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    • 55. 发明专利
    • Solid electrolytic capacitor and its manufacturing method
    • 固体电解电容器及其制造方法
    • JP2006196498A
    • 2006-07-27
    • JP2005003573
    • 2005-01-11
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • AKAMI KENJIKAWACHI AYUMITAKAGI SEIJIHAYASHI CHIHARUYOSHINO TAKESHI
    • H01G9/08H01G9/00
    • PROBLEM TO BE SOLVED: To provide a highly reliable solid electrolytic capacitor where conductive polymer is set to solid electrolyte, by solving the problem that conductive polymer is oxidized and deteriorated and vicinity of an anode oxide film corrodes due to oxygen and moisture which invade from outside, and that a capacitor characteristic is deteriorated.
      SOLUTION: The capacitor is provided with a capacitor element 1 where an anode and a cathode are formed with conductive polymer as solid electrolyte, a metallic cathode case 10 where the cathode of the capacitor element 1 is electrically connected and stored, and a metallic anode case 13 which electrically connects and stores the anode of the capacitor element 1 and is connected to the cathode case 10 in an insulated state. Invasion of oxygen and moisture from outside is inhibited, and oxidization and deterioration of conductive polymer and corrosion of vicinity of the anode oxide film are eliminated. Superior reliability without deterioration of the capacitor characteristic can be displayed. The capacitor can be miniaturized and cost can be reduced.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:为了提供将导电性聚合物设置为固体电解质的高可靠性的固体电解电容器,通过解决导电性聚合物被氧化和劣化的问题,并且阳极氧化物膜的附近由于氧气和水分而被腐蚀 从外部入侵,电容器特性劣化。 解决方案:电容器设置有电容器元件1,其中阳极和阴极由导电聚合物形成为固体电解质,电容器元件1的阴极电连接并存储的金属阴极壳体10,以及 金属阳极壳体13,其电连接并存储电容器元件1的阳极,并且在绝缘状态下连接到阴极壳体10。 抑制了外界氧气和水分的侵入,消除了导电聚合物的氧化和劣化以及阳极氧化膜附近的腐蚀。 可以显示优异的可靠性,而不会降低电容器特性。 电容器可以小型化并且可以降低成本。 版权所有(C)2006,JPO&NCIPI
    • 56. 发明专利
    • Electrode manufacturing method and solid electrolytic capacitor manufacturing method
    • 电极制造方法和固体电解电容器制造方法
    • JP2005136163A
    • 2005-05-26
    • JP2003370386
    • 2003-10-30
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • KAWACHI AYUMITAKAGI SEIJIMIDO YUJI
    • H01G9/052H01G9/00H01G9/012
    • PROBLEM TO BE SOLVED: To provide an electrode manufacturing method and a solid electrolytic capacitor manufacturing method by which electrostatic capacity can be kept constant and the accuracy of the thickness of a solid electrolytic capacitor can be also improved, by making a valve metal porous material as an electrode uniform in thickness in the manufacturing method for a number of solid electrolytic capacitors. SOLUTION: Valve metal powder paste is put into a mold 21 matching valve metal foil 1 with an optional uniform width, and dried. Then, the dried valve metal powder paste 22 and the valve metal foil 1 are press-fitted in a manner to cover one surface or both surfaces of the valve metal foil 1, and they are sintered to make an electrode. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:为了提供电极制造方法和固体电解电容器制造方法,通过使电极制造方法和固体电解电容器制造方法能够使静电电容保持恒定,并且还可以提高固体电解电容器的厚度精度, 在多种固体电解电容器的制造方法中,多孔材料作为电极厚度均匀。

      解决方案:将阀金属粉末浆料放入具有任选均匀宽度的匹配阀金属箔1的模具21中并干燥。 然后,将干燥的阀金属粉末膏22和阀金属箔1以覆盖阀金属箔1的一个表面或两个表面的方式压配合,并进行烧结以制成电极。 版权所有(C)2005,JPO&NCIPI

    • 60. 发明专利
    • REGULATOR FOR POWER SUPPLY
    • JP2002299159A
    • 2002-10-11
    • JP2001103236
    • 2001-04-02
    • MATSUSHITA ELECTRIC IND CO LTD
    • FUJII TATSUOTAKAGI SEIJIMIDO YUJIKIMURA RYOTAKAHASHI HIROSHI
    • H01G4/38H01G9/012H01G9/052
    • PROBLEM TO BE SOLVED: To provide a small-sized regulator for a power supply, which has a capacitor part constituted of a solid state electrolytic capacitor which can be directly and electrically connected with a semiconductor component via a connection bump and is superior in high frequency responsiveness, mounting property and productivity. SOLUTION: Dielectrics coating films 2, solid-state electrolyte layers 3 and current collector layers 4 are formed on porous surfaces of valve metal sheet bodies 1 and are covered with insulating layers 9, and a first capacitor part 14 and a second capacitor part 15 composed of them are formed; the second capacitor part 15 which is arranged so as to be electrically insulated on the same surface, on which the first capacitor part 14 is arranged, and a current collector layer 10 which is electrically connected with the first capacitor part 14 and the second capacitor part 15 are installed on the same surface; and the valve metal sheet body 1 of the first capacitor part 14 is electrically connected with the semiconductor component 8 via a connection bump 11, and the valve metal sheet body 1 of the second capacitor part 15 is electrically connected with the semiconductor component 8 via the connection bump 11.