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51. 发明专利

JPH02166620A METHOD AND DEVICE FOR DETECTING RECORDED SECTOR IN OPTICAL DISK 失效
公开(公告)号：JPH02166620A
公开(公告)日：1990-06-27
申请号：JP32067188
申请日：1988-12-21
申请人： HITACHI LTD , HITACHI VIDEO ENG
发明人： KUROKAWA MITSUO , TAKEUCHI SO , MATSUNAGA TOSHIHIRO
IPC分类号： G11B7/00 , G11B7/0045 , G11B7/005
摘要： PURPOSE:To obtain detecting method and device with high reliability for the defect of a disk or nonuniformity in reflectance, etc., by detecting the mirror plane level of a reproducing RF signal and the maximum level in data of one byte, performing judgement whether or not a sector is already recorded for plural times setting the difference of both levels as reference. CONSTITUTION:Since the detection of the mirror plane level of a digitized reproducing RF signal is performed in a servo mark 203 separated physically from a data part 204, no influence of the defect of the disk in the data part 204 and the signal of the data part 204 is given. Also, since the value of the mirror plane level is updated at every servo mark 203, it is performed within 16 bytes after the detection of the maximum level in the data of one byte of the digitized reproducing RF signal. Furthermore, even when the defect of the disk exists in the data part 204 or the servo mark 203,, it is checked whether or not the difference of both levels shows a prescribed level for plural times, and when the number of times in which the difference of both levels exceeds the prescribed level exceeds a prescribed number of times, it is judged as a recorded sector. In such a way, high reliability for the detection of the recorded sector.

52. 发明专利

JPH0287537A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0287537A
公开(公告)日：1990-03-28
申请号：JP23876188
申请日：1988-09-26
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： TANAKA AKIRA , MATSUNAGA TOSHIHIRO , SHIRAI MASAYUKI
IPC分类号： H01L23/36 , H01L21/60
摘要： PURPOSE:To effectively dissipate the heat generated by a chip, and obtain a semiconductor device capable of arranging a high power semiconductor chip by installing a dummy pad on a semiconductor chip, and connecting the dummy pad and a dam by using wires for heat radiation use. CONSTITUTION:On a semiconductor chip 3, a dummy pad 3b is arranged, which is connected with a dam 14 by using wires 8 for heat radiation use. The heat generated by the semiconductor chip 3 is delivered to the dam 14, without being stored in chip coat material 6. In virtue of this action, the heat generated from the chip 3 is effectively radiated in the air from the dam 14. Thereby, a high power semiconductor chip can be arranged.

53. 发明专利

JPS63144425A FOCUS LEADING-IN CIRCUIT FOR OPTICAL DISK DEVICE 失效
公开(公告)号：JPS63144425A
公开(公告)日：1988-06-16
申请号：JP28997986
申请日：1986-12-05
申请人： HITACHI LTD , HITACHI VIDEO ENG
发明人： TAKEDA KATSUMI , MATSUNAGA TOSHIHIRO , SAITO TADASHI
IPC分类号： G11B7/085
摘要： PURPOSE:To prevent such a malfunction as a focus leads in on a protective layer surface of a disk, by constituting the titled circuit so that a focus can be locked from a rise signal or a fall signal immediately after having passed through the last signal area which can lead in, of a focus servo-system appearing in a reflected signal from the protective layer surface of the disk. CONSTITUTION:The titled circuit is provided with comparator circuits 18, 19 for detecting a light beam reflecting signal A from a disk protective layer surface, generated at the time of focus lead-in. Outputs B, C of these comparators are further led to a focus lockable range setting means, for instance, a flip-flop circuit 20 or a microcomputer, and by a rise signal or a fall signal immediately after having passed through the last signal area which can execute a focus lock, in the reflected signal from the disk protective layer surface, an output state of the flip-flop circuit 20 or the microcomputer is inverted. Subsequently, by receiving this state, a focus leading-in circuit becomes operable. In such a way, it does not occur that a focus servo leads in on the disk protective layer surface.

