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51. 发明专利

JP2006287685A Radio wave propagation estimation program, radio wave propagation estimation method and device for implementing the method 有权
标题翻译：无线电波传播估计方案，无线电波传播估计方法和实现方法的装置
公开(公告)号：JP2006287685A
公开(公告)日：2006-10-19
申请号：JP2005105997
申请日：2005-04-01
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SATO YOSHITO , OKURA TAKANORI
IPC分类号： H04B7/26 , G01R29/08
摘要： PROBLEM TO BE SOLVED: To accurately calculate radio wave propagation path, from a transmission point to a receiving point with a comparatively small computation quantity.
SOLUTION: A receiving area with prescribed width, including the receiving point, is determined (S8), the radio wave propagation path of the reception point from the transmission point is calculated by a ray launching method, substance surfaces existing in the path are extracted (S9), and by using only the extracted substance surfaces the radio wave propagation path, from the transmission point to the reception point by an imaging method (S10) is calculated.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：从计算量相对较小的发送点到接收点准确地计算无线电波传播路径。解决方案：确定包括接收点在内的具有规定宽度的接收区域（S8），通过射线发射方法计算接收点从传输点的无线电波传播路径，路径中存在的物质表面（S9），并且通过仅使用所提取的物质表面，计算通过成像方法从发送点到接收点的无线电波传播路径（S10）。版权所有（C）2007，JPO＆INPIT

52. 发明专利

JPH0944555A SCAFFOLDING PLANNING SYSTEM 失效
公开(公告)号：JPH0944555A
公开(公告)日：1997-02-14
申请号：JP19752295
申请日：1995-08-02
申请人： HITACHI LTD
发明人： USAMI YOSHIAKI , SATO YOSHITO
IPC分类号： E04G3/00 , G06F17/50 , E04G3/14
摘要： PROBLEM TO BE SOLVED: To speedily arrange optimum scaffolding at necessary places without instructing the arrangement places, one by one, by an operator by forming an arrangement plan for the scaffolding on a projection screen. SOLUTION: Of a necessary space detecting process part B, a CAD data input part reads three-dimensional CAD data on a plant out of an external storage device and a scaffolding specification input part inputs specifications regarding the size, height, etc., of the scaffolding. Then a body image extraction part projects and converts the CAD data and extracts an object image of necessary scaffolding bodies and a cell division part divides the projection image into a set of cells. Next, in an arrangement determining process part C, a potential setting part sets potential values for corresponding cells for every necessary scaffolding body and a potential addition part adds the potential values of all the necessary scaffolding bodies. Then an arrangement position calculation part finds the arrangement position of the scaffolding so that each scaffolding part has a maximum potential value, an arrangement direction calculation part finds a scaffolding direction for each scaffolding part so that a maximum score is obtained, and an arrangement result output part outputs the arrangement result of the scaffolding.

53. 发明专利

JPH0721408A ILLUMINANCE CALCULATING METHOD FOR COMPUTER GRAPHICS AND DISPLAY DEVICE 失效
公开(公告)号：JPH0721408A
公开(公告)日：1995-01-24
申请号：JP15168093
申请日：1993-06-23
申请人： HITACHI LTD
发明人： SATO YOSHITO , USAMI YOSHIAKI , TAKEUCHI RYOZO
IPC分类号： G06T15/80 , G06T15/50
摘要： PURPOSE:To reduce the projection frequency of an object projected by Z buffer processing and to quickly calculate the illumination of skylight by finding out the illumination of skylight in each cube formed by a voxcel dividing means. CONSTITUTION:A control part 100 sends object data from a data part 4 to a voxcel dividing processing part 5, which executes voxcel division of object space and sends its voxcel division result to a voxcel face illumination calculating processing part 6. The control part 100 sends data in each voxcel face from the processing part 6 to a Z buffer processing part 1. The processing part 1 calculates projection to a voxcel face and transfers its calculated result to the processing part 6. After completing said processing, the same processing is repeated only by necessary frequency based upon command processing data. A voxcel face illumination synthesizing part 7 executes voxcel face illumination synthetic processing based upon previously found voxcel face illumination and sends its processing result to a shading processing part 2 as data C and a formed picture is displayed on a display device 3.

