的接头23c和23c形成在外部引线部分的远端 23b延伸到绝缘构件22的端部（角部）。用于布线的引线110焊接到这些接头23c和23c上。由于引线图案23的接头23c和23c设置在绝缘构件22的向金属板21的外侧突出的端部，所以防止在焊接期间施加的热量通过金属板21而被排出，可以有效地连接引线110。版权所有（C）2007，JPO＆INPIT

58. 发明专利

JP2007088077A Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：JP2007088077A
公开(公告)日：2007-04-05
申请号：JP2005272845
申请日：2005-09-20
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： KAMATA SAKUO , NISHIOKA YASUSHI , URANO YOJI
IPC分类号： H01L33/32 , H01L33/34 , H01L33/50 , H01L33/56 , H01L33/58
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device for reducing light extraction loss. SOLUTION: The light-emitting device 1 includes an LED chip 10 and a packaging substrate 20 where the LED chip 10 is packaged. The packaging substrate 20 comprises a metal plate 21 where the LED chip 10 is mounted; and an insulating base material 22 that is laminated at the non-mount part of the LED chip 10 in the metal plate 21 and forms a lead pattern 23 electrically connected to the electrode of the LED chip 10 on a surface at a side opposite to the metal plate 21. A projecting base part 21a where the LED chip 10 is mounted on a tip surface while projecting to the side of the LED chip 10 is provided at the packaging part of the LED chip 10 in the metal plate 21, and the amount of projection of the projecting base part 21a is set to dimensions, where the thickness of the insulating base material 22 is added to that of the lead pattern 23, or higher. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于降低光提取损失的发光装置。解决方案：发光装置1包括LED芯片10和封装基板20，LED芯片10被封装在其中。封装基板20包括安装有LED芯片10的金属板21; 以及在金属板21中的LED芯片10的非安装部分层叠的绝缘基材22，并且在与LED芯片10的相反侧的表面上形成与LED芯片10的电极电连接的引线图案23。金属板21.在金属板21的LED芯片10的封装部设置有突出于LED芯片10侧的LED芯片10安装在前端面的突出基部21a，将突起基部21a的突出部的尺寸设定为绝缘基材22的厚度与引线图案23的厚度相加的尺寸。版权所有（C）2007，JPO＆INPIT

59. 发明专利

JP2007088075A Light-emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2007088075A
公开(公告)日：2007-04-05
申请号：JP2005272840
申请日：2005-09-20
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： KAMATA SAKUO , NISHIOKA YASUSHI , URANO YOJI
IPC分类号： H01L33/32 , H01L33/54 , H01L33/56 , H01L33/60
CPC分类号： H01L2224/48091 , H01L2224/73265 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device that has a small number of members and high light extraction efficiency to the outside.
SOLUTION: The light-emitting device includes an LED chip 10; a packaging substrate 20 where the LED chip is packaged; a frame-like reflector 40 that surrounds the LED chip at the packaging surface side of the LED chip 10 on the packaging substrate and reflects light radiated from the LED chip 10; and a sealing section 50 that fills a transparent resin material inside the reflector for formation, seals the LED chip 10 and bonding wires 14, 14 connected to the LED chip, and is elastic. Then, the sealing section is formed in the shape of a convex lens by a silicone resin.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有少数构件并且对外部具有高光提取效率的发光装置。解决方案：发光装置包括LED芯片10; 包装基板20，其中封装有LED芯片; 在包装用基板上的LED芯片10的封装面侧包围LED芯片并反射从LED芯片10照射的光的框状反射体40; 以及填充用于形成的反射体内部的透明树脂材料的密封部50，密封LED芯片10和与LED芯片连接的接合线14,14，并且是弹性的。然后，通过硅树脂将密封部形成为凸透镜的形状。版权所有（C）2007，JPO＆INPIT

60. 发明专利

JP2007088072A Light-emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2007088072A
公开(公告)日：2007-04-05
申请号：JP2005272837
申请日：2005-09-20
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： KAMATA SAKUO , NISHIOKA YASUSHI , URANO YOJI
IPC分类号： H01L33/32 , H01L33/36 , H01L33/50 , H01L33/56 , H01L33/58 , H01L33/62
CPC分类号： H01L2224/73265 , H01L2924/19107
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device for reducing variations in the color of generated light and reducing height by restraining height dimensions. SOLUTION: The light-emitting device includes an LED chip 10; a packaging substrate 20 where the LED chip 10 is packaged; a frame 40 for surrounding the LED chip 10 at the packaging surface side of the packaging substrate 20; a sealing section 50 that is formed by filling a transparent silicon resin to the inside of the frame, seals the LED chip 10 and bonding wires 14, 14, and is elastic; a Fresnel lens 60 arranged while being overlapped to the sealing section 50; and a cylindrical color conversion member 70 that is a molding in which a phosphor excited by light radiated from the LED chip and radiates light with a color differing from the luminescent color of the LED chip is formed with a transparent material, covers the Fresnel lens at the side of a light emission surface 60b of the Fresnel lens 60, and is arranged while an air layer 80 is formed between the light emission surface and the frame 40. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过抑制高度尺寸来减少产生的光的颜色变化并降低高度的发光装置。解决方案：发光装置包括LED芯片10; 包装基板20，其中封装有LED芯片10; 用于围绕包装基板20的包装表面侧的LED芯片10的框架40; 通过将透明硅树脂填充到框架的内部而形成的密封部50，密封LED芯片10和接合线14,14，并且具有弹性; 布置在与密封部分50重叠的菲涅尔透镜60; 以及作为模制品的圆柱形颜色转换构件70，其中由透明材料形成由LED芯片辐射的光激发的荧光体并且以与LED芯片的发光颜色不同的颜色发光的成型体覆盖菲涅尔透镜菲涅尔透镜60的发光表面60b的一侧，并且在发光表面和框架40之间形成空气层80时布置。（C）2007年，JPO和INPIT

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