54. 发明专利

JPS62293365A DATA TRANSFER SYSTEM 失效
公开(公告)号：JPS62293365A
公开(公告)日：1987-12-19
申请号：JP13389686
申请日：1986-06-11
申请人： HITACHI LTD , HITACHI VIDEO ENG
发明人： ITO TAMOTSU , MASUBUCHI SHINICHI , MATSUNAGA TOSHIHIRO
IPC分类号： G06F13/14 , G06F13/38
摘要： PURPOSE:To transfer data between internal and external input/output devices just with one instruction by arranging the internal input/output device in an input/output address space and an internal memory and the external input/output device in a memory address space respectively. CONSTITUTION:When a CPU 1 outputs an IORD signal, an address decoder part 6 activates a CS for an internal input/output device 3 since the device 3 is set at a prescribed input/output address by the part 6. Thus data are read out of the device 3. Then the CPU 1 outputs a MEWR signal to an interface 4 and then a prescribed address signal to a memory address decoder 7 via signal lines A14 and 15 respectively. An internal memory 2 and an external input/output device 5 are set at each prescribed memory address by the decoder 7. Therefore, the decoder 7 activates a SEL of an interface 4 when a prescribed address signal is supplied for selection of the device 5. Thus data are written into the device 5 from the device 3 via the interface 4.

55. 发明专利

JP2009303233A Method for recording, apparatus for recording, method for reproducing, and apparatus for reproducing 有权
标题翻译：记录方法，记录装置，再生方法和再生装置
公开(公告)号：JP2009303233A
公开(公告)日：2009-12-24
申请号：JP2009186222
申请日：2009-08-11
申请人： Hitachi Advanced Digital Inc , Hitachi Ltd , 株式会社日立アドバンストデジタル , 株式会社日立製作所
发明人： SATO YASUHIRO , ODA TOSHIYUKI , HARUNA TOMOMI , TAKEUCHI TAKASHI , KADOMA JUNYA , MATSUNAGA TOSHIHIRO
IPC分类号： H04N5/93 , G11B20/10 , G11B27/00 , G11B27/034 , H04N5/91
摘要： PROBLEM TO BE SOLVED: To provide a method of producing a dynamic-image stream capable of performing the combined reproduction of a dynamic image, and at the same time materializing a branched reproduction during performing the combined reproduction.
SOLUTION: A data stream forming means of a multi-media data recording apparatus includes: a file connecting-sequence determining means for determining the connecting sequence of multi-media data files, in accordance with a reproduction connecting-sequence information and a reproduction branching information; a preload-file producing means for producing a preload-file being used as heading on reproduction using a part of or a total of the constitutional data of the data file, for each of a plurality of multi-media data files; and a file connecting means for connecting the plurality of the multi-media data files and the preload-file produced by the preload-file producing means.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够执行动态图像的组合再现的动态图像流的制造方法，并且同时在进行组合再现时实现分支再现。解决方案：多媒体数据记录装置的数据流形成装置包括：文件连接顺序确定装置，用于根据再现连接序列信息和一个多媒体数据记录装置确定多媒体数据文件的连接顺序再现分支信息; 预加载文件产生装置，用于针对多个多媒体数据文件中的每一个，使用数据文件的一部分或全部的构成数据来生成用于再现的标题的预加载文件; 以及文件连接装置，用于连接多个多媒体数据文件和由预加载文件产生装置产生的预加载文件。版权所有（C）2010，JPO＆INPIT

56. 发明专利

JP2005019765A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2005019765A
公开(公告)日：2005-01-20
申请号：JP2003183716
申请日：2003-06-27
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： IIDA TAKASHI , NAGATA TATSUYA , MIYAMOTO SEIJI , MATSUNAGA TOSHIHIRO
IPC分类号： H01L23/12 , H01L23/498 , H01L23/50
CPC分类号： H01L23/50 , H01L23/49827 , H01L23/49838 , H01L2224/16 , H01L2924/01078 , H01L2924/15173 , H01L2924/15311 , H01L2924/3011
摘要： PROBLEM TO BE SOLVED: To provide a compact semiconductor device, in which noises are reduced even by an operation at a high speed in the high speed BGA semiconductor device having multiple pins. SOLUTION: Semiconductor elements electrically connected to a base, on which surface layers are formed, are loaded on both surfaces of a core layer 7 composed of a wiring board. A through-hole array in the signal region of a core layer is constituted of an optimum through-hole pattern, in which signal through-holes 4s, power supply through-holes 4v and ground through-holes 4g are adjoined. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：提供一种即使在具有多个引脚的高速BGA半导体器件中通过高速操作也能降低噪声的紧凑型半导体器件。解决方案：电连接到其上形成有表面层的基底的半导体元件被装载在由布线板构成的芯层7的两个表面上。核心层的信号区域中的通孔阵列由信号通孔4s，电源通孔4v和接地通孔4g相邻的最佳通孔图案构成。版权所有（C）2005，JPO＆NCIPI

