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    • 52. 发明专利
    • MAGNETOSTATIC-WAVE MICROWAVE ELEMENT
    • JPS62101012A
    • 1987-05-11
    • JP23858685
    • 1985-10-26
    • HITACHI METALS LTD
    • KUROSAWA HISAOTAKEDA SHIGERU
    • H01F41/28C30B29/28H01P1/215H01P7/00
    • PURPOSE:To obtain a magnetostatic-wave microwave element using a YIG single crystal thin-film containing Pb for simultaneously making a change into a thick-film and low DELTAH (ferromagnetic resonance half-value width) compatible by mixing Pb contained in flux mainly comprising PbO-B2O3 into the single crystal film. CONSTITUTION:A gadolinium.gallium.garnet single crystal substrate is used, a single crystal film mainly comprising yttrium.iron.garnet is grown on the substrate through a liquid-phase epitaxial method while Pb contained in flux mainly comprising PbO-B2O3 is mixed into the single crystal film, and an LPE single crystal film in which the content of Pb is kept within a range of 1wt% or 2.25wt%, the lattice constant of the substrate is made larger than that of the formed single crystal film and the difference of these lattice constants is brought to 9X10 Angstrom or less is employed. According to this invention, a YIG thick-film having low DELTAH can be formed by positively utilizing the mixing of Pb into flux even when No.5 additional element is not used actively with the exception of Fe, Y, Pb and B, thus manufacturing a magnetostatic-wave microwave element having low loss by employing the YIG thick-film.
    • 56. 发明专利
    • Working method of crystal
    • 晶体工作方法
    • JPS58215625A
    • 1983-12-15
    • JP9827282
    • 1982-06-08
    • Hitachi Metals Ltd
    • NOJIYOU YASUOKUROSAWA HISAO
    • C30B33/00G02F1/00G02F1/11
    • G02F1/0018
    • PURPOSE:To recognize the relation between the cutting position of crystal and the position of a wafer before work by forming the 2nd orientation flat in a different direction from the 1st orientation flat and varying its width continuously in a crystal growth axis direction. CONSTITUTION:The shoulder part 7 and part Tail 8 of LiTaO3 single crystal 6 are cut in an X-axis direction to form a boule 9. A specific flank of this boule 9 is ground by a specific extent (width l3) to form the 1st orientation flat 2. Then, the boule 9 is rotated around its center axis by a specific angle and only the end part of the part Tail 8 is installed at specific height and ground more than the 1st orientation flat 2 to form the 2nd orientation flat 5. Then, the body boule 9 having those flats 2 and 5 is cut to a specific thickness at right angles to an X axis. The widths l1 and l2 of the orientation flat 5 of the wafter are not equal, so the correspondence to the position of the crystal is obtained by its length. Thus, the relation between the cutting position of the crystal and the position of the wafer before the work is known.
    • 目的:通过在与第一取向平面不同的方向上形成第二取向平面并且在晶体生长轴方向上连续地改变其宽度来识别晶体的切割位置与晶片的位置之间的关系。 构成:将LiTaO3单晶6的肩部7和部分尾部8沿X轴方向切割以形成圆棒9.将该毛坯9的特定侧面以特定程度(宽度13)研磨以形成第1 定向平面2.然后,将毛坯9围绕其中心轴线旋转一定角度,并且仅将部件尾部8的端部安装在特定高度并且比第一定向平面2多的地面以形成第二定向平面5 然后,将具有这些平板2和5的主体坯料9切割成与X轴成直角的特定厚度。 散片的定向平面5的宽度l1和l2不相等,因此与晶体位置的对应关系是通过其长度获得的。 因此,已知晶体的切割位置与工件前的晶片的位置之间的关系。
    • 57. 发明专利
    • MAGNETORESISTANCE EFFECT TYPE MAGNETIC HEAD
    • JPH1186223A
    • 1999-03-30
    • JP23790897
    • 1997-09-03
    • HITACHI METALS LTD
    • KUROSAWA HISAO
    • G11B5/39
    • PROBLEM TO BE SOLVED: To obtain a highly reliable head having a highly corrosion-resistive conductive lead by providing the conductive lead of WCr alloy, specifying a composition ratio of W and Cr, and preferably forming an alloy film including mainly metallic Cr or Cr as an undercoat film of the conductive lead consisting of the WCr alloy. SOLUTION: The composition ratio of a conductive lead 9 of WCr alloy is 2-50 at.% of Cr and the remaining at.% of W. A content of the Cr is suitably selected with an aim to increase corrosion resistance and adhesion. The corrosion resistance cannot be expected to be improved so much if the content of the Cr is smaller than 2 at.%. An advantage of a small specific resistance of the W cannot be utilized fully if the content of the Cr exceeds 50 at.%. Impurities generally mixed in the W and Cr are allowed so long as the specific resistance of the WCr alloy is not increased. An alloy film including mainly metallic Cr or Cr as an undercoat film 2 of the conductive lead 9 improves the adhesion.
    • 60. 发明专利
    • MANUFACTURE OF MAGNETORESISTANCE EFFECT ELEMENT
    • JPH07321386A
    • 1995-12-08
    • JP10956994
    • 1994-05-24
    • HITACHI METALS LTD
    • KUROSAWA HISAOTEJIMA HIROYUKIMITSUMATA CHIHARU
    • G01R33/09G11B5/39H01L43/12
    • PURPOSE:To increase the rate of change in electric resistance of a ferromagnetic thin film (single layer film of NiFe) by particularizing the amount of O2 contained in the ferromagnetic thin film having a magnetoresistance effect formed by sputtering method. CONSTITUTION:After venting a substrate 28 (30) in a sample exchange chamber 10, the substrate is brought to a film forming chamber 12 through a door valve 14 and is fixed at the position opposite to a target 24. At this time, the film forming chamber 12 is already vented almost the same degree as the sample exchange chamber's, so that atmospheric air does not enter directly the film forming chamber 12 even by opening the door valve. After forming a single layer thin film of NiFe on the substrate 28 (30), the substrate 28 (30) is returned to a sample exchange chamber 10 through the door valve 14 again, the door valve is closed, then the simple exchange chamber 10 is recovered to the atmospheric pressure by a valve 36, and the substrate 28 (30) with a film formed is taken out. Moreover, the film forming chamber 12 is directly exhausted by a cryopump 20, so that water vapor and the like can be fully removed, the possibility of mixing-in of O2 can be restricted to a minimum, and the content of O2 in ferromagnetic thin film can be made less than 150ppm.