54. 发明专利

JPH06349999A SOLDER DIPPING DEVICE FOR ELECTRONIC COMPONENT 失效
公开(公告)号：JPH06349999A
公开(公告)日：1994-12-22
申请号：JP14034093
申请日：1993-06-11
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： SATO YOSHITO
IPC分类号： H01L23/50 , H01R43/02
摘要： PURPOSE:To prevent excess solder from adhering to the leads of an electronic component at solder dipping by using an arm having a bypass part extended down via the component held at the arm. CONSTITUTION:A solder dipping device sucks and holds a semiconductor device 6 discharged from a loader at a product sucking part 5 of an arm. Then, the arm 3 is dipped in a melted solder tank, and solder layers are formed at outer leads 7 of the device 6. Thereafter, the arm is lifted from the tank. In this case, even if the arm 3 holding the device 6 is inclined, a bypass part 4 is brought into contact with a liquid surface to lift the surface. The device 6 is lifted from the melted solder surface 8, the part 4 becomes lowermost to be in contact with the liquid surface, and excess solder of the lead 7 is eliminated. Accordingly, the excess solder is reduced, and a malfunction, etc., at the time of mounting is largely eliminated.

55. 发明专利

JPH05326813A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH05326813A
公开(公告)日：1993-12-10
申请号：JP12712592
申请日：1992-05-20
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： SATO YOSHITO
IPC分类号： H01L23/28 , H01L23/50
摘要： PURPOSE:To prevent separation between a tab and resin, and to prevent generation of package cracks on the backside of the tab by conducting a bending work on the circumference of the tab. CONSTITUTION:A tab 1 is formed on a lead frame 3 by a part 1b having the circumference bent at right angle to the opposite side of pellet-installing direction and a part 1c having the tip part bent at right angle to the inside which is the direction in parallel with the tab. A semiconductor pellet 4 is attached to the tab 1, and a lead 6 and a pellet 4 are connected by a wire 5. The tab 4 and a part of the lead 6 are sealed by sealing resin 7. Accordingly, as the close contactness between the backside of the tab and the sealing resin can be improved, the exfoliation in the vicinity of the tab can be eliminated, and the generation of package cracks can also be prevented.

56. 发明专利

JPH05226551A LEAD FRAME FOR SEMICONDUCTOR DEVICE AND MANUFACTURE OF SEMICONDUCTOR DEVICE BY USING THE LEAD FRAME 失效
公开(公告)号：JPH05226551A
公开(公告)日：1993-09-03
申请号：JP2502692
申请日：1992-02-12
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： SATO YOSHITO
IPC分类号： H01L23/50
摘要： PURPOSE:To eliminate a cutting step for dam by forming a plurality of leads in a manner that their ends will be located near a tab and be extended to the periphery and a dam to connect the leads, and forming the dam by soldering. CONSTITUTION:A plurality of leads 1 are connected on a connection section 1b, and the opposite side of the section 1b is concentrated to the side center to form an inner lead section. In addition, a lead part having cutouts in a part of respective lead is preapred. Then the cutouts of the lead part are applied with soldering to form a dam 2. For such a step, the lead part is fitted into a die, etc., in advance which is molded into the shape of a dam, and the solder is flowed therein. A frame part, which has a tab 5 at the center thereof and tab leads 4 to connect the tab 5 with frames 3, is provided. The frames 3 are provided with cutouts 3a for connecting the dam 2 made of solder. Further the lead part with the dam is connected with the frame part. The two parts are heated at a high temperature to melt the solder for connection.

57. 发明专利

JPS613755B2 JPS613755B2 - 失效
公开(公告)号：JPS613755B2
公开(公告)日：1986-02-04
申请号：JP2735982
申请日：1982-02-24
申请人： Hitachi Ltd
发明人： KITAMURA TETSUO , SATO YOSHITO , TAKAHASHI TATSUHIKO , KIKUCHI SHIGEAKI
IPC分类号： B66B9/06

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