57. 发明专利

JPH11354569A METHOD AND DEVICE FOR BONDING WIRE AND MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH11354569A
公开(公告)日：1999-12-24
申请号：JP15692598
申请日：1998-06-05
申请人： HITACHI LTD
发明人： MATSUNAGA TOSHIHIRO , TSUTSUMI YASUKI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To improve the connection intensity of bonding in ball bonding. SOLUTION: A capillary 3 where a wire guide hole 3c is formed inside and recessed parts 3b being thin annular grooves are formed at tip faces 3a pressurizing the wire connection part of a wire at the time of bonding and a bonding processing part bonding the wire by the capillary 3 are provided. At the time of pressurizing the wire connection part by the capillary 3 and bonding the wire, wire side projection parts are formed in the wire connection part by the thin annular recessed parts 3b in the tip face 3a of the capillary 3, and the wire connection part is pressurized.

58. 发明专利

JPH1084012A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH1084012A
公开(公告)日：1998-03-31
申请号：JP23698296
申请日：1996-09-06
申请人： HITACHI LTD
发明人： HIDA AKIHIRO , TSUTSUMI YASUKI , MATSUNAGA TOSHIHIRO , SHIRAISHI TOMOHIRO , KUBOSONO MINORU , KURODA HIROSHI , SHIRAI MASAYUKI
IPC分类号： H01L21/60 , H01L25/065 , H01L25/07 , H01L25/18 , H01L27/10
摘要： PROBLEM TO BE SOLVED: To sharply reduce a semiconductor chip size and a package size. SOLUTION: Pads 2a are formed on the side faces in all directions of a semiconductor chip 2, leads 3 are electrically connected to the pads 2a directly by soldering, the chip 2 and a part of the leads 3 are rectangularly sealed by a mold resin package 4, and a semiconductor device 1 is formed. The pads 2a are formed in the thickness larger than the wiring formed on the ordinary wiring region by stacking layers of wirings on the scribe area with which a semiconductor wafer is divided into individual semiconductor chips 2 on the prescribed wiring layer, and the pads 2a are exposed to the side face of the semiconductor chip 2 by dicing in such a manner that the pads 2, provided on the scribe area, are divided into two parts when the semiconductor wafer is diced.

59. 发明专利

JPH09326421A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH09326421A
公开(公告)日：1997-12-16
申请号：JP16230596
申请日：1996-06-03
申请人： HITACHI LTD
发明人： TSUTSUMI YASUKI , MATSUNAGA TOSHIHIRO , HIDA AKIHIRO , SHIRAISHI TOMOHIRO , KUBOSONO MINORU , KURODA HIROSHI , SHIRAI MASAYUKI
IPC分类号： H01L21/60 , H01L23/12 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To prevent floating of solder balls upon solder-bump formation. SOLUTION: A solder-ball holding tool 30 is prepared. When solder bumps 16 are formed at respective external terminals 15 of a BGA IC (Ball Grid Array Type Semiconductor Integrated Circuit) 25, respective solder balls 33 of the solder-ball holding tool 30 are aligned with the external terminals 15 and reflow soldering is performed. Since the respective solder balls 33 are held by the solder-ball holding tool 30, floating of the solder balls 33 with respect to the external terminals 15 can be prevented in reflow soldering. Accordingly, as solder bumps are appropriately formed in reflow soldering, when packaging the BGA IC 25 to a packaging substrate, connection terminals are appropriately formed with the solder bumps. This prevents conduction failure and short- circuiting. Since the layout and/or size of a holding member of the solder-ball holding tool 30, and the size of the solder ball, can be changed in accordance with the change of specification of the BGA IC, this method can be applied to various products and newly-developed products.

60. 发明专利

JPH09148496A SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR 失效
公开(公告)号：JPH09148496A
公开(公告)日：1997-06-06
申请号：JP30699195
申请日：1995-11-27
申请人： HITACHI LTD
发明人： MATSUNAGA TOSHIHIRO , TSUTSUMI YASUKI
IPC分类号： H01L23/34
摘要： PROBLEM TO BE SOLVED: To attempt making a low thermal resistance without cost up when an LSI of cavity down system is assembled. SOLUTION: A through hole 3 is made at the central part of a cavity 1 of a base substrate 2, the rear surface 4B of a semiconductor chip 1 is exposed by the through hole 3 and resin 9 which seals the semiconductor chip 4 is filled into the cavity 1. After wire bonding and resin filling under the condition of the semiconductor 4 being temporally fixed by such an inexpensive material as a heat-proof tape, such construction is obtained by the heat-proof tape being eliminated. Therefore the semiconductor 4 of which rear surface 4B is exposed can be manufactured by a simple method.

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